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MSP430FR5948IDA

Texas Instruments

MSP430FR5948IDA by Texas Instruments

MSP430FR5948IDA by Texas Instruments is a 16-bit microcontroller with 49152 ROM words and 2048 RAM bytes. It features 12-Ch 12-Bit ADC channels, 3 DMA channels, and operates at a max clock frequency of 24 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$6.006

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,230 parts In-Stock

1+ parts

$4.081

100+ parts

$3.327

1k+ parts

$2.218

10k+ parts

-

1,230

$4.081

$3.327

$2.218

-

Mouser Electronics

USA . 67 parts In-Stock

1+ parts

$7.930

100+ parts

$5.280

1k+ parts

$3.610

10k+ parts

-

67

$7.930

$5.280

$3.610

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,617 parts In-Stock

1+ parts

$3.877

100+ parts

-

1k+ parts

-

10k+ parts

-

1,617

$3.877

-

-

-

Vyrian

USA . 7,733 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,733

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,919 parts In-Stock

1+ parts

$3.673

100+ parts

-

1k+ parts

-

10k+ parts

-

2,919

$3.673

-

-

-

Microchip USA

USA . 1,219 parts In-Stock

1+ parts

$28.390

100+ parts

$28.220

1k+ parts

$28.130

10k+ parts

$28.040

1,219

$28.390

$28.220

$28.130

$28.040

Parana Technologies

USA . 2,348 parts In-Stock

1+ parts

$40.635

100+ parts

$3,773.551

1k+ parts

$36.571

10k+ parts

-

2,348

$40.635

$3,773.551

$36.571

-

DigiPath Technology Company

USA . 2,257 parts In-Stock

1+ parts

$44.744

100+ parts

$41.164

1k+ parts

-

10k+ parts

-

2,257

$44.744

$41.164

-

-

ChromeModa Solutions

Germany . 625 parts In-Stock

1+ parts

$45.657

100+ parts

$37.439

1k+ parts

-

10k+ parts

-

625

$45.657

$37.439

-

-

IDEA Electronic Components Group

UK . 165 parts In-Stock

1+ parts

$45.657

100+ parts

$43.374

1k+ parts

$41.091

10k+ parts

-

165

$45.657

$43.374

$41.091

-

QUARKTWIN TECHNOLOGY LTD

USA . 15,749 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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15,749

-

-

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FR5948IDA microcontroller. Designed with cutting-edge technology and high-quality materials, this device offers unparalleled performance in a compact package. Ideal for a wide range of applications, from IoT devices to industrial automation, the MSP430FR5948IDA provides customers with unmatched value and benefits. With features like low power mode, multiple timers, and analog-to-digital converters, this microcontroller is the perfect choice for those looking to take their projects to the next level. Experience the difference with Texas Instruments and revolutionize your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various environmental conditions.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with different voltage sources.

Bit Size: 16

Provides a higher level of data processing capability and efficiency for complex tasks.

Maximum Operating Temperature: 85 °C

Ensures reliable operation even in high-temperature environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing (RISC) architecture for improved performance and efficiency in handling instructions.

Analog To Digital Convertors: 12-Ch 12-Bit

Enables efficient conversion of analog signals to digital data for accurate readings and sensor integration.

Connectivity: EUSCI(3)

Supports advanced communication protocols for seamless connectivity with external devices and peripherals.

PWM Channels: YES

Allows for precise control of power output for applications such as motor control and LED dimming.

Low Power Mode: YES

Enables power-saving features for extended battery life in portable and energy-efficient applications.

Technical Specifications

Microcontrollers MSP430FR5948IDA attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

2

No. of Terminals:

38

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

49152

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Peripheral IC Type:

Connectivity:

EUSCI(3)

Peripherals:

BOR, COMPARATOR(16), DMA(3), POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430FR5948IDA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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