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MSP430FW429IPM

Texas Instruments

MSP430FW429IPM by Texas Instruments

MSP430FW429IPM by Texas Instruments is a 16-bit microcontroller with 61440 ROM words and 2048 RAM bytes. It operates at a max clock frequency of 8 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. Features include integrated cache, ADC channels, and peripherals like LCD and timers.

Median Price

$8.585

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,830 parts In-Stock

1+ parts

$8.585

100+ parts

$6.999

1k+ parts

$4.666

10k+ parts

-

1,830

$8.585

$6.999

$4.666

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,900 parts In-Stock

1+ parts

$8.156

100+ parts

-

1k+ parts

-

10k+ parts

-

1,900

$8.156

-

-

-

Vyrian

USA . 8,605 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,605

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,283 parts In-Stock

1+ parts

$7.726

100+ parts

-

1k+ parts

-

10k+ parts

-

4,283

$7.726

-

-

-

Parana Technologies

USA . 1,404 parts In-Stock

1+ parts

$17.838

100+ parts

-

1k+ parts

$18.018

10k+ parts

-

1,404

$17.838

-

$18.018

-

DigiPath Technology Company

USA . 2,051 parts In-Stock

1+ parts

$19.642

100+ parts

-

1k+ parts

-

10k+ parts

-

2,051

$19.642

-

-

-

AZTECH Wire

Italy . 945 parts In-Stock

1+ parts

$20.000

100+ parts

-

1k+ parts

-

10k+ parts

-

945

$20.000

-

-

-

IDEA Electronic Components Group

UK . 1,145 parts In-Stock

1+ parts

$20.043

100+ parts

$19.041

1k+ parts

$18.039

10k+ parts

-

1,145

$20.043

$19.041

$18.039

-

ChromeModa Solutions

Germany . 660 parts In-Stock

1+ parts

$20.043

100+ parts

$16.435

1k+ parts

-

10k+ parts

-

660

$20.043

$16.435

-

-

Microchip USA

USA . 2,286 parts In-Stock

1+ parts

$23.490

100+ parts

$23.150

1k+ parts

$22.980

10k+ parts

$22.820

2,286

$23.490

$23.150

$22.980

$22.820

Overview

Discover the innovative MSP430FW429IPM microcontroller by Texas Instruments, setting new standards in performance and reliability. Perfect for a wide range of applications, this state-of-the-art device offers unmatched value with its integrated cache, low power mode, and advanced peripherals like LCD and timer. Trust in Texas Instruments' reputation for quality and precision engineering to deliver a product that exceeds expectations. Upgrade your projects today with the MSP430FW429IPM and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for a wide range of applications.

Integrated Cache: YES

Having an integrated cache helps in improving the overall performance and speed of the microcontroller.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with various power sources, offering flexibility in design.

CPU Family: MSP430

The MSP430 family is known for its low power consumption while offering high performance, making it ideal for battery-operated devices.

Maximum Clock Frequency: 8 MHz

The high clock frequency allows for fast processing speeds, suitable for applications requiring real-time data processing.

ADC Channels: YES

Having analog-to-digital converter channels enables the microcontroller to interface with a variety of sensors and devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a Reduced Instruction Set Computing (RISC) microcontroller ensures efficient and optimized code execution for faster performance.

ROM Programmability: FLASH

The flash programmable ROM allows for easy and flexible programming of the microcontroller, making it user-friendly for developers.

Technical Specifications

Microcontrollers MSP430FW429IPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

0

No. of Terminals:

64

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

BOD, COMPARATOR, LCD, TIMER(3), WDT

Trade Compliance

MSP430FW429IPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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