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MSP430FR5726IPWR

Texas Instruments

MSP430FR5726IPWR by Texas Instruments

MSP430FR5726IPWR by Texas Instruments is a 16-bit microcontroller with 2.5/3.3V power supplies, 24MHz clock frequency, and 1024 bytes of RAM. Ideal for industrial applications requiring a compact form factor and low power consumption, it features ADC and DMA channels for efficient data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,006 parts In-Stock

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3,006

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Digiode

USA . 2,589 parts In-Stock

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2,589

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One Stop Electronics

USA . 874 parts In-Stock

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$9.000

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874

$9.000

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AZTECH Wire

Italy . 822 parts In-Stock

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$11.378

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822

$11.378

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Parana Technologies

USA . 403 parts In-Stock

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$44.237

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403

$44.237

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DigiPath Technology Company

USA . 1,595 parts In-Stock

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$48.710

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$44.813

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1,595

$48.710

$44.813

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IDEA Electronic Components Group

UK . 1,237 parts In-Stock

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$49.704

100+ parts

$47.219

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$44.734

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1,237

$49.704

$47.219

$44.734

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ChromeModa Solutions

Germany . 319 parts In-Stock

1+ parts

$49.704

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$40.757

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319

$49.704

$40.757

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Corphita

USA . 2,330 parts In-Stock

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Microchip USA

USA . 385 parts In-Stock

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Overview

Unleash the power of innovation with the Texas Instruments MSP430FR5726IPWR microcontroller! Designed with cutting-edge technology and quality craftsmanship, this device offers unmatched performance and reliability. Ideal for a wide range of applications, from IoT devices to industrial automation, this microcontroller provides customers with value, efficiency, and flexibility like never before. Say goodbye to limitations and hello to endless possibilities with the MSP430FR5726IPWR by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protects the microcontroller from physical damage, making it a reliable choice for various applications.

Surface Mount: YES

Being surface mountable makes installation easy and efficient, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can handle higher voltage inputs without the risk of damage, ensuring stable operation.

Bit Size: 16

The 16-bit architecture enables faster and more efficient processing of data, making the microcontroller suitable for tasks that require high performance.

Power Supplies (V): 2.5/3.3

The availability of multiple power supply options allows flexibility in powering the microcontroller, making it compatible with various systems.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options for interfacing with external devices and peripherals, making it versatile for diverse applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance of 85°C ensures reliable performance even in harsh environmental conditions.

CPU Family: MSP430

Belonging to the MSP430 CPU family, known for low power consumption and high performance, this microcontroller offers efficiency and reliability in operation.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, allowing the microcontroller to interface with analog sensors and signals.

DMA Channels: YES

DMA channels facilitate direct memory access for efficient data transfer, reducing the workload on the CPU and enhancing overall system performance.

Technical Specifications

Microcontrollers MSP430FR5726IPWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

21

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

16384

ROM Programmability:

MROM

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

2.8 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

MSP430FR5726IPWR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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