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MSP430FR5041IRGCR

Texas Instruments

MSP430FR5041IRGCR by Texas Instruments

MSP430FR5041IRGCR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 24 MHz. It features 9 ADC channels, 6 DMA channels, and FRAM ROM programmability. Ideal for industrial applications requiring high-speed processing and multiple connectivity options like I2C, IRDA, SPI, and UART.

Median Price

$4.600

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,500 parts In-Stock

1+ parts

$4.600

100+ parts

$3.750

1k+ parts

$2.500

10k+ parts

-

1,500

$4.600

$3.750

$2.500

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,071 parts In-Stock

1+ parts

$4.370

100+ parts

-

1k+ parts

-

10k+ parts

-

1,071

$4.370

-

-

-

Vyrian

USA . 2,117 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,117

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,893 parts In-Stock

1+ parts

$4.140

100+ parts

-

1k+ parts

-

10k+ parts

-

3,893

$4.140

-

-

-

Parana Technologies

USA . 1,528 parts In-Stock

1+ parts

$16.769

100+ parts

$1,557.291

1k+ parts

$15.092

10k+ parts

-

1,528

$16.769

$1,557.291

$15.092

-

DigiPath Technology Company

USA . 1,646 parts In-Stock

1+ parts

$18.465

100+ parts

$16.988

1k+ parts

-

10k+ parts

-

1,646

$18.465

$16.988

-

-

AZTECH Wire

Italy . 39 parts In-Stock

1+ parts

$18.490

100+ parts

-

1k+ parts

-

10k+ parts

-

39

$18.490

-

-

-

ChromeModa Solutions

Germany . 6,351 parts In-Stock

1+ parts

$18.842

100+ parts

$15.450

1k+ parts

-

10k+ parts

-

6,351

$18.842

$15.450

-

-

IDEA Electronic Components Group

UK . 887 parts In-Stock

1+ parts

$18.842

100+ parts

$17.900

1k+ parts

$16.958

10k+ parts

-

887

$18.842

$17.900

$16.958

-

Overview

Unlock the power of cutting-edge technology with the MSP430FR5041IRGCR by Texas Instruments. As a leader in microcontrollers, Texas Instruments ensures top-notch quality and reliability in every product they create. The MSP430FR5041IRGCR is perfect for a wide range of applications thanks to its innovative features and advanced capabilities. Experience seamless connectivity with I2C, IRDA, SPI, and UART options, along with 9-channel, 12-bit ADCs for precise analog to digital conversion. With FRAM ROM programmability and a maximum clock frequency of 24 MHz, this microcontroller offers unmatched value and performance for your projects. Elevate your designs with the MSP430FR5041IRGCR and witness the difference Texas Instruments makes in powering your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for portable electronic devices.

Surface Mount: YES

Allows for easy and efficient assembly onto PCBs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power supply options.

Package Shape: SQUARE

Compact design for space-saving installations.

Bit Size: 16

Provides sufficient processing power for various applications.

No. of Terminals: 64

Offers ample connectivity options for peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG

Enhances thermal performance and protects the chip during operation.

Minimum Supply Voltage: 1.8 V

Allows for low power operation and energy efficiency.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with high temperature fluctuations.

CPU Family: MSP430

Known for low power consumption and high performance.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Ensures reliable electrical connections and prevents corrosion.

ADC Channels: YES

Allows for analog input signal conversion, essential for sensor integration.

DMA Channels: YES

Enables efficient data transfer between peripherals and memory without CPU intervention.

Terminal Position: QUAD

Facilitates easy soldering and handling during assembly.

ROM Words: 32768

Sufficient memory capacity for storing program instructions.

Width: 9 mm

Compact size for integration into small devices.

Peripherals: BOR, COMPARATOR(11), DMA(6), POR, RTC, TIMER(6), WDT

Rich set of peripheral options for versatile application development.

Maximum Clock Frequency: 24 MHz

Provides fast processing speed for real-time operations.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable solder connections during manufacturing process.

Peak Reflow Temperature °C: 260

Withstands high temperature soldering processes.

Length: 9 mm

Uniform size dimensions for consistent PCB layout.

Temperature Grade: INDUSTRIAL

Suitable for rugged industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Efficient RISC architecture for optimized performance.

RAM Bytes: 12288

Adequate working memory for data storage and manipulation.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: NO LEAD

Environmentally friendly lead-free terminal construction.

Analog To Digital Convertors: 9-Ch 12-Bit

Accurate analog signal conversion for precise sensor readings.

Nominal Supply Voltage: 3 V

Standard voltage supply for compatibility with existing systems.

PWM Channels: YES

Allows for precise control of motor speeds and power output.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Versatile communication interfaces for connecting with other devices.

ROM Programmability: FRAM

Fast and reliable non-volatile memory for program storage.

Terminal Pitch: 0.5 mm

Fine pitch spacing for compact PCB layout and advanced designs.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes with moderate moisture sensitivity.

Speed: 16 rpm

Supports efficient data processing and execution speed.

On Chip Program ROM Width: 8

Efficient use of on-chip memory for program storage.

No. of I/O Lines: 44

Sufficient input/output options for connecting with external peripherals.

Technical Specifications

Microcontrollers MSP430FR5041IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

44

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

RAM Bytes:

12288

ROM Words:

32768

ROM Programmability:

FRAM

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(11), DMA(6), POR, RTC, TIMER(6), WDT

Analog To Digital Convertors:

9-Ch 12-Bit

Trade Compliance

MSP430FR5041IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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