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MSP430F5438AIZQWR

Texas Instruments

MSP430F5438AIZQWR by Texas Instruments

MSP430F5438AIZQWR by Texas Instruments is a 16-bit microcontroller with a max clock frequency of 18 MHz. It features 16-channel, 12-bit analog-to-digital converters and offers connectivity options such as I2C, IRDA, SCI, SPI, and UART. This microcontroller is commonly used in industrial applications due to its low power mode and wide temperature range.

Median Price

$72.000

Lifecycle Status

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6

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1k+

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NAC Semi

USA . 2 parts In-Stock

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Vyrian

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One Stop Electronics

USA . 1,524 parts In-Stock

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$10.000

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AZTECH Wire

Italy . 409 parts In-Stock

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Semicontronic

India . 499 parts In-Stock

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$14.625

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$14.550

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Corohmni

South Africa . 421 parts In-Stock

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$16.314

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Ampacity Inc.

Singapore . 1,204 parts In-Stock

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Advanced Electronics

New Zealand . 450 parts In-Stock

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Parana Technologies

USA . 473 parts In-Stock

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 652 parts In-Stock

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IDEA Electronic Components Group

UK . 559 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the MSP430F5438AIZQWR microcontroller. Designed with precision and attention to detail, this microcontroller offers countless advantages for a wide range of applications. With its powerful capabilities and advanced features, you can trust this microcontroller to deliver exceptional performance and efficiency. Unlock the potential of your projects with the MSP430F5438AIZQWR and enjoy the value, benefits, and advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Makes the microcontroller lightweight and durable, suitable for various applications.

Surface Mount: YES

Enables easy and efficient installation, saving time and effort in the production process.

Maximum Supply Voltage: 3.6 V

Provides a high voltage range, allowing compatibility with a wide range of power sources.

On Chip Data RAM Width: 8

Offers sufficient data storage capacity for efficient data processing and multitasking capabilities.

Package Shape: SQUARE

Provides a compact and space-saving design, ideal for integration in small electronic devices.

Bit Size: 16

Allows for optimized performance and processing capabilities, supporting complex algorithms.

Power Supplies (V): 2/3.3

Provides flexibility in power source options, allowing compatibility with various supply voltages.

No. of Terminals: 113

Offers a high number of terminals for extensive connectivity options and peripheral integration.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enables high-density packaging, maximizing component placement on a PCB and optimizing space utilization.

Minimum Supply Voltage: 2.2 V

Allows for reliable operation even with low power supply, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

Withstands high operating temperatures, ensuring reliable performance in demanding environments.

CPU Family: MSP430

Represents a highly efficient and widely supported CPU family, offering a mature ecosystem and robust development tools.

Minimum Operating Temperature: -40 °C

Operates reliably in extreme cold temperatures, making it suitable for a wide range of environments.

Terminal Finish: TIN SILVER COPPER

Provides a reliable and robust electrical connection, ensuring signal integrity and preventing corrosion.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling measurement and processing of real-world inputs.

DMA Channels: YES

Supports direct memory access, optimizing data transfer speeds between peripherals and memory.

Terminal Position: BOTTOM

Facilitates easy integration into circuit board designs, enhancing flexibility and ease of assembly.

ROM Words: 262144

Offers a large amount of read-only memory, allowing for ample storage of program instructions.

Maximum Seated Height: 1 mm

Enables the use of low-profile designs, making it suitable for compact and slim devices.

RAM Words: 16

Provides a moderate amount of random access memory, sufficient for storing temporary data during program execution.

Width: 7 mm

Compact width allows for efficient space utilization in tight design constraints.

Boundary Scan: YES

Streamlines testing and debugging processes, enhancing overall product reliability and performance.

Peripherals: BOD, CRC, DMA(3), RTC, TIMER(15), WDT

Offers a comprehensive set of peripherals, enabling advanced functionality and versatility in application designs.

Maximum Clock Frequency: 18 MHz

Runs at a high clock frequency, ensuring fast and efficient execution of program instructions.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand prolonged exposure to high reflow temperatures during manufacturing processes.

Peak Reflow Temperature °C: 260

Withstands high temperatures during solder reflow processes, allowing for reliable assembly.

Length: 7 mm

Compact length enables space-saving designs and flexibility in electronic product integration.

Temperature Grade: INDUSTRIAL

Operates reliably in industrial temperature ranges, making it suitable for harsh environments and industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Incorporates a powerful and efficient RISC-based microcontroller architecture, ensuring efficient program execution.

No. of Timers: 15

Provides a substantial number of timers for precise timing and control in various applications.

RAM Bytes: 16384

Offers a generous amount of random access memory, facilitating data storage and manipulation.

Technology: CMOS

Utilizes CMOS technology, ensuring low power consumption, high noise immunity, and improved performance.

Terminal Form: BALL

Utilizes ball terminal form, enabling reliable electrical connections and easy soldering.

Analog To Digital Convertors: 16-Ch 12-Bit

Supports 16-channel analog-to-digital conversion with 12-bit resolution, enabling accurate measurement and data acquisition.

Maximum Supply Current: 9.6 mA

Operates with a low maximum supply current, optimizing power consumption and increasing battery life.

Nominal Supply Voltage: 3 V

Provides a stable and commonly used supply voltage for compatibility with a wide range of electronic components.

No. of DMA Channels: 3

Supports up to 3 independent direct memory access channels, enhancing data transfer efficiency.

No. of Serial I/Os: 3

Offers 3 serial input/output interfaces, enabling communication with external devices and expanding connectivity options.

PWM Channels: YES

Features pulse-width modulation capability, allowing precise control of analog outputs for applications such as motor control.

Connectivity: I2C, IRDA, SCI(3), SPI, UART

Provides multiple connectivity options for seamless integration with various communication protocols and devices.

ROM Programmability: FLASH

Incorporates flash memory for flexible and non-volatile program storage, allowing easy firmware updates and reprogramming.

Terminal Pitch: 0.5 mm

Features a small terminal pitch, facilitating high-density PCB designs and offering space-saving advantages.

Format: FIXED POINT

Utilizes fixed-point format for numerical representation, enabling efficient mathematical operations and precision.

Moisture Sensitivity Level (MSL): 3

Engineered to withstand moderate exposure to moisture during handling and storage.

Speed: 25 rpm

Operates at a low rotational speed, suitable for applications requiring precise or slow mechanical movements.

Low Power Mode: YES

Offers low-power operation modes, enabling energy-saving capabilities and extending battery life.

On Chip Program ROM Width: 8

Provides ample on-chip program storage capacity, accommodating complex program instructions.

No. of I/O Lines: 87

Provides a high number of input/output lines, facilitating extensive peripheral connectivity and system integration.

Technical Specifications

Microcontrollers MSP430F5438AIZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES MINIMUM 1.8V AT 8MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

18 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

87

No. of Serial I/Os:

3

No. of Terminals:

113

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI(3), SPI, UART"

Peripherals:

"BOD, CRC, DMA(3), RTC, TIMER(15), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430F5438AIZQWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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