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MSP430FR2310IPW20R

Texas Instruments

MSP430FR2310IPW20R by Texas Instruments

MSP430FR2310IPW20R by Texas Instruments is a 16-bit microcontroller with 2048 ROM words, 1024 RAM bytes, and 8-Ch 10-Bit ADC channels. It operates at a max clock frequency of 16 MHz and offers peripherals like PWM, RTC, and TIMER(2). Ideal for industrial applications requiring low power consumption and high-speed processing.

Median Price

$1.136

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,785 parts In-Stock

1+ parts

$1.136

100+ parts

$0.938

1k+ parts

$0.507

10k+ parts

-

7,785

$1.136

$0.938

$0.507

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 436 parts In-Stock

1+ parts

$1.079

100+ parts

-

1k+ parts

-

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436

$1.079

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Vyrian

USA . 6,466 parts In-Stock

1+ parts

-

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6,466

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,055 parts In-Stock

1+ parts

$1.022

100+ parts

-

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-

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3,055

$1.022

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Microchip USA

USA . 1,190 parts In-Stock

1+ parts

$4.490

100+ parts

$4.470

1k+ parts

$4.450

10k+ parts

$4.440

1,190

$4.490

$4.470

$4.450

$4.440

AZTECH Wire

Italy . 632 parts In-Stock

1+ parts

$17.670

100+ parts

-

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632

$17.670

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Parana Technologies

USA . 318 parts In-Stock

1+ parts

$76.793

100+ parts

-

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318

$76.793

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DigiPath Technology Company

USA . 1,517 parts In-Stock

1+ parts

$84.558

100+ parts

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1,517

$84.558

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ChromeModa Solutions

Germany . 4,382 parts In-Stock

1+ parts

$86.284

100+ parts

$70.753

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-

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4,382

$86.284

$70.753

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IDEA Electronic Components Group

UK . 967 parts In-Stock

1+ parts

$86.284

100+ parts

$81.970

1k+ parts

$77.656

10k+ parts

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967

$86.284

$81.970

$77.656

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Component Stockers USA

USA . 89,370 parts In-Stock

1+ parts

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89,370

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FR2310IPW20R microcontroller. Designed with quality and precision by a trusted manufacturer, this versatile device is perfect for a wide range of applications. From IoT devices to industrial control systems, the MSP430FR2310IPW20R offers unmatched value and performance. With its advanced features and reliable technology, this microcontroller delivers the benefits and advantages you need to take your projects to the next level. Experience the difference today and revolutionize your designs with the MSP430FR2310IPW20R.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the microcontroller.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Allows for a higher voltage input, offering flexibility in power supply options.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making this microcontroller energy-efficient.

ADC Channels: YES

The presence of Analog to Digital Converters allows for accurate conversion of analog signals to digital data.

ROM Words: 2048

With a generous amount of Read-Only Memory, this microcontroller can store a substantial amount of program data.

RAM Bytes: 1024

Ample Random Access Memory allows for efficient processing and storage of data during operation.

Peripheral IC Type: MICROCONTROLLER, RISC

The Reduced Instruction Set Computing architecture of this microcontroller provides fast and efficient processing capabilities.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high speed performance.

Connectivity: I2C, IRDA, SPI, UART

Multiple connectivity options allow for versatile communication with other devices and systems.

Technical Specifications

Microcontrollers MSP430FR2310IPW20R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

16

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

1024

ROM Words:

2048

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SPI, UART

Peripherals:

PWM, RTC, TIMER(2)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430FR2310IPW20R Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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