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MSP430FR2033IPM

Texas Instruments

MSP430FR2033IPM by Texas Instruments

MSP430FR2033IPM by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at max 16 MHz. It features 10 ADC channels, 6 timers, and peripherals like BOR and CRC. Ideal for industrial applications requiring low power consumption and connectivity via I2C, SPI, UART.

Median Price

$3.494

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 21,280 parts In-Stock

1+ parts

$2.188

100+ parts

$1.917

1k+ parts

$1.083

10k+ parts

-

21,280

$2.188

$1.917

$1.083

-

Mouser Electronics

USA . 276 parts In-Stock

1+ parts

$4.800

100+ parts

$2.460

1k+ parts

$1.790

10k+ parts

$1.730

276

$4.800

$2.460

$1.790

$1.730

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,778 parts In-Stock

1+ parts

$2.079

100+ parts

-

1k+ parts

-

10k+ parts

-

1,778

$2.079

-

-

-

Vyrian

USA . 7,793 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,793

-

-

-

-

Chip Stock

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10,549 parts In-Stock

1+ parts

$1.860

100+ parts

-

1k+ parts

-

10k+ parts

-

10,549

$1.860

-

-

-

Corphita

USA . 458 parts In-Stock

1+ parts

$1.969

100+ parts

-

1k+ parts

-

10k+ parts

-

458

$1.969

-

-

-

Component Stockers USA

USA . 8,231 parts In-Stock

1+ parts

$2.860

100+ parts

$2.110

1k+ parts

$1.180

10k+ parts

$1.180

8,231

$2.860

$2.110

$1.180

$1.180

Parana Technologies

USA . 981 parts In-Stock

1+ parts

$25.277

100+ parts

-

1k+ parts

$25.908

10k+ parts

-

981

$25.277

-

$25.908

-

DigiPath Technology Company

USA . 2,358 parts In-Stock

1+ parts

$27.833

100+ parts

$25.606

1k+ parts

-

10k+ parts

-

2,358

$27.833

$25.606

-

-

ChromeModa Solutions

Germany . 4,446 parts In-Stock

1+ parts

$28.401

100+ parts

$23.289

1k+ parts

-

10k+ parts

-

4,446

$28.401

$23.289

-

-

IDEA Electronic Components Group

UK . 760 parts In-Stock

1+ parts

$28.401

100+ parts

$26.981

1k+ parts

$25.561

10k+ parts

-

760

$28.401

$26.981

$25.561

-

Overview

Unlock the power of innovation with the MSP430FR2033IPM by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are versatile and reliable. Ideal for a wide range of applications, this microcontroller offers unparalleled value, benefits, and advantages to customers. Experience seamless connectivity, low power consumption, and high performance with the MSP430FR2033IPM, making it the perfect choice for all your project needs. Elevate your designs and bring your ideas to life with this exceptional product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the microcontroller suitable for various applications without adding too much weight.

Maximum Supply Voltage: 3.6 V

Allows for a higher input voltage, offering flexibility in power supply options for the microcontroller.

No. of Terminals: 64

The high number of terminals allows for multiple inputs and outputs, making the microcontroller versatile for connecting to various external devices.

ADC Channels: YES

Having Analog to Digital Converter (ADC) channels enables the microcontroller to convert analog signals into digital data, expanding its capabilities for sensor interfacing and data acquisition.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a Reduced Instruction Set Computing (RISC) microcontroller offers faster execution times and better performance compared to Complex Instruction Set Computing (CISC) architectures.

Connectivity: "I2C, IRDS, SPI(2), UART, USCI(2)

Multiple connectivity options like I2C, SPI, UART, etc., allow the microcontroller to interface with a wide range of external devices and communicate effectively within a system.

Low Power Mode: YES

The presence of a low power mode helps in conserving energy and extending the battery life of the device, making it suitable for portable and battery-operated applications.

Technical Specifications

Microcontrollers MSP430FR2033IPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

60

No. of Serial I/Os:

1

No. of Terminals:

64

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

15360

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

3.7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDS, SPI(2), UART, USCI(2)"

Peripherals:

"BOR, CRC, RTC, TIMER(6), WDT"

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

MSP430FR2033IPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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