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MSP430FR5849IDAR

Texas Instruments

MSP430FR5849IDAR by Texas Instruments

MSP430FR5849IDAR by Texas Instruments is a 16-bit microcontroller with 65536 ROM words and 2048 RAM bytes. It features 16-Ch 12-Bit ADC, 3 DMA channels, and peripherals like CRC and RTC. Ideal for industrial applications requiring low power consumption and high-speed processing up to 16 MHz.

Median Price

$3.511

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,374 parts In-Stock

1+ parts

$3.511

100+ parts

$2.862

1k+ parts

$1.908

10k+ parts

-

4,374

$3.511

$2.862

$1.908

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$1.908

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$1.908

-

-

-

Digiode

USA . 2,593 parts In-Stock

1+ parts

$3.335

100+ parts

-

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-

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2,593

$3.335

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Vyrian

USA . 6,546 parts In-Stock

1+ parts

-

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6,546

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,588 parts In-Stock

1+ parts

$1.908

100+ parts

-

1k+ parts

-

10k+ parts

$1.870

5,588

$1.908

-

-

$1.870

Argo Parts USA

USA . 3,071 parts In-Stock

1+ parts

$1.908

100+ parts

-

1k+ parts

-

10k+ parts

-

3,071

$1.908

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Netroflash

USA . 100 parts In-Stock

1+ parts

$1.908

100+ parts

-

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-

100

$1.908

-

-

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Ampacity Inc.

Singapore . 4,353 parts In-Stock

1+ parts

$2.980

100+ parts

-

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10k+ parts

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4,353

$2.980

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Corphita

USA . 4,121 parts In-Stock

1+ parts

$3.160

100+ parts

-

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4,121

$3.160

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AZTECH Wire

Italy . 1,050 parts In-Stock

1+ parts

$11.460

100+ parts

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1,050

$11.460

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Parana Technologies

USA . 1,334 parts In-Stock

1+ parts

$60.652

100+ parts

-

1k+ parts

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10k+ parts

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1,334

$60.652

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ChromeModa Solutions

Germany . 6,312 parts In-Stock

1+ parts

$68.148

100+ parts

$55.881

1k+ parts

-

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6,312

$68.148

$55.881

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IDEA Electronic Components Group

UK . 393 parts In-Stock

1+ parts

$68.148

100+ parts

$64.741

1k+ parts

$61.333

10k+ parts

-

393

$68.148

$64.741

$61.333

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DigiPath Technology Company

USA . 960 parts In-Stock

1+ parts

-

100+ parts

$61.442

1k+ parts

-

10k+ parts

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960

-

$61.442

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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500

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Overview

Unlock the power of innovation with the MSP430FR5849IDAR from Texas Instruments, a leading manufacturer in the field of microcontrollers. Perfect for a wide range of applications, this compact and efficient device offers unparalleled value and benefits to customers. With features like low power mode, analog to digital converters, and multiple connectivity options, this product is a game-changer in the world of electronics. Experience reliability, performance, and quality like never before with the MSP430FR5849IDAR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protects the microcontroller from external elements, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

Bit Size: 16

16-bit architecture enables efficient processing of data and instructions, making the microcontroller suitable for complex tasks.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures high performance and efficiency in executing instructions, making the microcontroller a reliable choice for various applications.

Analog To Digital Convertors: 16-Ch 12-Bit

Having 16 channels of 12-bit ADC allows for precise and accurate conversion of analog signals, making the microcontroller suitable for sensor-based applications.

Connectivity: I2C, IRDA, SPI(1), UART, USCI(3)

Multiple communication interfaces enable seamless integration with other devices, expanding the functionality and potential applications of the microcontroller.

Technical Specifications

Microcontrollers MSP430FR5849IDAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

2

No. of Terminals:

38

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.2 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(1), UART, USCI(3)"

Peripherals:

"COMPARATOR, CRC,RTC, TIMER(15), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR5849IDAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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