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MSP430F5132IYFFR

Texas Instruments

MSP430F5132IYFFR by Texas Instruments

MSP430F5132IYFFR by Texas Instruments is a 16-bit microcontroller with 40 terminals, operating at up to 32 MHz. It features 9 ADC channels, 3 DMA channels, and peripherals like BOR and PWM. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$2.036

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,950 parts In-Stock

1+ parts

$2.036

100+ parts

$1.784

1k+ parts

$1.008

10k+ parts

-

5,950

$2.036

$1.784

$1.008

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,438 parts In-Stock

1+ parts

$1.934

100+ parts

-

1k+ parts

-

10k+ parts

-

1,438

$1.934

-

-

-

Vyrian

USA . 3,780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,780

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,871 parts In-Stock

1+ parts

$1.832

100+ parts

-

1k+ parts

-

10k+ parts

-

2,871

$1.832

-

-

-

Microchip USA

USA . 5,107 parts In-Stock

1+ parts

$9.173

100+ parts

-

1k+ parts

-

10k+ parts

-

5,107

$9.173

-

-

-

AZTECH Wire

Italy . 418 parts In-Stock

1+ parts

$16.560

100+ parts

-

1k+ parts

-

10k+ parts

-

418

$16.560

-

-

-

Parana Technologies

USA . 215 parts In-Stock

1+ parts

$66.344

100+ parts

$6,161.062

1k+ parts

$59.710

10k+ parts

-

215

$66.344

$6,161.062

$59.710

-

DigiPath Technology Company

USA . 1,107 parts In-Stock

1+ parts

$73.053

100+ parts

-

1k+ parts

-

10k+ parts

-

1,107

$73.053

-

-

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ChromeModa Solutions

Germany . 1,578 parts In-Stock

1+ parts

$74.544

100+ parts

$61.126

1k+ parts

-

10k+ parts

-

1,578

$74.544

$61.126

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-

IDEA Electronic Components Group

UK . 381 parts In-Stock

1+ parts

$74.544

100+ parts

$70.817

1k+ parts

$67.090

10k+ parts

-

381

$74.544

$70.817

$67.090

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Overview

Unlock endless possibilities with the MSP430F5132IYFFR microcontroller from Texas Instruments. Built with precision and expertise, this powerful device offers unparalleled performance and reliability. Ideal for a wide range of applications, this microcontroller provides exceptional value by delivering high-quality results, advanced features, and innovative solutions to meet your specific needs. Trust Texas Instruments to bring you cutting-edge technology that empowers your projects and takes your creations to the next level. Experience excellence with the MSP430F5132IYFFR microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a variety of applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of systems.

Bit Size: 16

Provides sufficient processing power for a variety of tasks and applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enables compact design and efficient use of space, ideal for small devices and systems.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient data processing and control, enhancing overall performance.

Speed: 25 rpm

Offers high-speed operation for quick response times and efficient task execution.

Technical Specifications

Microcontrollers MSP430F5132IYFFR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

R-PBGA-B40

JESD-609 Code:

e1

Length:

3.06 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

3

No. of I/O Lines:

31

No. of Terminals:

40

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA40,6X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

25 rpm

Maximum Supply Current:

6.15 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.76 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(16), CRC, DMA(3), POR, PWM, TIMER(2), WDT

Analog To Digital Convertors:

9-Ch 10-Bit

Trade Compliance

MSP430F5132IYFFR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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