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MSP430F5519IPNR

Texas Instruments

MSP430F5519IPNR by Texas Instruments

MSP430F5519IPNR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 8192 RAM bytes. It operates at a max clock frequency of 32 MHz, suitable for industrial applications requiring low power consumption. With connectivity options like I2C, SPI, UART, and USB, it offers versatile peripheral support for various embedded systems.

Median Price

$8.159

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 58,291 parts In-Stock

1+ parts

$5.255

100+ parts

$4.284

1k+ parts

$2.856

10k+ parts

-

58,291

$5.255

$4.284

$2.856

-

Arrow

USA . 215 parts In-Stock

1+ parts

$8.159

100+ parts

$4.854

1k+ parts

-

10k+ parts

-

215

$8.159

$4.854

-

-

Mouser Electronics

USA . 638 parts In-Stock

1+ parts

$9.200

100+ parts

$6.060

1k+ parts

$5.470

10k+ parts

-

638

$9.200

$6.060

$5.470

-

DigiKey

USA . 795 parts In-Stock

1+ parts

$9.360

100+ parts

$6.186

1k+ parts

$6.010

10k+ parts

-

795

$9.360

$6.186

$6.010

-

Verical

USA . 215 parts In-Stock

1+ parts

-

100+ parts

$4.854

1k+ parts

-

10k+ parts

-

215

-

$4.854

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$4.560

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$4.560

-

-

-

Digiode

USA . 542 parts In-Stock

1+ parts

$4.992

100+ parts

-

1k+ parts

-

10k+ parts

-

542

$4.992

-

-

-

Chip Stock

USA . 30,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30,800

-

-

-

-

Vyrian

USA . 19,761 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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19,761

-

-

-

-

Sensible Micro Corp

USA . 8,417 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,417

-

-

-

-

Cyclops Electronics Ltd

UK . 1,448 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,448

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 19,760 parts In-Stock

1+ parts

$4.470

100+ parts

-

1k+ parts

-

10k+ parts

-

19,760

$4.470

-

-

-

Semicontronic

India . 19,719 parts In-Stock

1+ parts

$4.470

100+ parts

$4.358

1k+ parts

$4.336

10k+ parts

-

19,719

$4.470

$4.358

$4.336

-

Continental Prestige Electronics

USA . 6,232 parts In-Stock

1+ parts

$4.560

100+ parts

-

1k+ parts

-

10k+ parts

$4.469

6,232

$4.560

-

-

$4.469

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$4.560

100+ parts

-

1k+ parts

$4.332

10k+ parts

$4.241

2,000

$4.560

-

$4.332

$4.241

Corphita

USA . 4,539 parts In-Stock

1+ parts

$4.730

100+ parts

-

1k+ parts

-

10k+ parts

-

4,539

$4.730

-

-

-

Parana Technologies

USA . 1,321 parts In-Stock

1+ parts

$44.578

100+ parts

-

1k+ parts

-

10k+ parts

-

1,321

$44.578

-

-

-

DigiPath Technology Company

USA . 925 parts In-Stock

1+ parts

$49.086

100+ parts

-

1k+ parts

-

10k+ parts

-

925

$49.086

-

-

-

ChromeModa Solutions

Germany . 5,754 parts In-Stock

1+ parts

$50.088

100+ parts

$41.072

1k+ parts

-

10k+ parts

-

5,754

$50.088

$41.072

-

-

IDEA Electronic Components Group

UK . 1,391 parts In-Stock

1+ parts

$50.088

100+ parts

$47.584

1k+ parts

$45.079

10k+ parts

-

1,391

$50.088

$47.584

$45.079

-

Corohmni

South Africa . 165 parts In-Stock

1+ parts

$84.981

100+ parts

-

1k+ parts

-

10k+ parts

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165

$84.981

-

-

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Perfect Parts

USA . 8,861 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,861

-

-

-

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Argo Parts USA

USA . 4,438 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,438

-

-

-

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A-Z Elektronik GmbH

Germany . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

-

-

-

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Robosynatics

Brazil . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

-

-

-

-

Lucentia Tech

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$9.079

1k+ parts

$9.079

10k+ parts

$9.079

500

-

$9.079

$9.079

$9.079

Overview

Unleash the power of innovation with the Texas Instruments MSP430F5519IPNR microcontroller. Crafted by a renowned manufacturer, this device offers unparalleled quality and reliability in a compact package. Ideal for a wide range of applications, this microcontroller boasts advanced features like multiple ADC channels, DMA channels, and PWM channels. With low power modes and high-speed connectivity options, the MSP430F5519IPNR delivers exceptional performance and efficiency. Elevate your projects with this cutting-edge technology that combines versatility and precision for unbeatable results.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Durable material for long-lasting performance

Surface Mount:

YES - Easy to integrate into compact designs

Maximum Supply Voltage:

3.6 V - Supports a wide range of applications

On Chip Data RAM Width:

8 - Efficient data handling capability

Package Shape:

SQUARE - Space-saving design for compact setups

Bit Size:

16 - High processing capability for complex tasks

Power Supplies (V):

2/3.3 - Flexible power options for various settings

No. of Terminals:

80 - Sufficient connectivity for peripherals

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH - Easy to mount and integrate into systems

Minimum Supply Voltage:

2.4 V - Operates efficiently at low power levels

Maximum Operating Temperature:

85 °C - Suitable for industrial environments

CPU Family:

MSP430 - Reliable and proven technology for stability

Minimum Operating Temperature:

40 °C - Works in extreme conditions

Terminal Finish:

NICKEL PALLADIUM GOLD - Ensures strong and corrosion-resistant connections

ADC Channels:

YES - Enables analog to digital conversion for sensor integration

DMA Channels:

YES - Boosts data transfer speeds for improved performance

Terminal Position:

QUAD - Easy to connect in tight spaces

ROM Words:

131072 - Large memory capacity for storing programs and data

Maximum Seated Height:

1.6 mm - Low profile design for slim devices

RAM Words:

8 - Efficient memory management for smooth operations

Width:

12 mm - Compact size for space-constrained applications

Boundary Scan:

YES - Simplifies debugging and testing processes

Peripherals:

COMPARATOR(8), RTC, TIMER(4) - Enhances functionality for diverse applications

Maximum Clock Frequency:

32 MHz - High-speed processing for quick responses

Maximum Time At Peak Reflow Temperature (s):

30 - Resists heat during soldering processes

Peak Reflow Temperature °C:

260 - Endures high temperatures during manufacturing

Length:

12 mm - Balanced dimensions for versatile installations

Temperature Grade:

INDUSTRIAL - Reliable performance in harsh environments

Peripheral IC Type:

MICROCONTROLLER, RISC - Efficient data processing for embedded systems

No. of Timers:

4 - Multi-tasking capability for time-sensitive operations

RAM Bytes:

8192 - Sufficient memory for data storage and manipulation

Technology:

CMOS - Low power consumption for energy-efficient operation

Terminal Form:

GULL WING - Secure and stable terminal connections

Maximum Supply Current:

11 mA - Low power consumption for energy efficiency

Nominal Supply Voltage:

3 V - Stable power input for consistent performance

No. of DMA Channels:

3 - Enhanced data transfer capabilities for efficiency

No. of Serial I/Os:

4 - Supports multiple external connections for expanded functionality

PWM Channels:

YES - Enables precise control of connected devices

Connectivity:

I2C(2), SPI(4), UART(2), USB - Versatile communication options for different devices

ROM Programmability:

FLASH - Allows for flexible programming of memory

Terminal Pitch:

0.5 mm - Fine pitch for compact connections

Format:

FIXED POINT - Accurate data representation for calculations

Moisture Sensitivity Level (MSL):

3 - Resistant to moisture for reliable performance

Speed:

25 rpm - Supports quick data processing and response times

Low Power Mode:

YES - Saves energy during idle periods

On Chip Program ROM Width:

8 - Efficient storage and execution of programs

No. of I/O Lines:

63 - Versatile input/output options for interfacing with external devices.

Technical Specifications

Microcontrollers MSP430F5519IPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

63

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), SPI(4), UART(2), USB"

Peripherals:

"COMPARATOR(8), RTC, TIMER(4)"

Trade Compliance

MSP430F5519IPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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