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MSP430G2111IPW14R

Texas Instruments

MSP430G2111IPW14R by Texas Instruments

MSP430G2111IPW14R by Texas Instruments is a 16-bit microcontroller with 1024 ROM words and 128 RAM bytes. Operating at a max clock frequency of 0.032 MHz, it features peripherals like BOR, Comparator, Timer(2), WDT. Ideal for industrial applications requiring low power consumption and fixed-point format processing.

Median Price

$0.868

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,055 parts In-Stock

1+ parts

$0.627

100+ parts

$0.599

1k+ parts

$0.569

10k+ parts

-

1,055

$0.627

$0.599

$0.569

-

Chip1Stop

Japan . 1,055 parts In-Stock

1+ parts

$0.851

100+ parts

$0.579

1k+ parts

$0.569

10k+ parts

-

1,055

$0.851

$0.579

$0.569

-

Texas Instruments

USA . 14,940 parts In-Stock

1+ parts

$1.097

100+ parts

$0.844

1k+ parts

$0.444

10k+ parts

-

14,940

$1.097

$0.844

$0.444

-

Rochester

USA . 388 parts In-Stock

1+ parts

-

100+ parts

$0.868

1k+ parts

$0.720

10k+ parts

$0.642

388

-

$0.868

$0.720

$0.642

Verical

USA . 388 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.900

10k+ parts

$0.802

388

-

-

$0.900

$0.802

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,638 parts In-Stock

1+ parts

$0.544

100+ parts

-

1k+ parts

-

10k+ parts

-

2,638

$0.544

-

-

-

Vyrian

USA . 8,547 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,547

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,228 parts In-Stock

1+ parts

$0.516

100+ parts

-

1k+ parts

-

10k+ parts

-

4,228

$0.516

-

-

-

Microchip USA

USA . 1,020 parts In-Stock

1+ parts

$4.080

100+ parts

$4.060

1k+ parts

$4.040

10k+ parts

$4.030

1,020

$4.080

$4.060

$4.040

$4.030

AZTECH Wire

Italy . 50 parts In-Stock

1+ parts

$15.600

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$15.600

-

-

-

Parana Technologies

USA . 974 parts In-Stock

1+ parts

$41.657

100+ parts

-

1k+ parts

-

10k+ parts

-

974

$41.657

-

-

-

DigiPath Technology Company

USA . 542 parts In-Stock

1+ parts

$45.870

100+ parts

$42.200

1k+ parts

-

10k+ parts

-

542

$45.870

$42.200

-

-

ChromeModa Solutions

Germany . 2,066 parts In-Stock

1+ parts

$46.806

100+ parts

$38.381

1k+ parts

-

10k+ parts

-

2,066

$46.806

$38.381

-

-

IDEA Electronic Components Group

UK . 2,003 parts In-Stock

1+ parts

$46.806

100+ parts

$44.466

1k+ parts

$42.125

10k+ parts

-

2,003

$46.806

$44.466

$42.125

-

Perfect Parts

USA . 4,847 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,847

-

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Kepictronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,000

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Overview

Unlock endless possibilities with the MSP430G2111IPW14R by Texas Instruments. This high-quality microcontroller offers a wide range of applications in various industries. With its innovative technology, low power consumption, and compact design, this product provides exceptional value to customers looking for reliable performance and advanced features. Whether you're designing IoT devices, wearable tech, or industrial automation systems, the MSP430G2111IPW14R is the perfect choice for your next project. Trust Texas Instruments for top-notch quality and unmatched expertise in microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the microcontroller lightweight and durable, ideal for portable applications.

Surface Mount: YES

Surface mount design allows for easier and more efficient PCB assembly.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power supplies.

On Chip Data RAM Width: 8

8-bit data RAM width provides sufficient memory for data storage and processing.

Package Shape: RECTANGULAR

Rectangular shape allows for easier integration into compact electronic designs.

Bit Size: 16

16-bit architecture enables higher processing capabilities and precision.

Power Supplies (V): 2/3.3

Support for dual power supplies allows flexibility in voltage requirements.

No. of Terminals: 14

Sufficient number of terminals for connecting various external components.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves board space and facilitates compact designs.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in various environments.

CPU Family: MSP430

Belonging to the MSP430 family ensures compatibility and support from a reputable processor family.

Minimum Operating Temperature: -40 °C

Ability to operate in extreme cold conditions makes it suitable for outdoor and industrial applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish ensures good contact connectivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position allows for easy and secure mounting on the PCB.

ROM Words: 1024

Ample ROM memory for storing program codes and firmware.

Maximum Seated Height: 1.2 mm

Low seated height minimizes the size profile of the microcontroller in the final product.

RAM Words: 0.125

Small RAM memory footprint ideal for quick data access and manipulation tasks.

Width: 4.4 mm

Narrow width enables compact PCB layout and integration into space-constrained designs.

Boundary Scan: YES

Boundary scan feature allows for easier debugging and testing of the microcontroller.

Peripherals: "BOR, COMPARATOR, TIMER(2), WDT

Rich set of peripherals enable versatile functionality and support for various applications.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency for fast processing and real-time operations.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable soldering during manufacturing.

Length: 5 mm

Short length contributes to space-saving designs and compact product form factors.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and microcontroller type provide efficient processing and control capabilities.

No. of Timers: 2

Multiple timers allow for precise timing and scheduling of tasks.

RAM Bytes: 128

Sufficient RAM capacity for data storage and manipulation tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form provides robust mechanical strength and ease of soldering.

Maximum Supply Current: 0.37 mA

Low supply current consumption for energy-efficient operation.

Nominal Supply Voltage: 2.2 V

Stable nominal supply voltage for consistent performance and reliability.

PWM Channels: YES

Support for PWM channels enables precise control of analog output signals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and flexibility in programming.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for dense PCB layouts and miniaturization.

Format: FIXED POINT

Fixed-point format simplifies numerical calculations and reduces computational overhead.

Speed: 16 rpm

Operational speed of 16 rpm for efficient processing and control tasks.

Low Power Mode: YES

Low power mode feature helps in conserving energy and extending battery life.

On Chip Program ROM Width: 8

8-bit program ROM width for storing and executing program instructions efficiently.

No. of I/O Lines: 10

Adequate number of I/O lines for interfacing with external devices and sensors.

Technical Specifications

Microcontrollers MSP430G2111IPW14R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES 1.8 V MINIMUM SUPPLY AT 6 MHZ AND 2.7 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

14

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

1024

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOR, COMPARATOR, TIMER(2), WDT"

Trade Compliance

MSP430G2111IPW14R Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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