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OPA364IDG4

Texas Instruments

OPA364IDG4 by Texas Instruments

OPA364IDG4 by Texas Instruments is an operational amplifier with a max input offset voltage of 500uV, low bias current of 0.00001uA, and nominal voltage of 3.6V. Ideal for automotive applications due to its low-offset and micropower features, it offers high performance in a compact package with a small outline design.

Median Price

$3.600

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 165 parts In-Stock

1+ parts

$3.600

100+ parts

$2.200

1k+ parts

$2.030

10k+ parts

$1.870

165

$3.600

$2.200

$2.030

$1.870

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,219 parts In-Stock

1+ parts

$2.679

100+ parts

-

1k+ parts

-

10k+ parts

-

4,219

$2.679

-

-

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Vyrian

USA . 6,711 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

-

6,711

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,393 parts In-Stock

1+ parts

$1.663

100+ parts

-

1k+ parts

$2.271

10k+ parts

-

1,393

$1.663

-

$2.271

-

DigiPath Technology Company

USA . 679 parts In-Stock

1+ parts

$1.831

100+ parts

$1.684

1k+ parts

-

10k+ parts

-

679

$1.831

$1.684

-

-

ChromeModa Solutions

Germany . 2,526 parts In-Stock

1+ parts

$1.868

100+ parts

$1.532

1k+ parts

-

10k+ parts

-

2,526

$1.868

$1.532

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-

IDEA Electronic Components Group

UK . 1,599 parts In-Stock

1+ parts

$1.868

100+ parts

-

1k+ parts

$1.681

10k+ parts

-

1,599

$1.868

-

$1.681

-

Corphita

USA . 3,090 parts In-Stock

1+ parts

$2.538

100+ parts

-

1k+ parts

-

10k+ parts

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3,090

$2.538

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Component Stockers USA

USA . 143 parts In-Stock

1+ parts

$2.730

100+ parts

$2.000

1k+ parts

-

10k+ parts

-

143

$2.730

$2.000

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A-Z Elektronik GmbH

Germany . 7,314 parts In-Stock

1+ parts

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7,314

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Microchip USA

USA . 2,271 parts In-Stock

1+ parts

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2,271

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Perfect Parts

USA . 896 parts In-Stock

1+ parts

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1k+ parts

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896

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Kepictronics

USA . 349 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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349

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Overview

Discover the OPA364IDG4 by Texas Instruments, a top-quality operational amplifier that offers unparalleled performance and reliability. With Texas Instruments' stellar reputation for innovation and precision engineering, this op amp is sure to exceed your expectations in a variety of applications. From automotive systems to medical devices, this amplifier delivers low bias, low offset, and micropower operation, ensuring optimal performance in any project. Trust in Texas Instruments to provide you with the best-in-class components, and experience the difference with the OPA364IDG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, increasing reliability and durability.

Maximum Input Offset Voltage: 500 uV

Ensures high precision in signal processing by minimizing the voltage difference at the input terminals.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and simplifying the assembly process.

Nominal Common Mode Reject Ratio: 90 dB

Effectively attenuates common mode signals, improving the accuracy of the amplifier output.

Nominal Supply Voltage / Vsup (V): 3.6

Optimized supply voltage for efficient performance and low power consumption.

Technology: CMOS

Utilizes CMOS technology for low power consumption and improved noise immunity.

Amplifier Type: OPERATIONAL AMPLIFIER

Specifically designed for amplifying signals accurately with high stability and precision.

Technical Specifications

Operational Amplifiers (Op Amps) OPA364IDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

2/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

Yes

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

7 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

90 dB

Minimum Common Mode Rejection Ratio (CMRR ):

74 dB

Input Offset Voltage Limit:

500 uV

Minimum Voltage Gain:

19950

Nominal Slew Rate:

5 V/us

Maximum Input Offset Current (IIO):

10 pA

Peak Bias Current:

10 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Nominal Supply Voltage:

3.6 V

Maximum Supply Voltage:

5.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

750 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

OPA364IDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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