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MSP430F6726AIPNR

Texas Instruments

MSP430F6726AIPNR by Texas Instruments

MSP430F6726AIPNR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 8192 RAM bytes, and 3 ADC channels. It operates at a max clock frequency of 25 MHz and features low power mode for industrial applications requiring high-speed processing and connectivity via I2C, IRDA, SPI, and UART interfaces.

Median Price

$4.666

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,500 parts In-Stock

1+ parts

$4.666

100+ parts

$3.804

1k+ parts

$2.536

10k+ parts

-

1,500

$4.666

$3.804

$2.536

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,856 parts In-Stock

1+ parts

$4.433

100+ parts

-

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1,856

$4.433

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$4.770

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10

$4.770

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Maritex

Poland . 1,980 parts In-Stock

1+ parts

$5.117

100+ parts

$3.195

1k+ parts

$2.593

10k+ parts

-

1,980

$5.117

$3.195

$2.593

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Vyrian

USA . 4,728 parts In-Stock

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4,728

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,203 parts In-Stock

1+ parts

$3.970

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-

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1,203

$3.970

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Corphita

USA . 3,475 parts In-Stock

1+ parts

$4.199

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3,475

$4.199

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$4.675

100+ parts

-

1k+ parts

$4.488

10k+ parts

-

50

$4.675

-

$4.488

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Continental Prestige Electronics

USA . 5,148 parts In-Stock

1+ parts

$4.770

100+ parts

-

1k+ parts

-

10k+ parts

$4.675

5,148

$4.770

-

-

$4.675

AZTECH Wire

Italy . 293 parts In-Stock

1+ parts

$20.150

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293

$20.150

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Parana Technologies

USA . 856 parts In-Stock

1+ parts

$21.595

100+ parts

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1k+ parts

$21.992

10k+ parts

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856

$21.595

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$21.992

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Microchip USA

USA . 1,081 parts In-Stock

1+ parts

$22.480

100+ parts

$22.340

1k+ parts

$22.270

10k+ parts

$22.200

1,081

$22.480

$22.340

$22.270

$22.200

DigiPath Technology Company

USA . 1,240 parts In-Stock

1+ parts

$23.779

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1,240

$23.779

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IDEA Electronic Components Group

UK . 1,300 parts In-Stock

1+ parts

$24.264

100+ parts

$23.051

1k+ parts

$21.838

10k+ parts

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1,300

$24.264

$23.051

$21.838

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ChromeModa Solutions

Germany . 464 parts In-Stock

1+ parts

$24.264

100+ parts

$19.896

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464

$24.264

$19.896

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Corohmni

South Africa . 1,121 parts In-Stock

1+ parts

$38.552

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1,121

$38.552

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Argo Parts USA

USA . 1,413 parts In-Stock

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1,413

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F6726AIPNR microcontroller, a cutting-edge solution for your electronic projects. With a reputation for quality and reliability, Texas Instruments leads the industry in microcontroller technology. Ideal for a wide range of applications, this microcontroller offers unparalleled value with low power consumption, high performance, and a diverse set of peripherals including BOR, DMA, LCD, and more. Experience seamless connectivity through I2C, IRDA, SPI, and UART interfaces. Elevate your designs with the MSP430F6726AIPNR and discover limitless possibilities in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and long-lasting performance.

Maximum Supply Voltage: 3.6 V

Support for higher voltage input allows for efficient power management and performance.

CPU Family: MSP430

Features a reliable and established CPU family known for its low power consumption and high performance.

ROM Words: 131072

Large ROM capacity for storing program data and instructions, enabling more complex applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the overall efficiency of the microcontroller.

Analog To Digital Convertors: 3-Ch 10-Bit

Multiple ADC channels with 10-bit resolution allow for accurate and precise analog to digital conversion, suitable for sensor interfacing.

Connectivity: I2C, IRDA(3), SPI(4), UART(3)

Versatile connectivity options including I2C, IRDA, SPI, and UART enable easy communication with external devices and peripherals.

Low Power Mode: YES

Support for low power mode extends battery life and reduces power consumption during idle or low activity periods.

No. of I/O Lines: 72

Abundance of I/O lines provides flexibility for interfacing with a wide range of external devices and components.

Technical Specifications

Microcontrollers MSP430F6726AIPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Connectivity:

I2C, IRDA(3), SPI(4), UART(3)

Peripherals:

BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

3-Ch 10-Bit

Trade Compliance

MSP430F6726AIPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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