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MSP430F5308IZQE

Texas Instruments

MSP430F5308IZQE by Texas Instruments

MSP430F5308IZQE by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 32 MHz. It features 8 ADC channels, 3 DMA channels, and low power mode. Ideal for industrial applications requiring high-speed processing and multiple I/O lines.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,675 parts In-Stock

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7,675

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Digiode

USA . 554 parts In-Stock

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554

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Distributors (Availability)

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Parana Technologies

USA . 1,058 parts In-Stock

1+ parts

$13.238

100+ parts

-

1k+ parts

$13.742

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1,058

$13.238

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$13.742

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DigiPath Technology Company

USA . 163 parts In-Stock

1+ parts

$14.577

100+ parts

$13.410

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163

$14.577

$13.410

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ChromeModa Solutions

Germany . 5,889 parts In-Stock

1+ parts

$14.874

100+ parts

$12.197

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5,889

$14.874

$12.197

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IDEA Electronic Components Group

UK . 1,088 parts In-Stock

1+ parts

$14.874

100+ parts

$14.130

1k+ parts

$13.387

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1,088

$14.874

$14.130

$13.387

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AZTECH Wire

Italy . 672 parts In-Stock

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$16.760

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672

$16.760

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One Stop Electronics

USA . 1,312 parts In-Stock

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$29.000

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1,312

$29.000

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Corphita

USA . 754 parts In-Stock

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754

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Microchip USA

USA . 456 parts In-Stock

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Overview

Unlock the endless possibilities of advanced technology with the Texas Instruments MSP430F5308IZQE microcontroller. Crafted with precision and expertise, this device offers unparalleled performance and reliability in a compact package. Ideal for a wide range of applications, from industrial automation to consumer electronics, this microcontroller provides unmatched value and efficiency to customers seeking cutting-edge solutions. Trust Texas Instruments to deliver quality products that meet and exceed your expectations. Elevate your projects with the MSP430F5308IZQE and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product suitable for various applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle higher power tasks efficiently.

Bit Size: 16

A larger bit size of 16 allows for complex computations and improved performance.

Maximum Clock Frequency: 32 MHz

A high maximum clock frequency of 32 MHz ensures fast processing speed for time-sensitive applications.

ADC Channels: YES

Having Analog to Digital Converter (ADC) channels enables accurate conversion of analog signals to digital data for precise measurements.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a Reduced Instruction Set Computing (RISC) microcontroller, it can execute instructions quickly and efficiently.

ROM Programmability: FLASH

The ROM programmability using FLASH technology allows for easy and quick updates to the program memory.

Low Power Mode: YES

The availability of a low power mode helps in conserving energy and extending battery life.

Technical Specifications

Microcontrollers MSP430F5308IZQE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

18

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

6

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI, SPI(2), UART(2)"

Peripherals:

"BOD, COMPARATOR(16), CRC, DMA(3), RTC, TIMER(18), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F5308IZQE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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