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MSP430F5525IPNR

Texas Instruments

MSP430F5525IPNR by Texas Instruments

MSP430F5525IPNR by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 32 MHz. It features 10-Ch 12-Bit ADCs, 4 timers, and low power mode ideal for industrial applications requiring high-speed processing and connectivity via I2C, SPI, UART, and USB interfaces.

Median Price

$7.178

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,954 parts In-Stock

1+ parts

$5.675

100+ parts

$4.626

1k+ parts

$3.084

10k+ parts

-

10,954

$5.675

$4.626

$3.084

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Mouser Electronics

USA . 528 parts In-Stock

1+ parts

$8.680

100+ parts

$7.020

1k+ parts

$5.510

10k+ parts

-

528

$8.680

$7.020

$5.510

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 69 parts In-Stock

1+ parts

$4.930

100+ parts

-

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-

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69

$4.930

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Digiode

USA . 1,148 parts In-Stock

1+ parts

$5.391

100+ parts

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1,148

$5.391

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Chip Stock

USA . 32,500 parts In-Stock

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32,500

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Vyrian

USA . 4,387 parts In-Stock

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-

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4,387

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Semtec, LLC

USA . 829 parts In-Stock

1+ parts

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829

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,451 parts In-Stock

1+ parts

$4.820

100+ parts

-

1k+ parts

-

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5,451

$4.820

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Semicontronic

India . 5,322 parts In-Stock

1+ parts

$4.820

100+ parts

$4.700

1k+ parts

$4.675

10k+ parts

-

5,322

$4.820

$4.700

$4.675

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$4.831

100+ parts

-

1k+ parts

$4.638

10k+ parts

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2,000

$4.831

-

$4.638

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Continental Prestige Electronics

USA . 4,132 parts In-Stock

1+ parts

$4.930

100+ parts

-

1k+ parts

-

10k+ parts

$4.831

4,132

$4.930

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-

$4.831

Corohmni

South Africa . 15 parts In-Stock

1+ parts

$4.930

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-

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15

$4.930

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Corphita

USA . 124 parts In-Stock

1+ parts

$5.108

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124

$5.108

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Microchip USA

USA . 1,001 parts In-Stock

1+ parts

$27.330

100+ parts

$27.160

1k+ parts

$27.080

10k+ parts

$27.000

1,001

$27.330

$27.160

$27.080

$27.000

Parana Technologies

USA . 1,818 parts In-Stock

1+ parts

$71.406

100+ parts

-

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1,818

$71.406

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DigiPath Technology Company

USA . 315 parts In-Stock

1+ parts

$78.627

100+ parts

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315

$78.627

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ChromeModa Solutions

Germany . 4,648 parts In-Stock

1+ parts

$80.232

100+ parts

$65.790

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4,648

$80.232

$65.790

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IDEA Electronic Components Group

UK . 2,322 parts In-Stock

1+ parts

$80.232

100+ parts

$76.220

1k+ parts

$72.209

10k+ parts

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2,322

$80.232

$76.220

$72.209

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Perfect Parts

USA . 15,194 parts In-Stock

1+ parts

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15,194

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Robosynatics

Brazil . 2,018 parts In-Stock

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2,018

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Lucentia Tech

USA . 2,018 parts In-Stock

1+ parts

-

100+ parts

$1.724

1k+ parts

$1.724

10k+ parts

$1.724

2,018

-

$1.724

$1.724

$1.724

Argo Parts USA

USA . 842 parts In-Stock

1+ parts

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842

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Futuretech Components

Singapore . 829 parts In-Stock

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829

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Overview

Unlock the full potential of your electronic projects with the Texas Instruments MSP430F5525IPNR microcontroller. Built with top-quality materials and cutting-edge technology, this versatile device offers unmatched performance and reliability. Whether you're working on IoT devices, consumer electronics, or industrial automation, this microcontroller provides the power and efficiency you need to bring your ideas to life. Experience seamless connectivity, low power consumption, and a wide range of peripherals that make development a breeze. Trust Texas Instruments to deliver innovation at its finest with the MSP430F5525IPNR. Elevate your projects today.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Durable material for long-lasting performance.

Surface Mount:

YES - Easy to integrate into various electronic systems.

Maximum Supply Voltage:

3.6 V - Supports a wide range of applications.

On Chip Data RAM Width:

8 - Efficient data processing capabilities.

Package Shape:

SQUARE - Space-efficient design for compact systems.

Bit Size:

16 - Suitable for handling complex computations.

Power Supplies (V):

2/3.3 - Versatile voltage options for flexibility.

No. of Terminals:

80 - Sufficient connectivity for diverse peripherals.

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH - Enhanced package design for compactness.

Minimum Supply Voltage:

2.4 V - Operates efficiently at lower power levels.

Maximum Operating Temperature:

85 °C - Can withstand high-temperature environments.

CPU Family:

MSP430 - Reliable and established brand for microcontrollers.

Minimum Operating Temperature:

40 °C - Suitable for extreme temperature conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - Corrosion-resistant finish for longevity.

ADC Channels:

YES - Allows for analog to digital conversion.

DMA Channels:

YES - Supports efficient data transfer capabilities.

Terminal Position:

QUAD - Easy to connect in a quad arrangement.

ROM Words:

65536 - Sufficient memory for storing program instructions.

Maximum Seated Height:

1.6 mm - Low profile design for space-constrained applications.

RAM Words:

4 - Quick access memory for temporary data storage.

Width:

12 mm - Compact dimensions for versatility in placement.

Boundary Scan:

YES - Facilitates debugging and testing during development.

Peripherals:

"COMPARATOR(8), RTC, TIMER(4)" - Rich set of peripherals for diverse functions.

Maximum Clock Frequency:

32 MHz - High clock speed for efficient processing.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures proper soldering during assembly.

Peak Reflow Temperature °C:

260 - Appropriate temperature for solder reflow process.

Length:

12 mm - Balanced dimensions for space optimization.

Temperature Grade:

INDUSTRIAL - Suitable for industrial-grade applications.

Peripheral IC Type:

MICROCONTROLLER, RISC - Advanced IC type for enhanced performance.

No. of Timers:

4 - Supports timing functions for various operations.

RAM Bytes:

4096 - Sufficient memory for data storage and processing.

Technology:

CMOS - Efficient semiconductor technology for power optimization.

Terminal Form:

GULL WING - Secure terminal form for reliable connections.

Analog To Digital Convertors:

10-Ch 12-Bit - High-resolution conversion for accurate data capture.

Maximum Supply Current:

11 mA - Low power consumption for energy efficiency.

Nominal Supply Voltage:

3 V - Standard voltage for compatibility with other components.

No. of DMA Channels:

3 - Multiple channels for efficient data transfer.

No. of Serial I/Os:

4 - Supports serial communication interfaces.

PWM Channels:

YES - Enables precise control of pulse-width modulation.

Connectivity:

"I2C(2), SPI(4), UART(2), USB" - Versatile connectivity options for diverse applications.

ROM Programmability:

FLASH - Easily reprogrammable memory for flexibility.

Terminal Pitch:

0.5 mm - Fine pitch for compact layout designs.

Format:

FIXED POINT - Stable format for accurate calculations.

Moisture Sensitivity Level (MSL):

3 - Suitable for moderate moisture environments.

Speed:

25 rpm - Adequate speed for processing tasks efficiently.

Low Power Mode:

YES - Energy-saving mode for extended battery life.

On Chip Program ROM Width:

8 - Efficient program storage capability.

No. of I/O Lines:

63 - Numerous I/O lines for connecting external devices.

Technical Specifications

Microcontrollers MSP430F5525IPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

63

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), SPI(4), UART(2), USB"

Peripherals:

"COMPARATOR(8), RTC, TIMER(4)"

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

MSP430F5525IPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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