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MSP430F5338IPZ

Texas Instruments

MSP430F5338IPZ by Texas Instruments

MSP430F5338IPZ by Texas Instruments is a 16-bit microcontroller with 262144 ROM words and 18 RAM words. It operates at a max clock frequency of 32 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. Features include 18 timers, I2C, SPI, UART connectivity, and DMA channels for efficient data transfer.

Median Price

$9.152

Lifecycle Status

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9

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1k+

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Texas Instruments

USA . 5,311 parts In-Stock

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$7.605

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$6.200

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$4.133

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$7.605

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DigiKey

USA . 229 parts In-Stock

1+ parts

$10.700

100+ parts

$7.185

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229

$10.700

$7.185

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Mouser Electronics

USA . 160 parts In-Stock

1+ parts

$10.700

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$7.180

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$6.800

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160

$10.700

$7.180

$6.800

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Arrow

USA . 90 parts In-Stock

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$5.518

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90

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Digiode

USA . 4,500 parts In-Stock

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$7.225

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$7.225

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Chip Stock

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Vyrian

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Inventory MP

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Bristol Electronics

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USA . 1,570 parts In-Stock

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$6.844

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Component Stockers USA

USA . 11 parts In-Stock

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$9.620

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Microchip USA

USA . 2,021 parts In-Stock

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$27.410

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$27.010

Parana Technologies

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DigiPath Technology Company

USA . 2,129 parts In-Stock

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$40.503

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$37.263

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ChromeModa Solutions

Germany . 1,838 parts In-Stock

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$33.891

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IDEA Electronic Components Group

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$41.330

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$39.264

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$37.197

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Perfect Parts

USA . 501 parts In-Stock

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F5338IPZ microcontroller. Designed for cutting-edge applications, this product offers unmatched quality and reliability. With a wide range of peripherals including DMA, timers, and connectivity options like I2C and UART, this microcontroller is ideal for industrial-grade projects. Experience seamless performance and low power consumption, making it a cost-effective solution for your next project. Elevate your designs with the MSP430F5338IPZ and unlock endless possibilities in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable applications.

Surface Mount: YES

Surface mount technology allows for easy PCB assembly, saving space and reducing costs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different power sources.

On Chip Data RAM Width: 8

8-bit data RAM width enables efficient processing and storage of data.

Package Shape: SQUARE

Square package shape allows for easy placement on the PCB and efficient use of space.

Bit Size: 16

16-bit architecture allows for higher precision and performance in computing tasks.

DAC Channels: YES

Digital-to-analog converter channels enable conversion of digital signals to analog outputs, essential for many applications.

Power Supplies (V): 2/3.3

Supports multiple power supply voltages, offering flexibility in design and compatibility with various power sources.

No. of Terminals: 100

100 terminals provide ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style enables compact design and efficient heat dissipation.

Minimum Supply Voltage: 2.4 V

Low minimum supply voltage allows for operation in low-power scenarios, extending battery life.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance in harsh environmental conditions.

CPU Family: MSP430

Belonging to a reputable CPU family like MSP430 ensures reliable performance and compatibility with existing software and tools.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables operation in cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

ADC Channels: YES

Analog-to-digital converter channels enable the conversion of analog signals to digital data, essential for measuring real-world signals.

DMA Channels: YES

Direct memory access channels enhance data transfer speed and efficiency, reducing the load on the CPU.

Terminal Position: QUAD

Quad terminal position offers better stability and mechanical strength during soldering and PCB assembly.

ROM Words: 262144

Large ROM capacity allows for storing a significant amount of program data, enabling complex applications to run smoothly.

Maximum Seated Height: 1.6 mm

Low maximum seated height enables the product to be used in slim and compact designs.

RAM Words: 18

18 RAM words provide sufficient temporary memory for efficient data processing and storage.

Width: 14 mm

Compact width makes the product suitable for space-constrained applications where size matters.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging during product development and production.

Peripherals: "BOR, COMPARATOR(12), CRC, DMA(6), RTC, TIMER(18), WDT

Rich set of peripherals including Brown-out Reset, 12 comparators, CRC, DMA, Real-Time Clock, 18 timers, and Watchdog Timer enhance the product's versatility and functionality.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency enables high-speed processing and performance in demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds maximum time at peak reflow temperature ensures reliable soldering without damaging the product.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance supports lead-free soldering processes for compliance with environmental regulations.

Length: 14 mm

Compact length makes the product suitable for space-constrained designs without compromising functionality.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers high performance, power efficiency, and easy programmability for a wide range of applications.

No. of Timers: 18

18 timers provide versatile timing and scheduling capabilities for different tasks and applications.

RAM Bytes: 18432

Generous RAM capacity of 18432 bytes allows for efficient data storage and processing during operation.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliability for long-term operation.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder joints and mechanical stability during PCB assembly and operation.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage of 3V ensures consistent and reliable operation of the product.

No. of DMA Channels: 6

6 DMA channels offer efficient data transfer capabilities, reducing CPU overhead and enhancing system performance.

PWM Channels: YES

Pulse-width modulation channels enable precise control of analog outputs, suitable for applications like motor control and power management.

Connectivity: "I2C, IRDA, SPI(2), UART, USCI

Multiple connectivity options including I2C, IRDA, SPI, UART, and USCI facilitate communication with various external devices and peripherals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to the program code without the need for external programming tools.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density PCB layout and efficient use of limited space.

Format: FIXED POINT

Fixed-point format simplifies mathematical operations and enhances computational efficiency in embedded applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product has moderate sensitivity to moisture during soldering, requiring standard handling procedures.

Speed: 20 rpm

Operates at a speed of 20 rpm, suitable for a wide range of applications requiring precise timing or movement control.

Low Power Mode: YES

Low power mode feature enables energy-efficient operation, extending battery life and reducing power consumption in standby or idle states.

On Chip Program ROM Width: 8

8-bit program ROM width allows for efficient storage and execution of program instructions, enhancing overall performance.

No. of I/O Lines: 74

74 I/O lines provide ample interfaces for connecting to external devices, sensors, and peripherals, making the product highly versatile.

Technical Specifications

Microcontrollers MSP430F5338IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

1

No. of Terminals:

100

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

18432

RAM Words:

18

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI"

Peripherals:

"BOR, COMPARATOR(12), CRC, DMA(6), RTC, TIMER(18), WDT"

Trade Compliance

MSP430F5338IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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