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MSP430FR6987IPNR

Texas Instruments

MSP430FR6987IPNR by Texas Instruments

MSP430FR6987IPNR by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 24 MHz. It features 12 ADC channels, 3 DMA channels, and peripherals like BOD and RTC. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,819 parts In-Stock

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Vyrian

USA . 4,710 parts In-Stock

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4,710

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AZTECH Wire

Italy . 599 parts In-Stock

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$9.207

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599

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One Stop Electronics

USA . 1,459 parts In-Stock

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$22.000

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$22.000

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Parana Technologies

USA . 712 parts In-Stock

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$27.764

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$2,578.267

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$24.987

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712

$27.764

$2,578.267

$24.987

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Microchip USA

USA . 2,586 parts In-Stock

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$29.742

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DigiPath Technology Company

USA . 2,366 parts In-Stock

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$30.571

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2,366

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ChromeModa Solutions

Germany . 1,422 parts In-Stock

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$31.195

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$25.580

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$31.195

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IDEA Electronic Components Group

UK . 1,374 parts In-Stock

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$31.195

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$29.635

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$28.076

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1,374

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Corphita

USA . 1,048 parts In-Stock

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Overview

Unlock endless possibilities with the Texas Instruments MSP430FR6987IPNR microcontroller. Designed with cutting-edge technology, this device offers unparalleled quality and reliability. Perfect for various applications, this microcontroller guarantees efficient performance, low power consumption, and a wide range of peripherals. Experience seamless connectivity with I2C, IRDA, SPI, UART, and USCI interfaces. Discover the value of innovation with the MSP430FR6987IPNR, where high performance meets exceptional functionality to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Makes the product lightweight and durable, suitable for portable devices.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply options.

No. of Terminals: 80

Provides ample connectivity options for various peripherals and interfaces.

ADC Channels: YES

Enables analog to digital conversion for sensor interfacing and data acquisition.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient processing and control capabilities.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of analog circuits.

Connectivity: I2C, IRDA, SPI(2), UART, USCI(2)

Offers versatile communication options for interfacing with other devices.

Low Power Mode: YES

Allows for power-efficient operation, extending battery life in portable devices.

Technical Specifications

Microcontrollers MSP430FR6987IPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

63

No. of Serial I/Os:

3

No. of Terminals:

80

No. of Timers:

20

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(16), CRC, DMA(3), RTC, TIMER(20), WDT"

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430FR6987IPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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