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MSP430G2302IRSA16T

Texas Instruments

MSP430G2302IRSA16T by Texas Instruments

MSP430G2302IRSA16T by Texas Instruments is a 16-bit microcontroller with 4096 ROM words, 256 RAM bytes, and 4 DMA channels. Ideal for industrial applications, it operates b/w -40 to 85°C with low power mode support. Connectivity options include I2C, SPI, and USI interfaces for versatile usage.

Median Price

$1.381

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,000 parts In-Stock

1+ parts

$1.387

100+ parts

$1.145

1k+ parts

$0.619

10k+ parts

-

2,000

$1.387

$1.145

$0.619

-

Rochester

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$1.330

1k+ parts

$1.100

10k+ parts

$0.984

750

-

$1.330

$1.100

$0.984

DigiKey

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.660

10k+ parts

-

750

-

-

$1.660

-

Verical

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.375

10k+ parts

$1.230

750

-

-

$1.375

$1.230

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,132 parts In-Stock

1+ parts

$0.899

100+ parts

-

1k+ parts

-

10k+ parts

-

4,132

$0.899

-

-

-

Vyrian

USA . 6,294 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,294

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 495 parts In-Stock

1+ parts

$0.780

100+ parts

-

1k+ parts

-

10k+ parts

-

495

$0.780

-

-

-

Corphita

USA . 4,631 parts In-Stock

1+ parts

$0.851

100+ parts

-

1k+ parts

-

10k+ parts

-

4,631

$0.851

-

-

-

Microchip USA

USA . 1,146 parts In-Stock

1+ parts

$8.128

100+ parts

-

1k+ parts

-

10k+ parts

-

1,146

$8.128

-

-

-

Parana Technologies

USA . 1,737 parts In-Stock

1+ parts

$48.284

100+ parts

-

1k+ parts

-

10k+ parts

-

1,737

$48.284

-

-

-

DigiPath Technology Company

USA . 12 parts In-Stock

1+ parts

$53.167

100+ parts

$48.914

1k+ parts

-

10k+ parts

-

12

$53.167

$48.914

-

-

ChromeModa Solutions

Germany . 4,104 parts In-Stock

1+ parts

$54.252

100+ parts

$44.487

1k+ parts

-

10k+ parts

-

4,104

$54.252

$44.487

-

-

IDEA Electronic Components Group

UK . 450 parts In-Stock

1+ parts

$54.252

100+ parts

$51.539

1k+ parts

$48.827

10k+ parts

-

450

$54.252

$51.539

$48.827

-

Perfect Parts

USA . 552 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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552

-

-

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Kepictronics

USA . 500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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500

-

-

-

-

Overview

Unlock endless possibilities with the Texas Instruments MSP430G2302IRSA16T microcontroller. Designed to provide high quality and reliability, this chip offers a wide range of applications in various industries. With low power consumption and advanced features like DMA channels and PWM capabilities, this microcontroller ensures optimal performance for your projects. Trust in the expertise of Texas Instruments to deliver unmatched value and benefits to meet your design needs. Step into the future with the MSP430G2302IRSA16T and revolutionize your innovation today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and provides good protection for the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with various voltage sources.

CPU Family: MSP430

MSP430 family is known for its low power consumption and high performance, making it a reliable choice for applications requiring efficiency.

Peripherals: BOD, DMA(1), TIMER(4), WDT

Includes a range of peripherals for different functions, enhancing the versatility of the microcontroller.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller, enabling flexibility in application development.

Technical Specifications

Microcontrollers MSP430G2302IRSA16T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES 1.8 V MINIMUM SUPPLY AT 6 MHZ AND 2.7 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

1

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

16

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, DMA(1), TIMER(4), WDT"

Trade Compliance

MSP430G2302IRSA16T Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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