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MSP430G2533IRHB32R

Texas Instruments

MSP430G2533IRHB32R by Texas Instruments

MSP430G2533IRHB32R by Texas Instruments is a 16-bit microcontroller with 8KB ROM and 512B RAM. It operates at a max frequency of 0.032 MHz, suitable for industrial applications requiring low power consumption. Featuring 8 ADC channels and 2 PWM channels, it offers connectivity options like I2C, SPI, and UART for versatile peripheral interfacing.

Median Price

$2.288

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,624 parts In-Stock

1+ parts

$3.390

100+ parts

$2.107

1k+ parts

$1.875

10k+ parts

$1.807

1,624

$3.390

$2.107

$1.875

$1.807

Avnet

USA . 99,000 parts In-Stock

1+ parts

-

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$1.187

99,000

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$1.187

Distributors (In-Stock)

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EXC GmbH

Germany . 6,000 parts In-Stock

1+ parts

$1.406

100+ parts

-

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6,000

$1.406

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Digiode

USA . 433 parts In-Stock

1+ parts

$2.622

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433

$2.622

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NAC Semi

USA . 479 parts In-Stock

1+ parts

$12.650

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479

$12.650

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Chip Stock

USA . 28,310 parts In-Stock

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Vyrian

USA . 5,122 parts In-Stock

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Sunrise Surplus Inc.

USA . 606 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,859 parts In-Stock

1+ parts

$2.484

100+ parts

-

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1,859

$2.484

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Microchip USA

USA . 1,925 parts In-Stock

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$9.220

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$9.220

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Parana Technologies

USA . 1,467 parts In-Stock

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$36.438

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1,467

$36.438

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ChromeModa Solutions

Germany . 4,796 parts In-Stock

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$40.942

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$33.572

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4,796

$40.942

$33.572

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IDEA Electronic Components Group

UK . 1,678 parts In-Stock

1+ parts

$40.942

100+ parts

$38.895

1k+ parts

$36.848

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1,678

$40.942

$38.895

$36.848

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Lixinc

USA . 18,700 parts In-Stock

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18,700

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S.R.D Solutions

India . 9,000 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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A-Z Elektronik GmbH

Germany . 1,957 parts In-Stock

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1,957

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DigiPath Technology Company

USA . 1,812 parts In-Stock

1+ parts

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$36.913

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1,812

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$36.913

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Kepictronics

USA . 882 parts In-Stock

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882

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iodParts Technologies Inc.

India . 250 parts In-Stock

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250

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Overview

Unlock endless possibilities with the Texas Instruments MSP430G2533IRHB32R microcontroller! Designed for efficiency and reliability, this versatile chip offers a wide range of applications in various industries. With its cutting-edge technology and top-notch quality, Texas Instruments ensures that you get the best performance and value for your projects. Experience seamless connectivity, low power consumption, and advanced features that will take your designs to the next level. Choose the MSP430G2533IRHB32R and revolutionize the way you innovate.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost during production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, making it compatible with a wide range of systems.

On Chip Data RAM Width: 8

Having a wide data RAM width allows for faster data processing and storage capabilities, enhancing overall performance.

Package Shape: SQUARE

The square package shape provides efficient use of PCB space, especially in tight layouts or designs.

Bit Size: 16

A 16-bit microcontroller offers increased processing power and capabilities compared to lower bit sizes, making it suitable for complex applications.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages enables compatibility with different power sources and system requirements.

No. of Terminals: 32

Having a high number of terminals allows for more connections and I/O options, enabling versatile interfacing with other components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles offered provides flexibility in design and mounting options, catering to different form factor requirements.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage ensures efficient power usage and compatibility with low-power applications, extending battery life.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in industrial environments with elevated temperatures.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making it a popular choice for various embedded applications.

Minimum Operating Temperature: -40 °C

The wide temperature range in which the microcontroller can operate ensures reliability in both hot and cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections over time.

ADC Channels: YES

The presence of ADC channels allows for analog to digital conversion, enabling the microcontroller to interface with sensors and other analog devices.

DMA Channels: YES

DMA channels improve data transfer efficiency by allowing direct memory access, reducing CPU load and enhancing overall system performance.

Terminal Position: QUAD

The quad terminal position provides ease of soldering and reliability in connection, making it suitable for automated assembly processes.

ROM Words: 16384

Having a large ROM capacity allows for storing firmware and program data, catering to complex application requirements.

Maximum Seated Height: 1 mm

The low seated height allows for compact PCB designs, ideal for space-constrained applications or products.

RAM Words: 0.5

While small, the RAM capacity is sufficient for temporary data storage and processing, enhancing the microcontroller's performance.

Width: 5 mm

The compact width of the microcontroller enables space-efficient PCB layouts and designs, fitting into small enclosures or devices.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging during production, ensuring quality and reliability of the final product.

Peripherals: "BOD, DMA(1), TIMER(6), WDT

The presence of various peripherals such as Brown-Out Detection (BOD), DMA, timers, and Watchdog Timer (WDT) enhances the microcontroller's functionality for diverse applications.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency allows for fast data processing and real-time operation, suitable for time-critical applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures the microcontroller's reliability during the PCB assembly process, withstanding soldering heat.

Length: 5 mm

The compact length of the microcontroller contributes to space-efficient designs, especially in applications with size constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments with wide temperature fluctuations, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high performance, power efficiency, and quick operation, suitable for various embedded applications.

No. of Timers: 6

The availability of multiple timers allows for precise timing control and scheduling of tasks, enhancing the microcontroller's performance in time-sensitive applications.

RAM Bytes: 512

The sizeable RAM capacity provides ample memory for data storage and manipulation, contributing to efficient operation and responsiveness.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, making it an efficient choice for microcontrollers.

Terminal Form: NO LEAD

The no lead terminal form ensures environmentally friendly manufacturing and compliance with lead-free regulations.

Analog To Digital Convertors: 8-Ch 10-Bit

The presence of 8-channel 10-bit ADCs enables accurate conversion of analog signals to digital data, essential for interfacing with sensors and other analog devices.

Maximum Supply Current: 0.42 mA

The low maximum supply current results in reduced power consumption, making the microcontroller suitable for battery-powered applications and energy-efficient designs.

Nominal Supply Voltage: 2.2 V

The stable nominal supply voltage ensures reliable operation and compatibility with standard power sources, contributing to the microcontroller's overall performance.

No. of Serial I/Os: 2

Having multiple serial I/Os allows for interfacing with external devices and communication over serial protocols, enhancing connectivity and versatility.

PWM Channels: YES

The presence of PWM channels enables accurate and efficient control of analog signals, useful for applications such as motor control, lighting, and audio modulation.

Connectivity: "I2C, IRDA, SPI(2), UART, USCI(2)

The variety of connectivity options such as I2C, IRDA, SPI, UART, and USCI enhance the microcontroller's interfacing capabilities with different devices and communication protocols.

ROM Programmability: FLASH

Having a flash programmable ROM allows for easy reprogramming of firmware and data, facilitating updates and modifications to the microcontroller's functionality.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density mounting on PCBs, saving space and allowing for compact designs in miniaturized applications.

Format: FIXED POINT

Being a fixed-point microcontroller simplifies numerical calculations and reduces computational complexity, suitable for applications that do not require floating-point arithmetic.

Moisture Sensitivity Level (MSL): 2

The MSL level 2 indicates the microcontroller's resistance to moisture absorption during storage and handling, ensuring reliability in humid environments.

Speed: 16 rpm

The speed of 16 rpm denotes the performance capability of the microcontroller in executing instructions and processing data at a rapid pace, suitable for responsive applications.

Low Power Mode: YES

The low power mode feature allows for energy-efficient operation, prolonging battery life and reducing power consumption in standby or idle states.

Technical Specifications

Microcontrollers MSP430G2533IRHB32R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

1

No. of I/O Lines:

24

No. of Serial I/Os:

2

No. of Terminals:

32

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, DMA(1), TIMER(6), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2533IRHB32R Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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