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MSP430F5338IZQWR

Texas Instruments

MSP430F5338IZQWR by Texas Instruments

MSP430F5338IZQWR by Texas Instruments is a 16-bit microcontroller with 262144 ROM words and 18 RAM words. It operates at a max clock frequency of 32 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With features like DMA, ADC, DAC channels, and various connectivity options (I2C, SPI, UART), it offers versatile solutions in compact form factor for embedded systems.

Median Price

$3.770

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 710 parts In-Stock

1+ parts

$3.770

100+ parts

$3.690

1k+ parts

$3.620

10k+ parts

-

710

$3.770

$3.690

$3.620

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,965 parts In-Stock

1+ parts

-

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-

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4,965

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Digiode

USA . 1,861 parts In-Stock

1+ parts

-

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-

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1,861

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Distributors (Availability)

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AZTECH Wire

Italy . 281 parts In-Stock

1+ parts

$10.821

100+ parts

-

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-

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281

$10.821

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Parana Technologies

USA . 438 parts In-Stock

1+ parts

$19.282

100+ parts

-

1k+ parts

$19.311

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438

$19.282

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$19.311

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IDEA Electronic Components Group

UK . 2,285 parts In-Stock

1+ parts

$21.665

100+ parts

$20.582

1k+ parts

$19.498

10k+ parts

-

2,285

$21.665

$20.582

$19.498

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ChromeModa Solutions

Germany . 868 parts In-Stock

1+ parts

$21.665

100+ parts

$17.765

1k+ parts

-

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868

$21.665

$17.765

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One Stop Electronics

USA . 864 parts In-Stock

1+ parts

$28.000

100+ parts

-

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864

$28.000

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Perfect Parts

USA . 3,156 parts In-Stock

1+ parts

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3,156

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A-Z Elektronik GmbH

Germany . 1,806 parts In-Stock

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1,806

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Corphita

USA . 1,743 parts In-Stock

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1,743

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Kepictronics

USA . 1,617 parts In-Stock

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1,617

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DigiPath Technology Company

USA . 136 parts In-Stock

1+ parts

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100+ parts

$19.533

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136

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$19.533

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Overview

Upgrade your projects with the Texas Instruments MSP430F5338IZQWR microcontroller. With a focus on quality and innovation, Texas Instruments delivers top-of-the-line products that set the standard in the industry. This microcontroller is versatile and reliable, making it ideal for a wide range of applications. From smart home devices to industrial automation, this product offers exceptional value, benefits, and advantages to customers looking for high performance and efficiency. Experience the difference with Texas Instruments MSP430F5338IZQWR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers due to its durability and ability to protect the internal components from damage.

Maximum Supply Voltage: 3.6 V

This allows for a wide range of input voltage tolerance, making the microcontroller versatile and able to work with different power sources.

ADC Channels: YES

Having Analog-to-Digital Converter channels allows the microcontroller to interface with analog sensors and signals, making it suitable for a variety of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a Reduced Instruction Set Computer (RISC) microcontroller ensures efficient execution of instructions, making it a high-performance choice for embedded systems.

Connectivity: I2C, IRDA, SPI(2), UART, USCI

Offering multiple communication interfaces broadens the range of peripherals and devices the microcontroller can connect to, enhancing its versatility.

ROM Programmability: FLASH

Having Flash programmable memory allows for easy updates and modifications to the program code, making the microcontroller flexible for future changes.

Low Power Mode: YES

The ability to operate in low power modes is essential for energy-efficient designs and battery-powered applications, making this microcontroller suitable for portable devices.

Technical Specifications

Microcontrollers MSP430F5338IZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

1

No. of Terminals:

113

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

18432

RAM Words:

18

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI"

Peripherals:

"BOR, COMPARATOR(12), CRC, DMA(6), RTC, TIMER(18), WDT"

Trade Compliance

MSP430F5338IZQWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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