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MSP430FR5959IRHAR

Texas Instruments

MSP430FR5959IRHAR by Texas Instruments

MSP430FR5959IRHAR by Texas Instruments is a 16-bit microcontroller with 40 terminals, operating at a max frequency of 24 MHz. It features 14-Ch 12-Bit ADC channels and offers low power mode for industrial applications. With FRAM ROM programmability, it provides high-speed performance in a compact chip carrier package suitable for various embedded systems.

Median Price

$3.643

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,974 parts In-Stock

1+ parts

$3.643

100+ parts

$2.970

1k+ parts

$1.980

10k+ parts

-

13,974

$3.643

$2.970

$1.980

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$2.655

100+ parts

-

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-

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-

750

$2.655

-

-

-

Digiode

USA . 166 parts In-Stock

1+ parts

$3.461

100+ parts

-

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-

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-

166

$3.461

-

-

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Vyrian

USA . 7,770 parts In-Stock

1+ parts

-

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-

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-

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7,770

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-

-

-

Chip Stock

USA . 235 parts In-Stock

1+ parts

-

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-

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235

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,703 parts In-Stock

1+ parts

$2.655

100+ parts

-

1k+ parts

-

10k+ parts

$2.602

5,703

$2.655

-

-

$2.602

Argo Parts USA

USA . 3,176 parts In-Stock

1+ parts

$2.655

100+ parts

-

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-

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3,176

$2.655

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-

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Ampacity Inc.

Singapore . 13,641 parts In-Stock

1+ parts

$3.100

100+ parts

-

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13,641

$3.100

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Corphita

USA . 585 parts In-Stock

1+ parts

$3.279

100+ parts

-

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585

$3.279

-

-

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AZTECH Wire

Italy . 1,114 parts In-Stock

1+ parts

$9.990

100+ parts

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1,114

$9.990

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Parana Technologies

USA . 672 parts In-Stock

1+ parts

$49.933

100+ parts

-

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672

$49.933

-

-

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DigiPath Technology Company

USA . 1,656 parts In-Stock

1+ parts

$54.982

100+ parts

-

1k+ parts

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10k+ parts

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1,656

$54.982

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-

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ChromeModa Solutions

Germany . 6,942 parts In-Stock

1+ parts

$56.104

100+ parts

$46.005

1k+ parts

-

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6,942

$56.104

$46.005

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IDEA Electronic Components Group

UK . 2,205 parts In-Stock

1+ parts

$56.104

100+ parts

$53.299

1k+ parts

$50.494

10k+ parts

-

2,205

$56.104

$53.299

$50.494

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Lixinc

USA . 3,368 parts In-Stock

1+ parts

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3,368

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$2.602

1k+ parts

$2.522

10k+ parts

$2.469

1,000

-

$2.602

$2.522

$2.469

Overview

Unlock the power of innovation with the MSP430FR5959IRHAR by Texas Instruments. As a leading manufacturer in the microcontroller category, Texas Instruments delivers unmatched quality and reliability. This versatile product offers a wide range of applications, from industrial automation to consumer electronics. Customers can expect exceptional value with features like low power mode, PWM channels, and on-chip data RAM. Experience the benefits of cutting-edge technology with the MSP430FR5959IRHAR, designed to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation of the microcontroller in various applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources.

On Chip Data RAM Width: 8

The 8-bit data RAM width offers efficient data processing capabilities for the microcontroller.

Package Shape: SQUARE

The square package shape provides a compact design for space-constrained applications.

Bit Size: 16

The 16-bit architecture allows for more complex calculations and operations to be performed efficiently.

No. of Terminals: 40

The ample number of terminals ensures compatibility with a variety of peripheral devices and components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of package styles offers versatility in mounting and heat dissipation options.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for power-efficient operation in battery-powered devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in harsh environmental conditions.

Technical Specifications

Microcontrollers MSP430FR5959IRHAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

2

No. of Terminals:

40

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Connectivity:

EUSCI(3)

Peripherals:

BOR, COMPARATOR(16), DMA(3), POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

14-Ch 12-Bit

Trade Compliance

MSP430FR5959IRHAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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