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MSP430FR5735IRHAT

Texas Instruments

MSP430FR5735IRHAT by Texas Instruments

MSP430FR5735IRHAT by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 8192 ROM words. It features 14-Ch 10-Bit ADC channels, 3 DMA channels, and operates at a max clock frequency of 24 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$2.226

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 44,550 parts In-Stock

1+ parts

$2.226

100+ parts

$1.815

1k+ parts

$1.210

10k+ parts

-

44,550

$2.226

$1.815

$1.210

-

DigiKey

USA . 470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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470

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,565 parts In-Stock

1+ parts

$2.115

100+ parts

-

1k+ parts

-

10k+ parts

-

3,565

$2.115

-

-

-

Vyrian

USA . 3,004 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,004

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,012 parts In-Stock

1+ parts

$2.003

100+ parts

-

1k+ parts

-

10k+ parts

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4,012

$2.003

-

-

-

Component Stockers USA

USA . 533 parts In-Stock

1+ parts

$3.160

100+ parts

$2.320

1k+ parts

-

10k+ parts

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533

$3.160

$2.320

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-

Parana Technologies

USA . 680 parts In-Stock

1+ parts

$49.048

100+ parts

-

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680

$49.048

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-

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DigiPath Technology Company

USA . 1,341 parts In-Stock

1+ parts

$54.008

100+ parts

$49.687

1k+ parts

-

10k+ parts

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1,341

$54.008

$49.687

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-

IDEA Electronic Components Group

UK . 799 parts In-Stock

1+ parts

$55.110

100+ parts

$52.354

1k+ parts

$49.599

10k+ parts

-

799

$55.110

$52.354

$49.599

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ChromeModa Solutions

Germany . 434 parts In-Stock

1+ parts

$55.110

100+ parts

$45.190

1k+ parts

-

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434

$55.110

$45.190

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iodParts Technologies Inc.

India . 2,750 parts In-Stock

1+ parts

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100+ parts

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2,750

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Overview

Unlock the power of innovation with the MSP430FR5735IRHAT by Texas Instruments, a cutting-edge microcontroller designed to elevate your projects to new heights. With a reputation for excellence in quality and reliability, Texas Instruments delivers a product that exceeds expectations. Ideal for a wide range of applications, this microcontroller is versatile and efficient, offering customers unparalleled value and benefits. Embrace the future of technology with the MSP430FR5735IRHAT and experience the advantages of precision engineering in every project you undertake.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration onto PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.6 V

Allows for reliable operation within a safe voltage range, protecting the microcontroller from potential damage due to overvoltage.

ADC Channels: YES

Having analog-to-digital conversion channels enables the microcontroller to interface with analog sensors and signals, expanding its capabilities.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and offload the CPU, enhancing overall performance and responsiveness.

ROM Words: 8192

Ample Read-Only Memory capacity allows for storing program instructions and data, facilitating complex operations and applications.

Maximum Clock Frequency: 24 MHz

High clock frequency supports speedy data processing and execution, making the microcontroller suitable for tasks requiring quick responses.

Connectivity: I2C, IRDA(2), SCI(3), SPI(3), UART(2)

Multiple connectivity options make the microcontroller versatile and compatible with various communication protocols and peripherals, enhancing its flexibility.

Low Power Mode: YES

The ability to operate in low power mode conserves energy and extends battery life, ideal for applications requiring power efficiency.

Technical Specifications

Microcontrollers MSP430FR5735IRHAT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

1

No. of Terminals:

40

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

8192

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

24 rpm

Maximum Supply Current:

4.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), SCI(3), SPI(3), UART(2)"

Peripherals:

"COMPARATOR(16), CRC, DMA(3), RTC, TIMER(5)"

Analog To Digital Convertors:

14-Ch 10-Bit

Trade Compliance

MSP430FR5735IRHAT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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