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MSP432P4011TRGCR

Texas Instruments

MSP432P4011TRGCR by Texas Instruments

MSP432P4011TRGCR by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, offering 256 RAM words and 2097152 ROM words. It features 14-Ch 16-Bit ADC channels, 8 DMA channels, and peripherals like RTC and WDT. Ideal for industrial applications requiring low power consumption and high-speed processing up to 24 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,126 parts In-Stock

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4,126

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Vyrian

USA . 2,810 parts In-Stock

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2,810

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Distributors (Availability)

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One Stop Electronics

USA . 368 parts In-Stock

1+ parts

$6.000

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368

$6.000

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AZTECH Wire

Italy . 243 parts In-Stock

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$11.868

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243

$11.868

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Parana Technologies

USA . 54 parts In-Stock

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$65.195

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54

$65.195

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ChromeModa Solutions

Germany . 4,961 parts In-Stock

1+ parts

$73.253

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$60.067

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4,961

$73.253

$60.067

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IDEA Electronic Components Group

UK . 328 parts In-Stock

1+ parts

$73.253

100+ parts

$69.590

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$65.928

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328

$73.253

$69.590

$65.928

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Corphita

USA . 2,258 parts In-Stock

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2,258

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DigiPath Technology Company

USA . 793 parts In-Stock

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$66.045

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$66.045

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Microchip USA

USA . 129 parts In-Stock

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Overview

Unlock the power of innovation with the Texas Instruments MSP432P4011TRGCR microcontroller. Crafted with precision and expertise, this cutting-edge device offers unparalleled performance and reliability in a compact package. Ideal for a wide range of applications, this microcontroller boasts integrated cache, ADC channels, DMA channels, and more to streamline your projects. With a maximum clock frequency of 24 MHz and low power mode capabilities, the MSP432P4011TRGCR delivers optimal efficiency without compromising on speed. Trust Texas Instruments to deliver high-quality products that exceed expectations and propel your designs to new heights. Experience the difference with the MSP432P4011TRGCR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the microcontroller, making it suitable for various environments and applications.

Integrated Cache: YES

Having an integrated cache helps in improving data access speeds, enhancing the overall performance of the microcontroller.

Maximum Supply Voltage: 3.7 V

With a higher supply voltage, this microcontroller can handle more power, making it suitable for applications that require higher voltage levels.

CPU Family: CORTEX-M4F

Being part of the CORTEX-M4F family means this microcontroller offers high-performance computing capabilities and efficient power usage, making it ideal for a wide range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller allows for efficient processing and reduced power consumption, making it a suitable choice for embedded systems and IoT devices.

Maximum Clock Frequency: 24 MHz

The high clock frequency allows for fast data processing and response times, making this microcontroller suitable for tasks that require quick computations.

ADC Channels: YES

Having Analog to Digital Converters (ADC) channels allows the microcontroller to convert analog signals into digital data, enabling it to interact with the analog world in various applications.

Connectivity: I2C(3), IRDA(3), SPI(6), UART(3)

With multiple connectivity options such as I2C, IRDA, SPI, and UART, this microcontroller can easily communicate with other devices, making it versatile and compatible for a range of applications.

Technical Specifications

Microcontrollers MSP432P4011TRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

8

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

.88 mm

Speed:

24 rpm

Maximum Supply Voltage:

3.7 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), SPI(6), UART(3)

Peripherals:

COMPARATOR(6), DMA(8), POR, RTC, TIMER(7), WDT

Analog To Digital Convertors:

14-Ch 16-Bit

Trade Compliance

MSP432P4011TRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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