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MSP430F5637IPZ

Texas Instruments

MSP430F5637IPZ by Texas Instruments

MSP430F5637IPZ by Texas Instruments is a 16-bit microcontroller with 196608 ROM words, 16 RAM words, and 2 DAC channels. It operates at a max clock frequency of 32 MHz and features peripherals like BOR, DMA, and LCD. Ideal for industrial applications requiring low power consumption and high-speed processing.

Median Price

$6.414

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 928 parts In-Stock

1+ parts

$5.090

100+ parts

$4.990

1k+ parts

$4.890

10k+ parts

-

928

$5.090

$4.990

$4.890

-

Texas Instruments

USA . 2,875 parts In-Stock

1+ parts

$7.737

100+ parts

$6.308

1k+ parts

$4.205

10k+ parts

-

2,875

$7.737

$6.308

$4.205

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,933 parts In-Stock

1+ parts

$7.350

100+ parts

-

1k+ parts

-

10k+ parts

-

2,933

$7.350

-

-

-

Vyrian

USA . 7,709 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,709

-

-

-

-

Bristol Electronics

USA . 90 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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90

-

-

-

-

Flip Electronics

USA . 80 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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80

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,265 parts In-Stock

1+ parts

$6.963

100+ parts

-

1k+ parts

-

10k+ parts

-

4,265

$6.963

-

-

-

AZTECH Wire

Italy . 972 parts In-Stock

1+ parts

$15.520

100+ parts

-

1k+ parts

-

10k+ parts

-

972

$15.520

-

-

-

Microchip USA

USA . 1,100 parts In-Stock

1+ parts

$21.170

100+ parts

$20.860

1k+ parts

$20.710

10k+ parts

$20.560

1,100

$21.170

$20.860

$20.710

$20.560

Parana Technologies

USA . 34 parts In-Stock

1+ parts

$54.717

100+ parts

-

1k+ parts

-

10k+ parts

-

34

$54.717

-

-

-

DigiPath Technology Company

USA . 2,371 parts In-Stock

1+ parts

$60.250

100+ parts

$55.430

1k+ parts

-

10k+ parts

-

2,371

$60.250

$55.430

-

-

ChromeModa Solutions

Germany . 2,396 parts In-Stock

1+ parts

$61.480

100+ parts

$50.414

1k+ parts

-

10k+ parts

-

2,396

$61.480

$50.414

-

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IDEA Electronic Components Group

UK . 986 parts In-Stock

1+ parts

$61.480

100+ parts

$58.406

1k+ parts

$55.332

10k+ parts

-

986

$61.480

$58.406

$55.332

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Perfect Parts

USA . 287 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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287

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F5637IPZ microcontroller. Designed with precision and expertise, this versatile device offers a wide range of applications in various industries. From its high-quality materials to advanced features like DAC and ADC channels, this microcontroller delivers exceptional performance and reliability. With low power consumption and a wide operating temperature range, the MSP430F5637IPZ provides unmatched value and benefits to customers looking for cutting-edge solutions. Elevate your projects with the superior technology of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Provides a strong power supply for the microcontroller, allowing it to handle high voltage applications effectively.

ADC Channels: YES

Allows the microcontroller to convert analog signals into digital data for processing, expanding its functionality.

DMA Channels: YES

Direct Memory Access channels enable fast data transfer between peripherals and memory, improving overall system performance.

Maximum Clock Frequency: 32 MHz

The high clock frequency allows for swift and efficient processing of data, enhancing the microcontroller's performance.

Connectivity: I2C(2), IRDA(2), SPI(4), UART(2), USB

Multiple connectivity options enable seamless integration with various devices and networks, increasing the versatility of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing a Reduced Instruction Set Computing architecture allows for faster execution of instructions, enhancing the overall speed of the microcontroller.

Technical Specifications

Microcontrollers MSP430F5637IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V SUPPLY AT 8MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), IRDA(2), SPI(4), UART(2), USB"

Peripherals:

"BOR, COMPARATOR(12), DMA(6), LCD, POR, RTC, TIMER(4), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F5637IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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