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MSP430F6631IZQWR

Texas Instruments

MSP430F6631IZQWR by Texas Instruments

MSP430F6631IZQWR by Texas Instruments is a 16-bit microcontroller with 32 MHz clock frequency, 16384 bytes of RAM, and 196608 ROM words. Ideal for industrial applications, it operates b/w -40 to 85 °C with supply voltage range of 2.4-3.6 V, featuring PWM channels and DMA support.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,351 parts In-Stock

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2,351

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Digiode

USA . 488 parts In-Stock

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488

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Distributors (Availability)

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AZTECH Wire

Italy . 546 parts In-Stock

1+ parts

$19.720

100+ parts

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546

$19.720

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One Stop Electronics

USA . 458 parts In-Stock

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$30.000

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458

$30.000

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Parana Technologies

USA . 2,121 parts In-Stock

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$57.404

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$57.404

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ChromeModa Solutions

Germany . 2,978 parts In-Stock

1+ parts

$64.499

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$52.889

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2,978

$64.499

$52.889

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IDEA Electronic Components Group

UK . 92 parts In-Stock

1+ parts

$64.499

100+ parts

$61.274

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$58.049

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92

$64.499

$61.274

$58.049

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Corphita

USA . 1,809 parts In-Stock

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1,809

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DigiPath Technology Company

USA . 1,462 parts In-Stock

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$58.152

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Microchip USA

USA . 464 parts In-Stock

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Overview

Unleash the power of innovation with the MSP430F6631IZQWR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and performance in the realm of Microcontrollers. This versatile product offers a wide range of applications, making it perfect for a variety of projects. With its advanced features and reliable design, the MSP430F6631IZQWR provides exceptional value, benefits, and advantages to customers looking to elevate their creations to new heights. Experience the difference with Texas Instruments and take your projects to the next level today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material makes the microcontroller suitable for various applications without adding unnecessary weight.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on a PCB, saving time and space during assembly.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage provides flexibility and compatibility with a wide range of power sources.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on the PCB, especially in applications where board space is limited.

Bit Size: 16

The 16-bit architecture allows for faster processing and handling of data, making it suitable for tasks that require higher computational power.

Power Supplies (V): 2/3.3

Supporting multiple power supply options ensures compatibility with different system requirements, offering versatility in design.

No. of Terminals: 113

Having a higher number of terminals allows for more connectivity options, enabling the microcontroller to interface with a greater number of external components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The package style with a fine pitch and thin profile allows for a compact design that saves space on the PCB, ideal for portable and small form factor devices.

Minimum Supply Voltage: 2.4 V

The lower minimum supply voltage ensures efficient operation even in low-power scenarios, making it suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes the microcontroller suitable for industrial environments where temperature fluctuations are common.

CPU Family: MSP430

Being part of the MSP430 family indicates a reliable and proven track record of performance and efficiency in microcontroller applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows for reliable operation even in harsh environmental conditions, making it suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish with Tin, Silver, and Copper provides excellent conductivity and corrosion resistance, ensuring reliable connections for long-term use.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer efficiency, allowing for faster and more streamlined operation in data-intensive applications.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and integration, making it easier to interface with other components in the system.

ROM Words: 196608

The large ROM capacity allows for storing a significant amount of program data, enabling complex algorithms and functions to be executed smoothly.

Maximum Seated Height: 1 mm

The low seated height profile makes the microcontroller suitable for compact designs where space constraints are a concern.

Width: 7 mm

The narrow width dimension allows for a space-efficient placement on the PCB, contributing to a compact and streamlined overall design.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency enables faster processing speeds, making the microcontroller suitable for applications that require real-time operation and high performance.

Maximum Time At Peak Reflow Temperature (s): 30

With a quick reflow time at peak temperature, the microcontroller can be efficiently soldered onto the PCB during manufacturing processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature tolerance ensures the microcontroller can withstand the soldering process without damage, contributing to a reliable assembly.

Length: 7 mm

The compact length dimension allows for a space-saving layout on the PCB, especially in applications where board space is limited.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates durability and reliability in harsh operating conditions, making it suitable for industrial automation and control applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller facilitates efficient and optimized processing, enhancing overall system performance and responsiveness.

RAM Bytes: 16384

The generous RAM capacity allows for efficient data storage and manipulation, supporting multitasking and complex data processing tasks effectively.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in various operating conditions.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and easy soldering during assembly, ensuring consistent performance and connectivity.

Nominal Supply Voltage: 3 V

The stable nominal supply voltage of 3V ensures consistent and reliable operation, reducing the risk of voltage fluctuations affecting performance.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of analog signals, allowing for accurate and efficient power management in various applications.

ROM Programmability: FLASH

The Flash ROM programmability feature allows for easy and quick updates to the program code, ensuring flexibility and adaptability in application development.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density mounting on the PCB, saving space and allowing for more components to be integrated into a smaller area.

Moisture Sensitivity Level (MSL): 3

The MSL of 3 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures to maintain the reliability and integrity of the microcontroller.

Speed: 20 rpm

The speed specification of 20 rpm indicates the rate at which the microcontroller can process data and execute instructions, contributing to efficient performance in various applications.

No. of I/O Lines: 74

The large number of I/O lines provides flexibility in interfacing with external devices and peripherals, allowing for versatile connectivity options in diverse applications.

Technical Specifications

Microcontrollers MSP430F6631IZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES 1.8V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

74

No. of Terminals:

113

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

MSP430F6631IZQWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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