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MSP432P401RIPZ

Texas Instruments

MSP432P401RIPZ by Texas Instruments

MSP432P401RIPZ by Texas Instruments is a 32-bit microcontroller with a max clock frequency of 48 MHz. It features 8 DMA channels and 26-ch 16-bit ADCs, making it suitable for applications requiring high-speed data transfer and precise analog-to-digital conversion. Its low power mode also makes it ideal for battery-powered devices.

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Vyrian

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Nova Conductors

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Parana Technologies

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Overview

Discover the power and versatility of the MSP432P401RIPZ microcontroller by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments ensures high-quality products that deliver exceptional performance. With its advanced features and wide range of applications, the MSP432P401RIPZ offers unparalleled value to customers. From embedded systems to IoT devices, this microcontroller provides the reliability and efficiency you need. Experience the benefits of its low power mode, numerous I/O lines, and extensive connectivity options, including I2C, SPI, UART, and more. Whether you're a seasoned developer or just starting out, the MSP432P401RIPZ is the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY. This material provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount

YES. This feature allows for easy integration onto circuit boards, reducing assembly time and effort.

Maximum Supply Voltage

3.7 V. The high maximum supply voltage ensures compatibility with a wide range of power sources, making it flexible for different power requirements.

On Chip Data RAM Width

8. The wide data RAM width allows for efficient data processing and storage, enhancing overall performance and speed.

Package Shape

SQUARE. This shape facilitates space-saving and efficient circuit board layout, making it ideal for applications with limited space.

Bit Size

32. The 32-bit architecture provides enhanced processing capabilities, enabling complex tasks and computations to be performed effectively.

No. of Terminals

100. The large number of terminals enables connectivity to a wide range of external devices, increasing versatility and potential applications.

Package Style (Meter)

FLATPACK, LOW PROFILE, FINE PITCH. This package style offers compact size, low profile, and fine pitch, enabling higher density board designs and efficient use of space.

Minimum Supply Voltage

1.62 V. The low minimum supply voltage ensures compatibility with low power sources, making it suitable for battery-operated devices and energy-efficient applications.

Maximum Operating Temperature

85 °C. The high maximum operating temperature allows for reliable operation in harsh environments, expanding potential applications.

CPU Family

CORTEX-M4F. This powerful CPU family offers advanced features and performance, making it suitable for demanding applications and complex algorithms.

Minimum Operating Temperature

40 °C. The low minimum operating temperature ensures reliable operation in extreme cold conditions, enabling usage in various environments.

Terminal Finish

NICKEL PALLADIUM GOLD. This terminal finish provides excellent conductivity, corrosion resistance, and durability, ensuring reliable connections and longevity.

ADC Channels

YES. The presence of analog-to-digital converter (ADC) channels allows for accurate measurement and conversion of analog signals, expanding potential applications.

DMA Channels

YES. The availability of direct memory access (DMA) channels enhances data transfer efficiency, reducing CPU overhead and improving overall system performance.

Terminal Position

QUAD. The quad terminal position simplifies board layout and connection, enabling efficient integration into circuit designs.

ROM Words

262144. The large amount of read-only memory (ROM) words allows for storage of extensive program code, facilitating complex applications and algorithms.

Maximum Seated Height

1.6 mm. The low seated height allows for compact designs and efficient use of vertical space, making it suitable for slim-profile applications.

RAM Words

64. The sizable RAM words provide ample space for temporary data storage, enhancing multitasking capabilities and overall system performance.

Width

14 mm. The compact width makes the microcontroller suitable for space-constrained applications and allows for efficient utilization of available board space.

Boundary Scan

YES. The boundary scan feature facilitates debugging and testing of integrated circuits, streamlining the development and deployment process.

Peripherals

COMPARATOR(2), DMA(8), RTC, TIMER(6), WDT. The presence of multiple peripherals such as comparators, DMA, RTC, timers, and watchdog timers enhances the microcontroller's capabilities, enabling a wide range of applications.

Maximum Clock Frequency

48 MHz. The high maximum clock frequency allows for fast and efficient data processing, making it suitable for time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s)

30. This specification indicates the maximum duration the microcontroller can withstand during the reflow soldering process, ensuring reliable manufacturing and assembly.

Peak Reflow Temperature °C

260. The high peak reflow temperature enables the microcontroller to endure high-temperature soldering processes, ensuring robust assembly and reliability.

Length

14 mm. The compact length makes the microcontroller suitable for space-constrained applications and allows for efficient utilization of available board space.

Temperature Grade

INDUSTRIAL. The industrial temperature grade ensures reliable operation in demanding environments, making it suitable for industrial applications with varying temperature conditions.

Peripheral IC Type

MICROCONTROLLER, RISC. This microcontroller type offers a reduced instruction set computing (RISC) architecture, providing faster execution and efficiency in instruction processing.

No. of Timers

6. The presence of multiple timers allows for precise timing and synchronization of events, enhancing the microcontroller's capabilities for applications requiring accurate timing.

RAM Bytes

65536. The large amount of random-access memory (RAM) bytes provides sufficient space for data storage and manipulation, enabling efficient execution of complex algorithms.

Technology

CMOS. The complementary metal-oxide-semiconductor (CMOS) technology offers low power consumption, ensuring energy efficiency and extended battery life.

Terminal Form

GULL WING. The gull wing terminal form provides a reliable and cost-effective method for surface mounting, facilitating the assembly process and ensuring secure connections.

Analog To Digital Convertors

26-Ch 16-Bit. The multiple analog-to-digital converters (ADCs) with 16-bit resolution enable high-precision conversion of analog signals, making it suitable for applications requiring accurate measurements.

Nominal Supply Voltage

3 V. The nominal supply voltage ensures compatibility with standard power sources, offering ease of integration and reliable operation.

No. of DMA Channels

8. The availability of multiple direct memory access (DMA) channels enhances data transfer efficiency, reducing CPU workload and improving overall system performance.

No. of Serial I/Os

4. The presence of multiple serial input/output (I/O) ports allows for communication with external devices, expanding connectivity options and potential applications.

PWM Channels

YES. The presence of pulse-width modulation (PWM) channels enables precise control of analog outputs, making it suitable for applications involving motor control and LED dimming.

Connectivity

I2C(4), IRDA(4), SPI(8), UART(4). The presence of multiple connectivity options such as I2C, IRDA, SPI, and UART enables seamless integration into various communication protocols and networks.

ROM Programmability

FLASH. The ability to program the read-only memory (ROM) using flash technology provides flexibility and ease of firmware updates, allowing for future enhancements and bug fixes.

Terminal Pitch

0.5 mm. The small terminal pitch allows for enhanced package density, enabling compact designs and efficient use of available board space.

Format

FLOATING POINT. The support for floating-point format allows for high-precision mathematical calculations, making it suitable for applications requiring complex computations.

Moisture Sensitivity Level (MSL)

3. The moisture sensitivity level indicates the level of protection required during storage and handling, ensuring proper functioning in humid environments.

Speed

48 rpm. The high speed capability enables fast and efficient data processing, making it suitable for time-sensitive applications requiring quick response times.

Low Power Mode

YES. The availability of low-power mode enhances energy efficiency, allowing for longer battery life and reducing overall power consumption.

On Chip Program ROM Width

8. The wide on-chip program ROM width ensures efficient storage and execution of program code, enhancing overall system performance.

No. of I/O Lines

84. The abundance of input/output (I/O) lines allows for flexible connectivity options and integration with external devices, expanding potential applications.

Technical Specifications

Microcontrollers MSP432P401RIPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

8

No. of External Interrupts:

0

No. of I/O Lines:

84

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

65536

RAM Words:

64

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.7 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(4), IRDA(4), SPI(8), UART(4)

Peripherals:

COMPARATOR(2), DMA(8), RTC, TIMER(6), WDT

Analog To Digital Convertors:

26-Ch 16-Bit

Trade Compliance

MSP432P401RIPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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