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MSP430F5257IZQE

Texas Instruments

MSP430F5257IZQE by Texas Instruments

MSP430F5257IZQE by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 16384 RAM bytes. It features 12-Ch 10-Bit ADC channels, 3 DMA channels, and peripherals like RTC and WDT. Ideal for industrial applications requiring a max clock frequency of 32 MHz at temperatures ranging from -40 to 85 °C.

Median Price

$2.488

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,440 parts In-Stock

1+ parts

-

100+ parts

$2.350

1k+ parts

$2.100

10k+ parts

$1.980

1,440

-

$2.350

$2.100

$1.980

Verical

USA . 1,440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.625

10k+ parts

$2.475

1,440

-

-

$2.625

$2.475

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,898 parts In-Stock

1+ parts

$2.480

100+ parts

-

1k+ parts

-

10k+ parts

-

4,898

$2.480

-

-

-

Vyrian

USA . 3,005 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,005

-

-

-

-

DigiKey Marketplace

USA . 1,440 parts In-Stock

1+ parts

-

100+ parts

$2.710

1k+ parts

-

10k+ parts

-

1,440

-

$2.710

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,006 parts In-Stock

1+ parts

$2.349

100+ parts

-

1k+ parts

-

10k+ parts

-

3,006

$2.349

-

-

-

Parana Technologies

USA . 1,181 parts In-Stock

1+ parts

$24.277

100+ parts

-

1k+ parts

$24.937

10k+ parts

-

1,181

$24.277

-

$24.937

-

DigiPath Technology Company

USA . 875 parts In-Stock

1+ parts

$26.732

100+ parts

-

1k+ parts

-

10k+ parts

-

875

$26.732

-

-

-

ChromeModa Solutions

Germany . 2,241 parts In-Stock

1+ parts

$27.278

100+ parts

$22.368

1k+ parts

-

10k+ parts

-

2,241

$27.278

$22.368

-

-

IDEA Electronic Components Group

UK . 423 parts In-Stock

1+ parts

$27.278

100+ parts

$25.914

1k+ parts

$24.550

10k+ parts

-

423

$27.278

$25.914

$24.550

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Microchip USA

USA . 379 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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379

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Overview

Unlock endless possibilities with the MSP430F5257IZQE by Texas Instruments, a high-quality microcontroller designed to exceed your expectations. With a renowned track record of excellence, Texas Instruments delivers cutting-edge technology that empowers innovation in a variety of applications. From industrial automation to consumer electronics, this versatile microcontroller offers unparalleled value, efficiency, and reliability. Experience seamless connectivity, powerful performance, and exceptional functionality with the MSP430F5257IZQE. Elevate your projects to new heights with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options, accommodating different voltage requirements of peripheral components.

Package Shape: SQUARE

Square package shape optimizes space utilization on the PCB, making it ideal for compact and size-constrained designs.

Bit Size: 16

16-bit architecture provides higher processing capabilities and performance compared to lower bit architectures, enabling faster and more complex operations.

No. of Terminals: 80

Higher number of terminals allow for more connectivity options and peripherals to be integrated with the microcontroller, expanding its functionality.

Minimum Supply Voltage: 2.4 V

Lower minimum supply voltage ensures efficient power consumption and operation at lower voltage levels, enhancing energy efficiency of the product.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliability and performance in harsh environmental conditions, suitable for industrial applications.

CPU Family: MSP430

MSP430 CPU family is known for its low-power consumption and high performance, making it an excellent choice for battery-operated devices and IoT applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows the microcontroller to function reliably in extreme cold conditions, extending its applicability in various environments.

Terminal Finish: TIN SILVER COPPER

Terminal finish with TIN SILVER COPPER provides excellent conductivity and corrosion resistance, ensuring reliable connections and longevity of the product.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, facilitating sensor interfacing and data acquisition in applications requiring analog inputs.

DMA Channels: YES

Integrated DMA channels enhance data transfer efficiency and reduce CPU overhead, improving overall system performance and response time.

RAM Words: 16

Sufficient RAM capacity of 16 words enables temporary data storage and quick access during execution, enhancing computational speed and efficiency.

Peripherals: COMPARATOR(3), DMA(3), RTC, TIMER(5), WDT

Rich set of peripherals such as comparators, DMA controllers, timers, and watchdog timers provide versatile functionality and support for various system requirements and tasks.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency of 32 MHz enables fast data processing and real-time operation, suitable for applications demanding high-speed performance.

ROM Words: 131072

Large ROM capacity of 131072 words accommodates program storage and firmware updates, allowing for complex algorithms and code to be implemented in the microcontroller.

Width: 5 mm

Compact width of 5 mm enables efficient board layout and space-saving design, ideal for applications with size constraints and compact form factors.

Connectivity: USCI(8)

Multiple USCI interfaces with 8 channels provide diverse communication options and connectivity capabilities, supporting a wide range of interface protocols and peripherals.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 ensures proper handling and storage requirements to prevent moisture-related damage during manufacturing and assembly processes.

Technical Specifications

Microcontrollers MSP430F5257IZQE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

54

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USCI(8)

Peripherals:

COMPARATOR(3), DMA(3), RTC, TIMER(5), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F5257IZQE Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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