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MSP430G2213IPW20

Texas Instruments

MSP430G2213IPW20 by Texas Instruments

MSP430G2213IPW20 by Texas Instruments is a 16-bit microcontroller with 2/3.3V power supplies, 2048 ROM words, and 256 RAM bytes. It features peripherals like BOD, DMA(1), and TIMER(2) suitable for industrial applications requiring low power mode and connectivity via I2C, SPI, UART.

Median Price

$2.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,820 parts In-Stock

1+ parts

$1.301

100+ parts

$1.075

1k+ parts

$0.581

10k+ parts

-

6,820

$1.301

$1.075

$0.581

-

DigiKey

USA . 451 parts In-Stock

1+ parts

$2.000

100+ parts

$1.230

1k+ parts

$1.122

10k+ parts

-

451

$2.000

$1.230

$1.122

-

Mouser Electronics

USA . 269 parts In-Stock

1+ parts

$2.000

100+ parts

$1.170

1k+ parts

$1.120

10k+ parts

$1.050

269

$2.000

$1.170

$1.120

$1.050

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 801 parts In-Stock

1+ parts

$1.236

100+ parts

-

1k+ parts

-

10k+ parts

-

801

$1.236

-

-

-

Vyrian

USA . 7,248 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,248

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,827 parts In-Stock

1+ parts

$1.171

100+ parts

-

1k+ parts

-

10k+ parts

-

1,827

$1.171

-

-

-

Microchip USA

USA . 1,748 parts In-Stock

1+ parts

$11.250

100+ parts

$11.180

1k+ parts

$11.140

10k+ parts

$11.110

1,748

$11.250

$11.180

$11.140

$11.110

Parana Technologies

USA . 1,524 parts In-Stock

1+ parts

$41.772

100+ parts

-

1k+ parts

-

10k+ parts

-

1,524

$41.772

-

-

-

DigiPath Technology Company

USA . 369 parts In-Stock

1+ parts

$45.996

100+ parts

-

1k+ parts

-

10k+ parts

-

369

$45.996

-

-

-

ChromeModa Solutions

Germany . 989 parts In-Stock

1+ parts

$46.935

100+ parts

$38.487

1k+ parts

-

10k+ parts

-

989

$46.935

$38.487

-

-

IDEA Electronic Components Group

UK . 486 parts In-Stock

1+ parts

$46.935

100+ parts

$44.588

1k+ parts

$42.242

10k+ parts

-

486

$46.935

$44.588

$42.242

-

Overview

Unlock the potential of your projects with the MSP430G2213IPW20 microcontroller by Texas Instruments. Designed with top-quality materials and cutting-edge technology, this powerful device offers a wide range of applications in various industries. From industrial automation to consumer electronics, this microcontroller delivers high performance and reliability. With its low power consumption and advanced peripherals, the MSP430G2213IPW20 provides exceptional value and efficiency, making it the perfect choice for all your embedded system needs. Elevate your designs with Texas Instruments' industry-leading microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount technology makes it easy to integrate this microcontroller into compact designs and PCB layouts.

Maximum Supply Voltage: 3.6 V

Can operate within a wide range of supply voltages, providing flexibility in different power systems.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and efficient multitasking capabilities.

Package Shape: RECTANGULAR

Rectangular shape helps in efficient placement and assembly on printed circuit boards.

Bit Size: 16

A 16-bit architecture enables handling of larger data sets and more complex computations compared to lower-bit microcontrollers.

Power Supplies (V): 2/3.3

Supports multiple power supply options, allowing compatibility with different power sources and systems.

No. of Terminals: 20

Sufficient number of terminals for connections and interfaces with other components in a system.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space and enables integration in small form factor devices.

Minimum Supply Voltage: 3.3 V

Even at a lower supply voltage, the microcontroller can still operate efficiently, conserving power.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications where heat dissipation is critical.

CPU Family: MSP430

Part of the popular MSP430 CPU family known for its low power consumption and high performance.

Minimum Operating Temperature: -40 °C

Operational at very low temperatures, making it suitable for use in various environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish for reliable connections and resistance to corrosion.

DMA Channels: YES

Direct Memory Access channels improve data transfer speeds and reduce CPU workload.

Terminal Position: DUAL

Dual terminal position for enhanced connectivity options and flexibility in circuit arrangements.

ROM Words: 2048

Large ROM capacity for storing program instructions and data, enabling complex applications to run smoothly.

Maximum Seated Height: 1.2 mm

Low-profile design with small seated height for slim and compact device designs.

RAM Words: 0.25

Sufficient RAM capacity for temporary data storage and processing, facilitating efficient operation.

Width: 4.4 mm

Compact width for space-saving integration in tight layouts and designs.

Boundary Scan: YES

Boundary scan feature for easy testing, debugging, and maintenance of the microcontroller in the production process.

Peripherals: BOD, COMPARATOR(8), DMA(1), TIMER(2), WDT

Rich set of peripherals for added functionality and interfacing with external devices in diverse applications.

Maximum Clock Frequency: 16 MHz

High clock frequency for fast processing speeds, making it suitable for real-time applications.

Peak Reflow Temperature °C: 260

Able to withstand high reflow temperatures during soldering processes, ensuring reliable assembly on PCBs.

Length: 6.5 mm

Optimal length for compact and space-efficient board layout and system integration.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh environments and demanding applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller design for high performance, energy efficiency, and fast instruction execution.

No. of Timers: 2

Multiple timers for precise timing control and synchronization in various applications and processes.

RAM Bytes: 256

Adequate RAM capacity in bytes for temporary data storage and efficient program execution.

Technology: CMOS

CMOS technology for low power consumption, high speed, and reliable operation in digital circuits.

Terminal Form: GULL WING

Gull wing terminal form for secure soldering and robust mechanical connections on PCBs.

Maximum Supply Current: 0.42 mA

Low supply current consumption for energy-efficient operation and extended battery life in portable devices.

PWM Channels: YES

Pulse Width Modulation channels for accurate control of analog signals and motor speed regulation.

Connectivity: I2C, IRDA, LIN, SPI, UART, USCI(2)

Diverse connectivity options for communication with external devices, sensors, and interfaces in a wide range of applications.

ROM Programmability: FLASH

Flash programmable ROM for easy and fast program updates, debugging, and customization of applications.

Terminal Pitch: 0.65 mm

Optimal terminal pitch for secure connections and easy PCB layout integration in compact designs.

Format: FIXED POINT

Fixed-point format for numerical calculations, offering efficient performance and resource utilization.

Speed: 16 rpm

High processing speed of 16 revolutions per minute for responsive and real-time control applications.

Low Power Mode: YES

Support for low power mode operation to conserve energy and extend battery life in battery-powered devices.

On Chip Program ROM Width: 8

Broad on-chip program ROM width for storing instructions and data, enabling versatile and complex functionality.

No. of I/O Lines: 16

Sufficient I/O lines for interfacing with external devices, sensors, and peripherals in diverse applications.

Technical Specifications

Microcontrollers MSP430G2213IPW20 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 1.8V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of I/O Lines:

16

No. of Serial I/Os:

1

No. of Terminals:

20

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI, UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), DMA(1), TIMER(2), WDT"

Trade Compliance

MSP430G2213IPW20 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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