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MSP430FR5734IPWR

Texas Instruments

MSP430FR5734IPWR by Texas Instruments

MSP430FR5734IPWR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 8192 ROM words. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring low power consumption. Features include 10 ADC channels, 3 DMA channels, and connectivity options like I2C, SCI, SPI, and UART.

Median Price

$1.811

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 35,006 parts In-Stock

1+ parts

$1.811

100+ parts

$1.476

1k+ parts

$0.984

10k+ parts

-

35,006

$1.811

$1.476

$0.984

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,194 parts In-Stock

1+ parts

$1.720

100+ parts

-

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4,194

$1.720

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Vyrian

USA . 2,440 parts In-Stock

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2,440

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Distributors (Availability)

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Corphita

USA . 2,198 parts In-Stock

1+ parts

$1.630

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-

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2,198

$1.630

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AZTECH Wire

Italy . 469 parts In-Stock

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$18.940

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469

$18.940

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Parana Technologies

USA . 933 parts In-Stock

1+ parts

$67.519

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-

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933

$67.519

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ChromeModa Solutions

Germany . 1,674 parts In-Stock

1+ parts

$75.864

100+ parts

$62.208

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1,674

$75.864

$62.208

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IDEA Electronic Components Group

UK . 1,616 parts In-Stock

1+ parts

$75.864

100+ parts

$72.071

1k+ parts

$68.278

10k+ parts

-

1,616

$75.864

$72.071

$68.278

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Component Stockers USA

USA . 45,236 parts In-Stock

1+ parts

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QUARKTWIN TECHNOLOGY LTD

USA . 10,158 parts In-Stock

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Lixinc

USA . 4,712 parts In-Stock

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Perfect Parts

USA . 1,120 parts In-Stock

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1,120

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DigiPath Technology Company

USA . 718 parts In-Stock

1+ parts

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$68.399

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718

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$68.399

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Overview

Unlock the power of innovation with the MSP430FR5734IPWR by Texas Instruments. As a leader in microcontrollers, Texas Instruments delivers top-notch quality and reliability. This versatile product is perfect for a wide range of applications, offering customers unbeatable value and benefits. With advanced features like low power mode, connectivity options, and analog to digital converters, the MSP430FR5734IPWR is a game-changer in the industry. Experience the difference with Texas Instruments and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6 V allows for flexibility in power supply options.

Bit Size: 16

16-bit architecture provides improved processing capabilities and performance.

No. of Terminals: 28

28 terminals offer ample connectivity options for peripherals and external components.

Maximum Clock Frequency: 24 MHz

High maximum clock frequency of 24 MHz enables fast processing and execution of instructions.

Technology: CMOS

CMOS technology ensures low power consumption and efficient operation.

No. of I/O Lines: 21

21 I/O lines provide versatility in interfacing with external devices and sensors.

Technical Specifications

Microcontrollers MSP430FR5734IPWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

21

No. of Serial I/Os:

1

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Maximum Supply Current:

4.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), SCI(3), SPI(3), UART(2)"

Peripherals:

"COMPARATOR(16), CRC, DMA(3), RTC, TIMER(5)"

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

MSP430FR5734IPWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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