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MSP430FR2111IRLLT

Texas Instruments

MSP430FR2111IRLLT by Texas Instruments

MSP430FR2111IRLLT by Texas Instruments is a 16-bit microcontroller with 3840 ROM words and 1024 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption. Featuring peripherals like BOR, PWM, and RTC, it offers connectivity options such as IRDA and UART for versatile usage in various electronic systems.

Median Price

$1.459

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 54,069 parts In-Stock

1+ parts

$1.068

100+ parts

$0.882

1k+ parts

$0.477

10k+ parts

-

54,069

$1.068

$0.882

$0.477

-

Mouser Electronics

USA . 1,000 parts In-Stock

1+ parts

$1.850

100+ parts

$1.100

1k+ parts

$0.844

10k+ parts

$0.731

1,000

$1.850

$1.100

$0.844

$0.731

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,030 parts In-Stock

1+ parts

$1.015

100+ parts

-

1k+ parts

-

10k+ parts

-

1,030

$1.015

-

-

-

Vyrian

USA . 3,984 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,984

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,119 parts In-Stock

1+ parts

$0.961

100+ parts

-

1k+ parts

-

10k+ parts

-

1,119

$0.961

-

-

-

Microchip USA

USA . 1,564 parts In-Stock

1+ parts

$6.733

100+ parts

-

1k+ parts

-

10k+ parts

-

1,564

$6.733

-

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$42.120

100+ parts

$38.329

1k+ parts

$34.538

10k+ parts

-

3,000

$42.120

$38.329

$34.538

-

Parana Technologies

USA . 814 parts In-Stock

1+ parts

$57.025

100+ parts

-

1k+ parts

-

10k+ parts

-

814

$57.025

-

-

-

DigiPath Technology Company

USA . 1,285 parts In-Stock

1+ parts

$62.792

100+ parts

$57.768

1k+ parts

-

10k+ parts

-

1,285

$62.792

$57.768

-

-

ChromeModa Solutions

Germany . 5,354 parts In-Stock

1+ parts

$64.073

100+ parts

$52.540

1k+ parts

-

10k+ parts

-

5,354

$64.073

$52.540

-

-

IDEA Electronic Components Group

UK . 822 parts In-Stock

1+ parts

$64.073

100+ parts

$60.869

1k+ parts

$57.666

10k+ parts

-

822

$64.073

$60.869

$57.666

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QUARKTWIN TECHNOLOGY LTD

USA . 27,841 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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27,841

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-

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iodParts Technologies Inc.

India . 8,016 parts In-Stock

1+ parts

-

100+ parts

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8,016

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Overview

Experience the innovation and reliability of Texas Instruments with the MSP430FR2111IRLLT microcontroller. This versatile chip delivers high performance in a compact package, making it ideal for a wide range of applications. With features like low power mode, analog to digital converters, and connectivity options, this microcontroller provides exceptional value and functionality. Trust Texas Instruments for cutting-edge technology that meets your needs efficiently and effectively.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material makes the package lightweight and durable, ideal for portable applications.

ADC Channels: YES

Having analog to digital converters allows for easy interfacing with sensors and other analog devices.

ROM Words: 3840

With a large ROM capacity, this microcontroller can store complex program instructions and data efficiently.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with Reduced Instruction Set Computing (RISC) architecture ensures efficient execution of instructions for faster processing.

RAM Bytes: 1024

Ample RAM allows for efficient data processing and multitasking capabilities.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making it suitable for battery-operated devices.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of analog circuits such as motor speed and LED brightness.

Connectivity: IRDA, SCI(3), SPI, UART

Multiple connectivity options like Infrared Data Association (IRDA), Serial Communication Interface (SCI), Serial Peripheral Interface (SPI), and Universal Asynchronous Receiver-Transmitter (UART) provide versatile communication capabilities.

Technical Specifications

Microcontrollers MSP430FR2111IRLLT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

3 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

12

No. of Terminals:

24

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.13SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

ROM Words:

3840

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, SCI(3), SPI, UART

Peripherals:

BOR, COMPARATOR, POR, PWM, RTC, TIMER, WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430FR2111IRLLT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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