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MSP430F6658IZQWT

Texas Instruments

MSP430F6658IZQWT by Texas Instruments

MSP430F6658IZQWT by Texas Instruments is a 16-bit microcontroller with 2/3.3V supplies, 113 terminals, and 32MHz clock frequency. Ideal for industrial applications, it features 16-Ch ADC, 2-Ch DAC, and peripherals like LCD and UART for efficient system integration. With a compact size of 7x7mm and advanced CMOS technology, it offers high performance in a variety of embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,231 parts In-Stock

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Digiode

USA . 1,548 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 287 parts In-Stock

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$15.755

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287

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Parana Technologies

USA . 954 parts In-Stock

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$16.976

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$17.202

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954

$16.976

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ChromeModa Solutions

Germany . 5,136 parts In-Stock

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$19.074

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$15.641

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IDEA Electronic Components Group

UK . 230 parts In-Stock

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$19.074

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$18.120

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$17.167

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230

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$17.167

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One Stop Electronics

USA . 1,380 parts In-Stock

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$21.000

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$21.000

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Microchip USA

USA . 372 parts In-Stock

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$25.760

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$25.390

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$25.210

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$25.030

372

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$25.390

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$25.030

QUARKTWIN TECHNOLOGY LTD

USA . 27,610 parts In-Stock

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Corphita

USA . 4,298 parts In-Stock

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DigiPath Technology Company

USA . 589 parts In-Stock

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$17.197

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F6658IZQWT microcontroller. Designed for exceptional performance and efficiency, this versatile device offers a wide range of applications in various industries. With cutting-edge technology and reliable manufacturing by Texas Instruments, customers can trust in the quality and value that this product delivers. Upgrade your projects with the MSP430F6658IZQWT and experience the benefits of advanced features and seamless connectivity. Elevate your designs with this top-of-the-line microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable devices.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power sources and applications.

Bit Size: 16

Offers sufficient processing power for various embedded system applications.

DAC Channels: YES

Enables the generation of analog signals for interfacing with external sensors and actuators.

ADC Channels: YES

Allows for accurate analog-to-digital conversion, essential for many control and measurement applications.

Digital To Analog Convertors: 2-Ch 12-Bit

Provides high-resolution output signals for precise control and communication.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient processing and control capabilities.

Nominal Supply Voltage: 3.3 V

Standard voltage level for compatibility with many electronic components and systems.

Connectivity: I2C(3), IRDA(3), SPI(6), UART(3), USB

Offers versatile communication options for interfacing with different devices and networks.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming and updating of firmware to adapt to changing requirements.

Technical Specifications

Microcontrollers MSP430F6658IZQWT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO HAVING 2KBYTE USB SRAM CAN BE USED AS GENERAL PURPOSE SRAM WHEN USB IS NOT IN USE

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

74

No. of Terminals:

113

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

34816

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), SPI(6), UART(3), USB

Peripherals:

COMPARATOR(12), DMA(6), LCD, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F6658IZQWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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