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MSP430F5526IYFFR

Texas Instruments

MSP430F5526IYFFR by Texas Instruments

MSP430F5526IYFFR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 32 MHz. Ideal for industrial applications, it features 6144 bytes of RAM, ADC and DMA channels, and flash ROM programmability.

Median Price

$3.610

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,474 parts In-Stock

1+ parts

$3.610

100+ parts

$3.540

1k+ parts

$3.470

10k+ parts

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1,474

$3.610

$3.540

$3.470

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,787 parts In-Stock

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5,787

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Digiode

USA . 1,890 parts In-Stock

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1,890

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Distributors (Availability)

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AZTECH Wire

Italy . 871 parts In-Stock

1+ parts

$13.963

100+ parts

-

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871

$13.963

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Microchip USA

USA . 460 parts In-Stock

1+ parts

$25.160

100+ parts

$25.000

1k+ parts

$24.930

10k+ parts

$24.850

460

$25.160

$25.000

$24.930

$24.850

One Stop Electronics

USA . 532 parts In-Stock

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$27.000

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532

$27.000

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Parana Technologies

USA . 796 parts In-Stock

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$74.887

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796

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DigiPath Technology Company

USA . 406 parts In-Stock

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$82.460

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406

$82.460

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ChromeModa Solutions

Germany . 2,823 parts In-Stock

1+ parts

$84.143

100+ parts

$68.997

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2,823

$84.143

$68.997

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IDEA Electronic Components Group

UK . 1,982 parts In-Stock

1+ parts

$84.143

100+ parts

$79.936

1k+ parts

$75.729

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1,982

$84.143

$79.936

$75.729

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Corphita

USA . 2,476 parts In-Stock

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Overview

Unleash the power of innovation with the MSP430F5526IYFFR microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments consistently delivers top-quality products, and this microcontroller is no exception. With its versatile applications in various industries, the MSP430F5526IYFFR offers unmatched value, benefits, and advantages to customers. Whether you're looking to enhance your IoT devices, implement smart home technology, or develop cutting-edge robotics, this microcontroller provides the reliability and performance you need to bring your ideas to life. Choose Texas Instruments for superior quality and endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount compatibility makes it easy to integrate the microcontroller onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage of 3.6V, this microcontroller can handle a wide range of power supply inputs, making it versatile for different systems.

Package Shape: SQUARE

The square package shape enables easier placement and alignment on the circuit board, ensuring efficient connectivity.

Bit Size: 16

A 16-bit architecture allows for higher processing power and performance, making the microcontroller suitable for complex tasks and applications.

Power Supplies (V): 2/3.3

Support for dual power supply voltages (2V and 3.3V) offers flexibility in designing and operating the microcontroller in different environments.

No. of Terminals: 64

With 64 terminals, this microcontroller provides ample connectivity options for interfacing with other components and peripherals.

ADC Channels: YES

Integrated ADC channels allow the microcontroller to accurately convert analog signals to digital data, enabling sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels facilitate efficient data transfer and processing, reducing the burden on the CPU and improving overall system performance.

ROM Words: 98304

A large ROM memory of 98304 words ensures sufficient storage capacity for program code and data, enabling versatile and feature-rich applications.

RAM Bytes: 6144

With 6144 bytes of RAM, the microcontroller can store and manipulate data efficiently, enabling responsive and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in various operating conditions.

PWM Channels: YES

Built-in PWM channels allow precise control of analog outputs, making the microcontroller suitable for applications requiring accurate voltage or signal modulation.

ROM Programmability: FLASH

Flash ROM programmability enables easy and quick updates to the program code, improving flexibility and adaptability for future enhancements or bug fixes.

Technical Specifications

Microcontrollers MSP430F5526IYFFR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Length:

3.76 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

47

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.76 mm

Peripheral IC Type:

Trade Compliance

MSP430F5526IYFFR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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