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NE592ADR

Texas Instruments

NE592ADR by Texas Instruments

NE592ADR by Texas Instruments is a video amplifier IC with 14 terminals, gain of 52.9 dB, and bandwidth of 90 kHz. It operates b/w 0-70°C, requires min supply voltage of 3V, and supports max supply voltage up to 8V. Ideal for audio/video applications requiring high-quality signal amplification in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,254 parts In-Stock

1+ parts

-

100+ parts

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3,254

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Digiode

USA . 2,755 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,755

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 675 parts In-Stock

1+ parts

$2.480

100+ parts

-

1k+ parts

$2.971

10k+ parts

-

675

$2.480

-

$2.971

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DigiPath Technology Company

USA . 51 parts In-Stock

1+ parts

$2.730

100+ parts

$2.512

1k+ parts

-

10k+ parts

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51

$2.730

$2.512

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ChromeModa Solutions

Germany . 913 parts In-Stock

1+ parts

$2.786

100+ parts

$2.285

1k+ parts

-

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913

$2.786

$2.285

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IDEA Electronic Components Group

UK . 9 parts In-Stock

1+ parts

$2.786

100+ parts

-

1k+ parts

$2.507

10k+ parts

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9

$2.786

-

$2.507

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One Stop Electronics

USA . 749 parts In-Stock

1+ parts

$7.800

100+ parts

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10k+ parts

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749

$7.800

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AZTECH Wire

Italy . 404 parts In-Stock

1+ parts

$9.542

100+ parts

-

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404

$9.542

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Corphita

USA . 3,449 parts In-Stock

1+ parts

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3,449

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Overview

Experience superior audio and video amplification with the NE592ADR by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliability and performance in every package. Perfect for a wide range of applications, this video amplifier provides crystal-clear sound and sharp image quality. Elevate your audio and video experience with the NE592ADR, offering unmatched value and benefits to customers seeking top-notch amplification solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the amplifier, ensuring a long lifespan.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation of the amplifier onto PCBs, saving space and simplifying the overall design.

Package Shape: RECTANGULAR

The rectangular package shape enables efficient placement and alignment on circuit boards, contributing to a neat and organized layout.

General IC Type: VIDEO AMPLIFIER

Designed specifically as a video amplifier, this product is optimized to enhance the quality and clarity of video signals, making it a suitable choice for video applications.

No. of Terminals: 14

With 14 terminals, this amplifier offers a sufficient number of connections for various input and output configurations, increasing flexibility in system integration.

Package Style: SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact designs or applications with limited board space.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even under extended periods of use in elevated temperature environments.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this amplifier can function effectively in a wide range of temperature conditions, providing versatility for various applications.

Terminal Position: DUAL

The dual terminal position allows for easy and secure connection of external components, facilitating installation and ensuring stable electrical connections.

Minimum Supply Voltage (Vsup): 3 V

Operating at a minimum supply voltage of 3V, this amplifier is suitable for low-power applications while providing efficient signal amplification.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this amplifier meets industry standards for performance and reliability in commercial use cases.

Nominal Bandwidth: 90 kHz

With a nominal bandwidth of 90 kHz, this amplifier can effectively process and amplify video signals within the specified frequency range, ensuring optimal performance.

Terminal Form: GULL WING

The gull wing terminal form provides a robust and reliable connection to the PCB, enhancing the durability and stability of the amplifier in various operating conditions.

Maximum Supply Current: 27 mA

Drawing a maximum supply current of 27 mA, this amplifier offers efficient power consumption while delivering the required level of amplification for video signals.

Gain: 52.9 dB

With a gain of 52.9 dB, this amplifier can effectively boost the strength of video signals, improving overall signal quality and clarity in video applications.

Maximum Supply Voltage (Vsup): 8 V

Operating within a maximum supply voltage of 8V, this amplifier can handle higher voltage inputs while maintaining stable and efficient signal amplification.

Technical Specifications

Audio & Video Amplifiers NE592ADR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

90 kHz

General IC Type:

Gain:

52.9 dB

JESD-30 Code:

R-PDSO-G14

No. of Channels:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Supply Current:

27 mA

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

NE592ADR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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