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MSP430F5501IRGZT

Texas Instruments

MSP430F5501IRGZT by Texas Instruments

MSP430F5501IRGZT by Texas Instruments is a 16-bit microcontroller with 32 MHz clock frequency, 3.6V max supply voltage, and 4096 RAM bytes. Ideal for industrial applications requiring low power consumption, it features peripherals like CRC, DMA(3), and UART for connectivity via I2C, LIN, SPI.

Median Price

$4.147

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,920 parts In-Stock

1+ parts

$3.664

100+ parts

$3.211

1k+ parts

$1.814

10k+ parts

-

5,920

$3.664

$3.211

$1.814

-

DigiKey

USA . 139 parts In-Stock

1+ parts

$4.630

100+ parts

$2.933

1k+ parts

$2.655

10k+ parts

$2.551

139

$4.630

$2.933

$2.655

$2.551

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 593 parts In-Stock

1+ parts

$3.481

100+ parts

-

1k+ parts

-

10k+ parts

-

593

$3.481

-

-

-

Vyrian

USA . 5,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,520

-

-

-

-

Cyclops Electronics Ltd

UK . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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250

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,919 parts In-Stock

1+ parts

$3.110

100+ parts

-

1k+ parts

-

10k+ parts

-

2,919

$3.110

-

-

-

Corphita

USA . 1,846 parts In-Stock

1+ parts

$3.298

100+ parts

-

1k+ parts

-

10k+ parts

-

1,846

$3.298

-

-

-

Advanced Electronics

New Zealand . 800 parts In-Stock

1+ parts

$35.920

100+ parts

$35.560

1k+ parts

$34.124

10k+ parts

-

800

$35.920

$35.560

$34.124

-

Parana Technologies

USA . 365 parts In-Stock

1+ parts

$68.538

100+ parts

-

1k+ parts

-

10k+ parts

-

365

$68.538

-

-

-

DigiPath Technology Company

USA . 2,057 parts In-Stock

1+ parts

$75.469

100+ parts

-

1k+ parts

-

10k+ parts

-

2,057

$75.469

-

-

-

ChromeModa Solutions

Germany . 1,383 parts In-Stock

1+ parts

$77.009

100+ parts

$63.147

1k+ parts

-

10k+ parts

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1,383

$77.009

$63.147

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-

IDEA Electronic Components Group

UK . 125 parts In-Stock

1+ parts

$77.009

100+ parts

$73.159

1k+ parts

$69.308

10k+ parts

-

125

$77.009

$73.159

$69.308

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Lixinc

USA . 17,658 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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17,658

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A-Z Elektronik GmbH

Germany . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,000

-

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Perfect Parts

USA . 404 parts In-Stock

1+ parts

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404

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Overview

Unlock the power of innovation with the MSP430F5501IRGZT by Texas Instruments. As a leader in microcontrollers, Texas Instruments delivers top-quality products that cater to a wide range of applications. The MSP430F5501IRGZT offers unparalleled value with its low power consumption, high performance, and versatile connectivity options. Whether you're designing IoT devices, consumer electronics, or industrial automation systems, this microcontroller is your go-to solution for seamless integration and reliable operation. Elevate your projects with the MSP430F5501IRGZT and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and resistant to damage.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power sources, providing flexibility in design and application.

ADC Channels: YES

The ability to perform analog-to-digital conversion enables the microcontroller to interface with analog sensors and devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Being based on Reduced Instruction Set Computing (RISC) architecture allows for efficient and high-performance operation of the microcontroller.

Maximum Clock Frequency: 32 MHz

Provides fast processing speed, suitable for applications that require quick response times and high computational capabilities.

Connectivity: "I2C, IRDA, LIN, SPI, UART, USCI(2)

Support for multiple communication protocols enables versatile connectivity options with other devices and systems.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the microcontroller, facilitating firmware updates and customization.

Low Power Mode: YES

The ability to operate in low power mode conserves energy and prolongs battery life in portable or energy-efficient applications.

Technical Specifications

Microcontrollers MSP430F5501IRGZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

31

No. of Serial I/Os:

4

No. of Terminals:

48

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI, UART, USCI(2)"

Peripherals:

"COMPARATOR, CRC, DMA(3),RTC, TIMER(18), WDT"

Trade Compliance

MSP430F5501IRGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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