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MSP430F6733AIPN

Texas Instruments

MSP430F6733AIPN by Texas Instruments

MSP430F6733AIPN by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 25 MHz. It features 3 ADC and DMA channels, suitable for industrial applications requiring low power consumption and high-speed processing. With peripherals like BOR, LCD, and RTC, it offers versatile connectivity through I2C, SPI, and UART interfaces.

Median Price

$6.517

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,082 parts In-Stock

1+ parts

$6.517

100+ parts

$5.313

1k+ parts

$3.542

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3,082

$6.517

$5.313

$3.542

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,878 parts In-Stock

1+ parts

$6.191

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4,878

$6.191

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Vyrian

USA . 7,435 parts In-Stock

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7,435

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Chip Stock

USA . 2,775 parts In-Stock

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2,775

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Distributors (Availability)

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Corphita

USA . 2,842 parts In-Stock

1+ parts

$5.865

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2,842

$5.865

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Microchip USA

USA . 1,601 parts In-Stock

1+ parts

$17.830

100+ parts

$17.580

1k+ parts

$17.450

10k+ parts

$17.320

1,601

$17.830

$17.580

$17.450

$17.320

AZTECH Wire

Italy . 752 parts In-Stock

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$18.160

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752

$18.160

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Parana Technologies

USA . 1,633 parts In-Stock

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$43.396

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1,633

$43.396

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DigiPath Technology Company

USA . 2,345 parts In-Stock

1+ parts

$47.785

100+ parts

$43.962

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2,345

$47.785

$43.962

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ChromeModa Solutions

Germany . 5,212 parts In-Stock

1+ parts

$48.760

100+ parts

$39.983

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5,212

$48.760

$39.983

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IDEA Electronic Components Group

UK . 1,099 parts In-Stock

1+ parts

$48.760

100+ parts

$46.322

1k+ parts

$43.884

10k+ parts

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1,099

$48.760

$46.322

$43.884

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Component Stockers USA

USA . 1,141 parts In-Stock

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1,141

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F6733AIPN microcontroller, a game-changer in the world of technology. This cutting-edge device offers unparalleled quality and reliability, backed by the trusted name of Texas Instruments. With a wide range of applications in various industries, this microcontroller provides customers with exceptional value, benefits, and advantages. Experience top-notch performance, efficiency, and versatility like never before with the MSP430F6733AIPN, setting the benchmark for excellence in the field of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material ensures durability and reliability of the microcontroller.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with various circuits.

CPU Family: MSP430

Being part of the MSP430 family ensures a well-established and reliable platform for development and support.

ROM Words: 65536

Large ROM capacity allows for storing a significant amount of program code and data.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing power for a wide range of applications in a compact package.

RAM Bytes: 4096

A good amount of RAM for temporary data storage and manipulation during program execution.

Analog To Digital Convertors: 3-Ch 10-Bit

Multiple ADC channels with 10-bit resolution allow for accurate analog signal conversion in various sensor interfacing applications.

Connectivity: I2C, IRDA(3), SPI(4), UART(3)

Versatile connectivity options enable easy integration with different communication protocols and peripherals.

No. of I/O Lines: 72

Abundance of I/O lines for interfacing with external devices and sensors, providing flexibility in designing complex systems.

Technical Specifications

Microcontrollers MSP430F6733AIPN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Connectivity:

I2C, IRDA(3), SPI(4), UART(3)

Peripherals:

BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

3-Ch 10-Bit

Trade Compliance

MSP430F6733AIPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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