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MSP430FR2675TRHAT

Texas Instruments

MSP430FR2675TRHAT by Texas Instruments

MSP430FR2675TRHAT by Texas Instruments is a 16-bit microcontroller with 33280 ROM words and 3072 RAM words. It operates at a max clock frequency of 0.032 MHz, making it suitable for industrial applications requiring low power consumption and high-speed processing. With features like BOR, POR, RTC, and multiple timers, it offers versatile connectivity options through I2C, IRDA, SPI, and UART interfaces.

Median Price

$3.549

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,500 parts In-Stock

1+ parts

$3.549

100+ parts

$3.110

1k+ parts

$1.757

10k+ parts

-

11,500

$3.549

$3.110

$1.757

-

Mouser Electronics

USA . 250 parts In-Stock

1+ parts

$4.500

100+ parts

$2.710

1k+ parts

$2.490

10k+ parts

$2.470

250

$4.500

$2.710

$2.490

$2.470

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.702

10k+ parts

-

250

-

-

$2.702

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,689 parts In-Stock

1+ parts

$3.372

100+ parts

-

1k+ parts

-

10k+ parts

-

3,689

$3.372

-

-

-

Vyrian

USA . 7,740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,740

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,839 parts In-Stock

1+ parts

$3.194

100+ parts

-

1k+ parts

-

10k+ parts

-

4,839

$3.194

-

-

-

Microchip USA

USA . 1,449 parts In-Stock

1+ parts

$21.340

100+ parts

$21.210

1k+ parts

$21.140

10k+ parts

$21.080

1,449

$21.340

$21.210

$21.140

$21.080

Parana Technologies

USA . 120 parts In-Stock

1+ parts

$36.494

100+ parts

-

1k+ parts

-

10k+ parts

-

120

$36.494

-

-

-

DigiPath Technology Company

USA . 2,059 parts In-Stock

1+ parts

$40.185

100+ parts

$36.970

1k+ parts

-

10k+ parts

-

2,059

$40.185

$36.970

-

-

ChromeModa Solutions

Germany . 6,067 parts In-Stock

1+ parts

$41.005

100+ parts

$33.624

1k+ parts

-

10k+ parts

-

6,067

$41.005

$33.624

-

-

IDEA Electronic Components Group

UK . 995 parts In-Stock

1+ parts

$41.005

100+ parts

$38.955

1k+ parts

$36.904

10k+ parts

-

995

$41.005

$38.955

$36.904

-

Overview

Unlock the power of innovation with the Texas Instruments MSP430FR2675TRHAT microcontroller. Built with precision and expertise, this versatile chip offers a wide range of applications in various industries. From industrial automation to consumer electronics, this microcontroller provides unmatched performance and reliability. With advanced features such as low power mode and multiple peripherals, customers can expect enhanced efficiency and seamless integration. Experience the quality and value offered by Texas Instruments with the MSP430FR2675TRHAT - the perfect solution for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, suitable for various applications.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in powering the microcontroller within a safe range.

Bit Size: 16

16-bit architecture enables efficient processing and execution of instructions, suitable for handling complex tasks.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures high performance and efficiency in data processing, making it a reliable choice for microcontroller applications.

Analog To Digital Convertors: 10-Ch 12-Bit

10-channel 12-bit ADC provides high-resolution analog to digital conversion, allowing for accurate and precise measurement of analog signals.

Technical Specifications

Microcontrollers MSP430FR2675TRHAT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

35

No. of Serial I/Os:

2

No. of Terminals:

40

No. of Timers:

5

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

6144

RAM Words:

3072

ROM Words:

33280

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

3.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2)

Peripherals:

BOR, COMPARATOR, POR, RTC, TIMER(6), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

MSP430FR2675TRHAT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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