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MSP430F5309IRGZR

Texas Instruments

MSP430F5309IRGZR by Texas Instruments

MSP430F5309IRGZR by Texas Instruments is a 16-bit microcontroller with 3.6V max supply voltage, 32MHz clock frequency, and 18 timers. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities. Features include 8-Ch ADC, 3 DMA channels, and various connectivity options like I2C, SPI, UART.

Median Price

$1.880

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,422 parts In-Stock

1+ parts

$1.570

100+ parts

$1.540

1k+ parts

$1.510

10k+ parts

-

1,422

$1.570

$1.540

$1.510

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Texas Instruments

USA . 35,000 parts In-Stock

1+ parts

$2.842

100+ parts

$2.490

1k+ parts

$1.407

10k+ parts

-

35,000

$2.842

$2.490

$1.407

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Chip1Stop

Japan . 2,500 parts In-Stock

1+ parts

-

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$1.880

2,500

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$1.880

Distributors (In-Stock)

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Digiode

USA . 381 parts In-Stock

1+ parts

$2.700

100+ parts

-

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381

$2.700

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Vyrian

USA . 8,013 parts In-Stock

1+ parts

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8,013

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Classic Components Corporation

USA . 323 parts In-Stock

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323

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Prism Electronics

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Corphita

USA . 1,944 parts In-Stock

1+ parts

$2.558

100+ parts

-

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1,944

$2.558

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Ampacity Inc.

Singapore . 18,292 parts In-Stock

1+ parts

$3.480

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18,292

$3.480

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AZTECH Wire

Italy . 1,134 parts In-Stock

1+ parts

$8.100

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1,134

$8.100

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Parana Technologies

USA . 2,111 parts In-Stock

1+ parts

$37.506

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2,111

$37.506

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ChromeModa Solutions

Germany . 374 parts In-Stock

1+ parts

$42.142

100+ parts

$34.556

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374

$42.142

$34.556

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IDEA Electronic Components Group

UK . 245 parts In-Stock

1+ parts

$42.142

100+ parts

$40.035

1k+ parts

$37.928

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245

$42.142

$40.035

$37.928

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QUARKTWIN TECHNOLOGY LTD

USA . 11,130 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,455 parts In-Stock

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7,455

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Component Stockers USA

USA . 6,784 parts In-Stock

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6,784

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Perfect Parts

USA . 6,577 parts In-Stock

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6,577

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DigiPath Technology Company

USA . 1,614 parts In-Stock

1+ parts

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$37.995

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1,614

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$37.995

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Overview

Discover the unparalleled performance and reliability of the Texas Instruments MSP430F5309IRGZR microcontroller. Designed with cutting-edge technology and precision engineering, this powerful device offers a wide range of applications in various industries. From IoT devices to automotive systems, this microcontroller delivers exceptional value and efficiency to customers. Trust in the quality and expertise of Texas Instruments to provide you with the innovative solutions you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for more flexibility in power supply options and compatibility with different systems.

On Chip Data RAM Width: 16

Having a wider data RAM width allows for faster data processing and storage capabilities.

Package Shape: SQUARE

Square package shape helps in efficient use of space and easy integration into circuit designs.

Power Supplies (V): 2/3.3

Multiple power supply options enable compatibility with different voltage requirements of various components in a system.

No. of Terminals: 48

Higher number of terminals provide more I/O options and connectivity for interfacing with external devices.

Maximum Clock Frequency: 32 MHz

Higher clock frequency allows for faster processing speeds, making the microcontroller suitable for applications requiring high performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient performance and lower power consumption, making it ideal for battery-powered devices.

Analog To Digital Convertors: 8-Ch 10-Bit

Multiple ADC channels with 10-bit resolution enable accurate analog signal conversion, essential for sensor interfacing and data acquisition.

Connectivity: I2C(2), IRDA(2), LIN(2), SPI(4), UART

Various communication interfaces allow for easy integration with other devices and systems, enhancing overall functionality.

Technical Specifications

Microcontrollers MSP430F5309IRGZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

4

No. of Terminals:

48

No. of Timers:

18

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

3072

ROM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(4), UART

Peripherals:

BOD, CRC, COMPARATOR(4), DMA(3), PWM, RTC, TIMER(18), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F5309IRGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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