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MSP430F5171IYFFR

Texas Instruments

MSP430F5171IYFFR by Texas Instruments

MSP430F5171IYFFR by Texas Instruments is a 16-bit microcontroller with 32 MHz clock frequency, 2048 bytes RAM, and 32768 ROM words. Ideal for industrial applications, it features I2C, SPI, UART connectivity and low power mode for energy efficiency. With ADC and DMA channels, this CMOS technology-based MCU offers high performance in a compact package.

Median Price

$3.054

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,950 parts In-Stock

1+ parts

$3.054

100+ parts

$2.676

1k+ parts

$1.512

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5,950

$3.054

$2.676

$1.512

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,495 parts In-Stock

1+ parts

$2.901

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3,495

$2.901

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Vyrian

USA . 8,974 parts In-Stock

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8,974

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Distributors (Availability)

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Ampacity Inc.

Singapore . 5,508 parts In-Stock

1+ parts

$2.600

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-

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5,508

$2.600

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Semicontronic

India . 5,475 parts In-Stock

1+ parts

$2.600

100+ parts

$2.535

1k+ parts

$2.522

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5,475

$2.600

$2.535

$2.522

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Corphita

USA . 1,130 parts In-Stock

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$2.749

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1,130

$2.749

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Corohmni

South Africa . 407 parts In-Stock

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$3.054

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407

$3.054

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Microchip USA

USA . 5,072 parts In-Stock

1+ parts

$13.759

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5,072

$13.759

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AZTECH Wire

Italy . 293 parts In-Stock

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$15.540

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293

$15.540

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Parana Technologies

USA . 1,499 parts In-Stock

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$42.582

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$42.582

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DigiPath Technology Company

USA . 1,046 parts In-Stock

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$46.888

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1,046

$46.888

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ChromeModa Solutions

Germany . 1,886 parts In-Stock

1+ parts

$47.845

100+ parts

$39.233

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1,886

$47.845

$39.233

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IDEA Electronic Components Group

UK . 692 parts In-Stock

1+ parts

$47.845

100+ parts

$45.453

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$43.060

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692

$47.845

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$43.060

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Overview

Discover the Texas Instruments MSP430F5171IYFFR microcontroller, a versatile solution for your project needs. With its high-quality manufacturing and wide range of applications, this microcontroller offers unmatched value and benefits to customers. From low power mode to on chip program ROM width, this product delivers exceptional performance and reliability. Trust in Texas Instruments for cutting-edge technology that pushes boundaries and drives innovation in the industry. Elevate your designs with the MSP430F5171IYFFR and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a variety of applications.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for flexibility in power sources and compatibility with a wider range of systems.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making this microcontroller suitable for energy-efficient applications.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, expanding its capabilities.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of this microcontroller ensures efficient data processing and execution, enhancing the overall performance of the device.

Maximum Clock Frequency: 32 MHz

High clock frequency allows for fast data processing and real-time operation, making this microcontroller suitable for time-sensitive applications.

RAM Bytes: 2048

A larger RAM size enables the microcontroller to store and manipulate more data simultaneously, enhancing its ability to handle complex tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable in various environments.

Technical Specifications

Microcontrollers MSP430F5171IYFFR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

R-PBGA-B40

JESD-609 Code:

e1

Length:

3.06 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

3

No. of I/O Lines:

31

No. of Terminals:

40

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA40,6X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

25 rpm

Maximum Supply Current:

6.15 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.76 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(16), CRC, DMA(3), POR, PWM, TIMER(2), WDT

Trade Compliance

MSP430F5171IYFFR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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