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MSP430F6458IPZ

Texas Instruments

MSP430F6458IPZ by Texas Instruments

MSP430F6458IPZ by Texas Instruments is a 16-bit microcontroller with 2/3.3V power supplies, 393216 ROM words, and 34 RAM words. Ideal for industrial applications, it features 8 external interrupts, 12-bit DAC channels, and low power mode for efficient operation at temperatures ranging from -40 to 85°C.

Median Price

$11.095

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 685 parts In-Stock

1+ parts

$11.095

100+ parts

$9.692

1k+ parts

$6.684

10k+ parts

-

685

$11.095

$9.692

$6.684

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,597 parts In-Stock

1+ parts

$10.540

100+ parts

-

1k+ parts

-

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2,597

$10.540

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Vyrian

USA . 3,858 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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3,858

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,334 parts In-Stock

1+ parts

$9.986

100+ parts

-

1k+ parts

-

10k+ parts

-

1,334

$9.986

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AZTECH Wire

Italy . 102 parts In-Stock

1+ parts

$12.390

100+ parts

-

1k+ parts

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10k+ parts

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102

$12.390

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Microchip USA

USA . 2,887 parts In-Stock

1+ parts

$30.810

100+ parts

$30.370

1k+ parts

$30.150

10k+ parts

$29.930

2,887

$30.810

$30.370

$30.150

$29.930

Parana Technologies

USA . 145 parts In-Stock

1+ parts

$55.867

100+ parts

-

1k+ parts

-

10k+ parts

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145

$55.867

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DigiPath Technology Company

USA . 1,615 parts In-Stock

1+ parts

$61.517

100+ parts

-

1k+ parts

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10k+ parts

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1,615

$61.517

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ChromeModa Solutions

Germany . 3,927 parts In-Stock

1+ parts

$62.772

100+ parts

$51.473

1k+ parts

-

10k+ parts

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3,927

$62.772

$51.473

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IDEA Electronic Components Group

UK . 2,090 parts In-Stock

1+ parts

$62.772

100+ parts

$59.633

1k+ parts

$56.495

10k+ parts

-

2,090

$62.772

$59.633

$56.495

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Overview

Unlock the potential of your projects with the Texas Instruments MSP430F6458IPZ microcontroller. Manufactured by a trusted industry leader, this powerful device offers unparalleled performance and reliability in a compact package. Ideal for a wide range of applications, from IoT devices to industrial control systems, this microcontroller boasts advanced features like DAC and ADC channels, low power modes, and a maximum clock frequency of 32 MHz. Experience the value and benefits of cutting-edge technology with the MSP430F6458IPZ - take your designs to the next level today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for portable devices.

Surface Mount: YES

Easy to integrate onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power supply options for flexibility in design.

Bit Size: 16

Higher bit size allows for more complex processing tasks.

DAC Channels: YES

Ability to convert digital signals to analog for various applications.

Power Supplies (V): 2/3.3

Supports multiple power supply options for different requirements.

No. of Terminals: 100

Sufficient number of terminals for connecting peripherals and external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact and low profile design for space-constrained applications.

Minimum Supply Voltage: 2.4 V

Allows for operation in low power conditions.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with wide temperature ranges.

CPU Family: MSP430

Known for low-power consumption and high efficiency, ideal for battery-operated devices.

Technical Specifications

Microcontrollers MSP430F6458IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MIN SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of I/O Lines:

74

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

0

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

34816

RAM Words:

34

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), SPI(6), UART(3)

Peripherals:

BOR, COMPARATOR(12), DMA(6), LCD, POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F6458IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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