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MSP430FR2433IYQWT

Texas Instruments

MSP430FR2433IYQWT by Texas Instruments

MSP430FR2433IYQWT by Texas Instruments is a 16-bit microcontroller with 15360 ROM words and 4096 RAM bytes. It operates b/w -40 to 85 °C, features 8-Ch 10-Bit ADC channels, and offers low power mode for industrial applications.

Median Price

$2.178

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,378 parts In-Stock

1+ parts

$1.745

100+ parts

$1.441

1k+ parts

$0.779

10k+ parts

-

7,378

$1.745

$1.441

$0.779

-

Mouser Electronics

USA . 113 parts In-Stock

1+ parts

$2.610

100+ parts

$1.580

1k+ parts

$1.110

10k+ parts

$1.080

113

$2.610

$1.580

$1.110

$1.080

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.150

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$1.150

-

-

-

Digiode

USA . 2,837 parts In-Stock

1+ parts

$1.658

100+ parts

-

1k+ parts

-

10k+ parts

-

2,837

$1.658

-

-

-

Vyrian

USA . 6,749 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,749

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,236 parts In-Stock

1+ parts

$0.830

100+ parts

-

1k+ parts

-

10k+ parts

-

2,236

$0.830

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

$1.150

100+ parts

$1.127

1k+ parts

-

10k+ parts

-

50

$1.150

$1.127

-

-

Corphita

USA . 3,297 parts In-Stock

1+ parts

$1.570

100+ parts

-

1k+ parts

-

10k+ parts

-

3,297

$1.570

-

-

-

Microchip USA

USA . 1,649 parts In-Stock

1+ parts

$10.230

100+ parts

$10.170

1k+ parts

$10.130

10k+ parts

$10.100

1,649

$10.230

$10.170

$10.130

$10.100

Parana Technologies

USA . 1,618 parts In-Stock

1+ parts

$48.728

100+ parts

-

1k+ parts

-

10k+ parts

-

1,618

$48.728

-

-

-

DigiPath Technology Company

USA . 1,486 parts In-Stock

1+ parts

$53.655

100+ parts

$49.363

1k+ parts

-

10k+ parts

-

1,486

$53.655

$49.363

-

-

ChromeModa Solutions

Germany . 4,946 parts In-Stock

1+ parts

$54.750

100+ parts

$44.895

1k+ parts

-

10k+ parts

-

4,946

$54.750

$44.895

-

-

IDEA Electronic Components Group

UK . 975 parts In-Stock

1+ parts

$54.750

100+ parts

$52.012

1k+ parts

$49.275

10k+ parts

-

975

$54.750

$52.012

$49.275

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

-

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Overview

Unlock the potential of your projects with the Texas Instruments MSP430FR2433IYQWT microcontroller. Manufactured by a trusted industry leader, this versatile device offers a wide range of applications in a compact and efficient package. Experience the value of its low power consumption, advanced connectivity options, and robust peripherals. Whether you're designing IoT devices, consumer electronics, or industrial automation systems, this microcontroller delivers the performance and reliability you need to succeed. Trust in Texas Instruments to provide top-quality solutions for all your embedded system needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material makes the microcontroller lightweight and durable, ideal for portable electronic devices.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6 V provides flexibility in power supply options for different applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this microcontroller can withstand harsh environmental conditions.

ADC Channels: YES

Having ADC channels enables the microcontroller to easily interface with analog sensors and inputs.

ROM Words: 15360

With 15360 ROM words, this microcontroller has ample memory space for program storage and data handling.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures high performance, efficiency, and fast operation.

RAM Bytes: 4096

4096 RAM bytes provide sufficient memory for data manipulation and storage during program execution.

PWM Channels: YES

PWM channels allow for precise control of analog signals, making this microcontroller suitable for applications requiring accurate modulation.

Technical Specifications

Microcontrollers MSP430FR2433IYQWT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT HAS INFORMATION FRAM OF 512 BYTES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B24

JESD-609 Code:

e1

Length:

2.34 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

16

No. of I/O Lines:

17

No. of Terminals:

24

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

4096

ROM Words:

15360

ROM Programmability:

FRAM

Maximum Seated Height:

.625 mm

Speed:

16 rpm

Maximum Supply Current:

3.48 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.29 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SCI, SPI, UART(2)

Peripherals:

BOR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430FR2433IYQWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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