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MSP430F5227IYFFR

Texas Instruments

MSP430F5227IYFFR by Texas Instruments

MSP430F5227IYFFR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 32 MHz. It features 8192 bytes of RAM, ADC and DMA channels, suitable for industrial applications requiring low power consumption and high performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,628 parts In-Stock

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Digiode

USA . 307 parts In-Stock

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307

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One Stop Electronics

USA . 452 parts In-Stock

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$9.000

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452

$9.000

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AZTECH Wire

Italy . 333 parts In-Stock

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$17.341

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Parana Technologies

USA . 356 parts In-Stock

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$51.898

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DigiPath Technology Company

USA . 1,640 parts In-Stock

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$57.146

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IDEA Electronic Components Group

UK . 2,003 parts In-Stock

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$58.312

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$55.396

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$52.481

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2,003

$58.312

$55.396

$52.481

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ChromeModa Solutions

Germany . 1,462 parts In-Stock

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$58.312

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$47.816

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Component Stockers USA

USA . 781 parts In-Stock

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$99.990

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Corphita

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Microchip USA

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F5227IYFFR microcontroller, a cutting-edge solution that offers unmatched quality and reliability. Manufactured by a trusted industry leader, this versatile device is ideal for a wide range of applications in various industries. Experience seamless performance, low power consumption, and exceptional functionality with this advanced microcontroller. Elevate your projects and designs with the value, benefits, and advantages that the MSP430F5227IYFFR brings to the table, making it the ultimate choice for your next groundbreaking innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and provides good protection for the components inside the package.

Surface Mount: YES

Surface mount technology allows for high-density mounting of components, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Can operate efficiently within a wide range of supply voltages, providing flexibility in different applications.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to design and integrate into circuit boards.

Bit Size: 16

Efficiently handles data processing tasks with a 16-bit architecture.

Power Supplies (V): 2/3.3

Supports multiple power supply options, enabling compatibility with different power sources.

No. of Terminals: 64

Sufficient number of terminals for connecting to external components and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array style with thin profile and fine pitch helps in achieving high density and miniaturization.

Minimum Supply Voltage: 2.4 V

Can operate at low supply voltages, conserving power and extending battery life.

Maximum Operating Temperature: 85 °C

Capable of operating reliably in high temperature environments.

CPU Family: MSP430

Part of a well-known and established CPU family with a reputation for reliability and performance.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold temperatures, suitable for a wide range of environments.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and ensures long-term reliability of the terminals.

ADC Channels: YES

Built-in analog-to-digital converter channels for interfacing with analog sensors and signals.

DMA Channels: YES

Direct Memory Access channels for efficient data transfer and multitasking capabilities.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and assembly onto the circuit board.

ROM Words: 65536

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 0.625 mm

Low profile design for space-constrained applications.

Width: 3.415 mm

Compact width for efficient board layout and space utilization.

Maximum Clock Frequency: 32 MHz

High clock frequency for fast processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for extended periods during soldering.

Peak Reflow Temperature °C: 260

Capable of withstanding high-temperature reflow processes during assembly.

Length: 3.535 mm

Optimal length for compact and efficient board design.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with Reduced Instruction Set Computing architecture for efficient processing.

RAM Bytes: 8192

Sufficient RAM capacity for storing and processing data during operation.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology for low power consumption and high-speed operation.

Terminal Form: BALL

Ball terminal form for easy soldering and strong mechanical connections.

Maximum Supply Current: 11 mA

Low supply current for energy-efficient operation.

Nominal Supply Voltage: 3 V

Stable and standardized supply voltage for reliable performance.

PWM Channels: YES

Pulse-Width Modulation channels for precise control of analog signals.

ROM Programmability: FLASH

Flash ROM programmability for easy firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting and space-saving designs.

Speed: 25 rpm

Efficient processing speed for quick response and execution of tasks.

No. of I/O Lines: 53

Sufficient number of input/output lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers MSP430F5227IYFFR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V AT 8MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B64

JESD-609 Code:

e1

Length:

3.535 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

53

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.415 mm

Peripheral IC Type:

Trade Compliance

MSP430F5227IYFFR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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