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MSP430F6433IZQWR

Texas Instruments

MSP430F6433IZQWR by Texas Instruments

MSP430F6433IZQWR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 10240 RAM bytes. It features 16-Ch 12-Bit ADC channels, 18 timers, and connectivity options like I2C, IRDA, SCI, SPI(2), UART(2). Ideal for industrial applications requiring low power consumption and high-speed processing up to 32 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,386 parts In-Stock

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4,386

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Digiode

USA . 2,940 parts In-Stock

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2,940

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Distributors (Availability)

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One Stop Electronics

USA . 268 parts In-Stock

1+ parts

$13.000

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268

$13.000

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AZTECH Wire

Italy . 279 parts In-Stock

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$19.418

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279

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Parana Technologies

USA . 555 parts In-Stock

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$22.086

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$22.678

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555

$22.086

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$22.678

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ChromeModa Solutions

Germany . 746 parts In-Stock

1+ parts

$24.816

100+ parts

$20.349

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746

$24.816

$20.349

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IDEA Electronic Components Group

UK . 229 parts In-Stock

1+ parts

$24.816

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$23.575

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$22.334

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229

$24.816

$23.575

$22.334

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Corphita

USA . 4,086 parts In-Stock

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4,086

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DigiPath Technology Company

USA . 520 parts In-Stock

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$22.374

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Microchip USA

USA . 344 parts In-Stock

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Overview

Unleash the full potential of your projects with the Texas Instruments MSP430F6433IZQWR microcontroller. Designed with precision and quality in mind, this device offers unrivaled performance and reliability for a wide range of applications. From low power mode to integrated cache, this microcontroller packs a punch with its advanced features. Whether you're working on IoT devices, industrial automation, or consumer electronics, the MSP430F6433IZQWR provides the power and flexibility you need to bring your ideas to life. Experience the difference of Texas Instruments technology and take your projects to the next level today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for its durability and resistance to damage, making the product robust for various applications.

Integrated Cache: YES

Having an integrated cache helps in improving the overall performance of the microcontroller by reducing memory latency and increasing data access speed.

Maximum Supply Voltage: 3.6 V

With a higher maximum supply voltage, the microcontroller can handle a wider range of input voltages, making it versatile for different power supply scenarios.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and storage capabilities within the microcontroller.

No. of Terminals: 113

With a higher number of terminals, the microcontroller can support more external connections and peripherals, enhancing its functionality and usability.

Maximum Operating Temperature: 85 °C

Being able to operate at higher temperatures makes this microcontroller suitable for industrial environments where heat may be a concern.

ADC Channels: YES

The presence of Analog to Digital Converter (ADC) channels allows the microcontroller to convert analog signals into digital data, enabling it to interface with a variety of sensors and input devices.

ROM Words: 131072

With a larger ROM size, the microcontroller can store more program instructions and data, increasing its flexibility and processing capabilities.

Maximum Clock Frequency: 32 MHz

A higher maximum clock frequency means that the microcontroller can execute instructions at a faster rate, improving overall performance and responsiveness.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a Reduced Instruction Set Computing (RISC) architecture, the microcontroller can execute instructions more efficiently, leading to better performance and power efficiency.

Technical Specifications

Microcontrollers MSP430F6433IZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES MINIMUM SUPPLY 1.8 V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

4

No. of Terminals:

113

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

10240

RAM Words:

10

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI, SPI(2), UART(2)"

Peripherals:

"BOR, COMPARATOR(12), CRC, DMA(6), RTC, TIMER(18), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430F6433IZQWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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