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MSP430FR6879IPZ

Texas Instruments

MSP430FR6879IPZ by Texas Instruments

MSP430FR6879IPZ by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 2048 RAM bytes. It features 16 ADC channels, 3 DMA channels, and operates at a max clock frequency of 24 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$6.357

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,272 parts In-Stock

1+ parts

$6.357

100+ parts

$5.183

1k+ parts

$3.455

10k+ parts

-

1,272

$6.357

$5.183

$3.455

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,253 parts In-Stock

1+ parts

$6.039

100+ parts

-

1k+ parts

-

10k+ parts

-

2,253

$6.039

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-

-

Vyrian

USA . 4,537 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,537

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,227 parts In-Stock

1+ parts

$5.721

100+ parts

-

1k+ parts

-

10k+ parts

-

2,227

$5.721

-

-

-

Parana Technologies

USA . 2,136 parts In-Stock

1+ parts

$46.171

100+ parts

-

1k+ parts

-

10k+ parts

-

2,136

$46.171

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-

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ChromeModa Solutions

Germany . 6,063 parts In-Stock

1+ parts

$51.878

100+ parts

$42.540

1k+ parts

-

10k+ parts

-

6,063

$51.878

$42.540

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IDEA Electronic Components Group

UK . 1,655 parts In-Stock

1+ parts

$51.878

100+ parts

$49.284

1k+ parts

$46.690

10k+ parts

-

1,655

$51.878

$49.284

$46.690

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DigiPath Technology Company

USA . 1,253 parts In-Stock

1+ parts

-

100+ parts

$46.773

1k+ parts

-

10k+ parts

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1,253

-

$46.773

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Overview

Unleash the power of innovation with the Texas Instruments MSP430FR6879IPZ microcontroller, a cutting-edge solution for your electronic projects. Crafted by industry leaders, this device offers unmatched quality and reliability. Ideal for a wide range of applications, from IoT devices to industrial automation, the MSP430FR6879IPZ delivers exceptional performance and efficiency. Experience seamless connectivity and unparalleled functionality at an unbeatable value. Elevate your designs with this versatile microcontroller and bring your ideas to life with ease. Trust in Texas Instruments for superior technology that sets you apart from the rest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection to the microcontroller, making it suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can operate efficiently in various voltage environments, providing flexibility in design.

ROM Words: 131072

The large ROM size of 131072 words allows for storing a significant amount of program code, enabling the microcontroller to handle complex tasks effectively.

Maximum Clock Frequency: 24 MHz

With a high maximum clock frequency of 24 MHz, this microcontroller can perform tasks quickly and efficiently, making it suitable for applications that require fast processing.

Analog To Digital Convertors: 16-Ch 12-Bit

The 16-channel 12-bit analog-to-digital converters (ADCs) enable the microcontroller to accurately convert analog signals to digital data, making it ideal for applications that require precise measurements.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption when the microcontroller is in idle or standby mode, making it energy-efficient and suitable for battery-powered devices.

Technical Specifications

Microcontrollers MSP430FR6879IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

83

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

131072

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), DMA(3), LCD, POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR6879IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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