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MSP430G2413IRHB32T

Texas Instruments

MSP430G2413IRHB32T by Texas Instruments

MSP430G2413IRHB32T by Texas Instruments is a 16-bit microcontroller with 8KB ROM and 512B RAM. Operating at up to 16MHz, it offers low power mode and peripherals like BOD, DMA, and timers. Ideal for industrial applications requiring high-speed processing in a compact form factor.

Median Price

$2.602

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,000 parts In-Stock

1+ parts

$2.065

100+ parts

$1.706

1k+ parts

$0.922

10k+ parts

-

2,000

$2.065

$1.706

$0.922

-

DigiKey

USA . 500 parts In-Stock

1+ parts

$3.140

100+ parts

$1.937

1k+ parts

-

10k+ parts

-

500

$3.140

$1.937

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,914 parts In-Stock

1+ parts

$1.962

100+ parts

-

1k+ parts

-

10k+ parts

-

1,914

$1.962

-

-

-

Vyrian

USA . 4,120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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4,120

-

-

-

-

Bristol Electronics

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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250

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,000 parts In-Stock

1+ parts

$1.760

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$1.760

-

-

-

Corphita

USA . 2,548 parts In-Stock

1+ parts

$1.858

100+ parts

-

1k+ parts

-

10k+ parts

-

2,548

$1.858

-

-

-

Microchip USA

USA . 1,546 parts In-Stock

1+ parts

$12.110

100+ parts

$12.030

1k+ parts

$11.990

10k+ parts

$11.960

1,546

$12.110

$12.030

$11.990

$11.960

Parana Technologies

USA . 54 parts In-Stock

1+ parts

$63.833

100+ parts

$5,927.906

1k+ parts

$57.450

10k+ parts

-

54

$63.833

$5,927.906

$57.450

-

DigiPath Technology Company

USA . 556 parts In-Stock

1+ parts

$70.289

100+ parts

-

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556

$70.289

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-

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ChromeModa Solutions

Germany . 3,325 parts In-Stock

1+ parts

$71.723

100+ parts

$58.813

1k+ parts

-

10k+ parts

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3,325

$71.723

$58.813

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IDEA Electronic Components Group

UK . 265 parts In-Stock

1+ parts

$71.723

100+ parts

$68.137

1k+ parts

$64.551

10k+ parts

-

265

$71.723

$68.137

$64.551

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QUARKTWIN TECHNOLOGY LTD

USA . 14,029 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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14,029

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Lixinc

USA . 2,084 parts In-Stock

1+ parts

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2,084

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Perfect Parts

USA . 118 parts In-Stock

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118

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Overview

Unlock endless possibilities with the MSP430G2413IRHB32T by Texas Instruments. Designed for efficiency and reliability, this microcontroller offers unparalleled performance in a compact package. From industrial automation to consumer electronics, this versatile device delivers seamless connectivity and low power consumption, making it the ideal choice for your next project. Trust Texas Instruments for cutting-edge technology that enables innovation and drives success. Elevate your designs with the MSP430G2413IRHB32T and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Makes the product lightweight and durable.

Surface Mount: YES

Convenient for easy mounting on circuit boards.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply options.

On Chip Data RAM Width: 8

Provides efficient data processing capability.

Package Shape: SQUARE

Facilitates easy integration into various circuit layouts.

Bit Size: 16

Suitable for handling moderate complexity applications.

Power Supplies (V): 2/3.3

Allows for flexibility in power input requirements.

No. of Terminals: 32

Offers ample connection options for peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Enables efficient heat dissipation and compact design.

Minimum Supply Voltage: 3.3 V

Ensures stable operation with a reliable power source.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without issues.

CPU Family: MSP430

Known for low power consumption and high performance.

Minimum Operating Temperature: -40 °C

Can function in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides corrosion resistance and excellent conductivity.

DMA Channels: YES

Facilitates efficient data transfer without CPU intervention.

Terminal Position: QUAD

Simplifies connection layout and wiring.

ROM Words: 8192

Offers ample storage for program instructions.

Maximum Seated Height: 1 mm

Allows for low-profile and compact device design.

RAM Words: 0.5

Efficiently handles temporary data storage.

Width: 5 mm

Compact size suitable for various applications.

Boundary Scan: YES

Facilitates testing and debugging during manufacturing.

Peripherals: "BOD, COMPARATOR(8), DMA(1), TIMER(2), WDT

Offers a wide range of integrated peripheral functions.

Maximum Clock Frequency: 16 MHz

Provides high-speed processing capability.

Peak Reflow Temperature °C: 260

Ensures reliable soldering during manufacturing.

Length: 5 mm

Compact form factor for space-constrained designs.

Temperature Grade: INDUSTRIAL

Suitable for industrial operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Efficient for handling real-time control tasks.

No. of Timers: 2

Enables precise timing and scheduling functions.

RAM Bytes: 512

Sufficient memory for data storage and processing.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: NO LEAD

Eco-friendly and compliant with lead-free regulations.

Maximum Supply Current: 0.42 mA

Low power consumption for energy-efficient operation.

PWM Channels: YES

Enables precise control of analog functions.

Connectivity: "I2C, IRDA, LIN, SPI, UART, USCI(2)

Supports a variety of communication protocols.

ROM Programmability: FLASH

Allows for easy reprogramming and updates of firmware.

Terminal Pitch: 0.5 mm

Fine pitch for compact and high-density PCB layouts.

Format: FIXED POINT

Simplified arithmetic operations for efficient processing.

Moisture Sensitivity Level (MSL): 2

Suitable for a range of environmental conditions.

Speed: 16 rpm

Offers high processing speed for real-time applications.

Technical Specifications

Microcontrollers MSP430G2413IRHB32T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 1.8V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

1

No. of I/O Lines:

24

No. of Serial I/Os:

1

No. of Terminals:

32

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI, UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), DMA(1), TIMER(2), WDT"

Trade Compliance

MSP430G2413IRHB32T Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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