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MSP430F5310IZQE

Texas Instruments

MSP430F5310IZQE by Texas Instruments

MSP430F5310IZQE by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 32 MHz. It features 8 ADC channels, 3 DMA channels, and peripherals like BOD and RTC. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

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Digiode

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Vyrian

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AZTECH Wire

Italy . 559 parts In-Stock

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One Stop Electronics

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$22.000

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Advanced Electronics

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Parana Technologies

USA . 1,270 parts In-Stock

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DigiPath Technology Company

USA . 1,683 parts In-Stock

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ChromeModa Solutions

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IDEA Electronic Components Group

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QUARKTWIN TECHNOLOGY LTD

USA . 9,240 parts In-Stock

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Microchip USA

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Overview

Unlock the potential of your projects with the MSP430F5310IZQE microcontroller from Texas Instruments. With its cutting-edge technology and high-quality construction, this device offers unmatched reliability and performance. Ideal for a wide range of applications, this microcontroller provides seamless integration, low power consumption, and versatile connectivity options. Experience the value and benefits of Texas Instruments' expertise in microcontrollers with the MSP430F5310IZQE. Boost your project's efficiency and functionality today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package of the microcontroller durable and lightweight, ideal for various electronic applications.

Surface Mount: YES

Surface mount feature allows for easy and efficient installation on circuit boards, saving space and making assembly processes more streamlined.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can operate efficiently within standard voltage ranges, ensuring reliable performance.

On Chip Data RAM Width: 8

Having a data RAM width of 8 allows for faster data processing and storage capabilities, improving overall performance of the microcontroller.

Package Shape: SQUARE

A square package shape helps in optimizing space utilization on circuit boards, making it easier to integrate the microcontroller into compact electronic devices.

Bit Size: 16

The 16-bit architecture of this microcontroller provides enhanced computational capabilities, suitable for handling complex tasks efficiently.

Power Supplies (V): 2/3.3

Supporting power supplies of 2V and 3.3V ensures compatibility with a wide range of voltage requirements, making it versatile for different applications.

No. of Terminals: 80

Having 80 terminals allows for more connectivity options and peripheral integration, offering flexibility in designing electronic systems.

Minimum Supply Voltage: 2.4 V

A minimum supply voltage of 2.4 V ensures that the microcontroller can operate even in low power situations, enhancing power efficiency.

Maximum Operating Temperature: 85 °C

The microcontroller can operate at temperatures up to 85°C, making it suitable for industrial applications where high temperatures may be encountered.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making this microcontroller a reliable choice for energy-efficient applications.

Minimum Operating Temperature: -40 °C

Being able to operate at temperatures as low as -40°C ensures reliable performance in cold environments, making it suitable for a wide range of operating conditions.

Terminal Finish: TIN SILVER COPPER

A terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable connections for long-lasting performance.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to convert analog signals into digital data, enabling a wider range of sensor integration and data acquisition capabilities.

DMA Channels: YES

Having DMA channels enables direct memory access for efficient data transfer, reducing CPU load and improving overall system performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and assembly, making it easier to integrate the microcontroller into electronic designs.

ROM Words: 32768

With 32768 ROM words, the microcontroller can store a significant amount of program code and data, enhancing its capabilities for handling complex tasks.

Maximum Seated Height: 1 mm

A maximum seated height of 1 mm allows for a slim profile, ideal for applications where space constraints are a concern.

RAM Words: 6

Although with a limited amount of RAM words, the microcontroller can still efficiently process and store temporary data for various functions.

Width: 5 mm

With a width of 5 mm, the microcontroller is compact and space-saving, suitable for applications where size is a critical factor.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging processes, offering enhanced reliability and ease of maintenance for electronic systems.

Peripherals: BOD, COMPARATOR(16), CRC, DMA(3), RTC, TIMER(18), WDT

The microcontroller comes equipped with various peripherals including timers, watchdog timers, and DMA controllers, enhancing its versatility for different applications.

Maximum Clock Frequency: 32 MHz

Operating at a maximum clock frequency of 32 MHz allows the microcontroller to execute instructions quickly, making it suitable for demanding real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during assembly processes.

Peak Reflow Temperature °C: 260

The microcontroller can endure peak reflow temperatures of 260°C, making it suitable for lead-free soldering processes and high-temperature environments.

Length: 5 mm

With a length of 5 mm, the microcontroller is compact and can be easily integrated into electronic devices with limited space availability.

Temperature Grade: INDUSTRIAL

The microcontroller is designed for industrial temperature range operations, ensuring reliable performance in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high performance and power-efficient operation, making it suitable for a wide range of embedded applications.

No. of Timers: 18

Having 18 timers provides extensive timing and scheduling capabilities, enabling precise control and synchronization of various functions within the microcontroller.

RAM Bytes: 6144

With 6144 bytes of RAM, the microcontroller can efficiently handle data storage and processing for a variety of tasks, ensuring smooth operation of applications.

Technology: BIPOLAR

Utilizing bipolar technology offers high-speed operation and precise control, making the microcontroller suitable for applications requiring fast response times and accurate data processing.

Terminal Form: BALL

The ball terminal form provides secure connections and facilitates soldering, ensuring high reliability and robustness in electronic systems utilizing the microcontroller.

Analog To Digital Convertors: 8-Ch 10-Bit

Featuring 8-channel 10-bit ADCs allows the microcontroller to efficiently convert analog signals into digital data, enabling a wide range of sensor integration and measurement capabilities.

Maximum Supply Current: 6.5 mA

Consuming a maximum supply current of 6.5 mA ensures energy efficiency, making the microcontroller suitable for battery-powered or low-power applications where power consumption is critical.

Nominal Supply Voltage: 3 V

With a nominal supply voltage of 3 V, the microcontroller operates efficiently within standard voltage ranges, providing reliable performance for various electronic applications.

No. of DMA Channels: 3

Having 3 DMA channels enables efficient data transfer and processing, reducing CPU overhead and enhancing overall system performance for demanding applications.

No. of Serial I/Os: 4

Featuring 4 serial I/Os allows for communication with external devices and peripherals, enhancing connectivity options and expanding the functionality of the microcontroller.

PWM Channels: YES

The presence of PWM channels enables precise control of analog outputs, making the microcontroller suitable for applications requiring accurate modulation and signal generation.

Connectivity: I2C, IRDA, SCI, SPI(2), UART(2)

Supporting multiple communication interfaces including I2C, IRDA, SCI, SPI, and UART allows for seamless connectivity with external devices and peripherals, enhancing versatility in system integration.

ROM Programmability: FLASH

Being programmable with FLASH memory allows for easy and efficient program updates and customization, making the microcontroller flexible for different application requirements.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, the microcontroller is suitable for high-density mounting configurations, optimizing PCB layout and integration in compact electronic devices.

Technical Specifications

Microcontrollers MSP430F5310IZQE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

18

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

6

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI, SPI(2), UART(2)"

Peripherals:

"BOD, COMPARATOR(16), CRC, DMA(3), RTC, TIMER(18), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F5310IZQE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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