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MSP430F6458IZQWR

Texas Instruments

MSP430F6458IZQWR by Texas Instruments

MSP430F6458IZQWR by Texas Instruments is a 16-bit microcontroller with 2/3.3V power supplies, 113 terminals, and 32MHz max clock frequency. Ideal for industrial applications requiring ADC/DAC channels, DMA support, and multiple peripherals like LCD and RTC. Operating temperature range from -40 to 85°C makes it suitable for various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,025 parts In-Stock

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Digiode

USA . 513 parts In-Stock

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513

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AZTECH Wire

Italy . 735 parts In-Stock

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$9.648

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One Stop Electronics

USA . 599 parts In-Stock

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$35.000

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Parana Technologies

USA . 1,296 parts In-Stock

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$70.800

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DigiPath Technology Company

USA . 748 parts In-Stock

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$77.959

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ChromeModa Solutions

Germany . 4,214 parts In-Stock

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$79.550

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$65.231

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IDEA Electronic Components Group

UK . 1,437 parts In-Stock

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$79.550

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$75.572

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$71.595

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Corphita

USA . 953 parts In-Stock

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Microchip USA

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Overview

Unlock a world of possibilities with the MSP430F6458IZQWR microcontroller by Texas Instruments. This reliable and versatile device offers unparalleled performance in a compact package, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers exceptional value and efficiency. Trust in Texas Instruments' reputation for quality and innovation, and revolutionize your designs with the MSP430F6458IZQWR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection to the microcontroller, making it suitable for a variety of applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle higher power applications effectively.

Bit Size: 16

The 16-bit architecture allows for higher precision and performance in data processing tasks.

DAC Channels: YES

Having DAC channels allows for precise control of analog outputs, making it suitable for applications requiring accurate analog signal generation.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the microcontroller can perform reliably in harsh environmental conditions.

CPU Family: MSP430

Being part of the MSP430 family, this microcontroller is known for its low power consumption and high performance, making it a preferred choice for energy-efficient applications.

Analog To Digital Convertors: 16-Ch 12-Bit

Having 16 channels of 12-bit ADC allows for accurate conversion of analog signals into digital data, making it suitable for applications requiring precise sensor data acquisition.

Technical Specifications

Microcontrollers MSP430F6458IZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MIN SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

74

No. of Terminals:

113

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

34816

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), SPI(6), UART(3)

Peripherals:

BOR, COMPARATOR(12), DMA(6), LCD, POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F6458IZQWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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