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MSP430F5132IDA

Texas Instruments

MSP430F5132IDA by Texas Instruments

MSP430F5132IDA by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 8192 ROM words. It operates at a max frequency of 25 MHz, offering 9 ADC channels and 3 DMA channels for industrial applications requiring low power consumption. The package style is small outline, thin profile, shrink pitch with a terminal pitch of 0.65 mm.

Median Price

$2.987

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,977 parts In-Stock

1+ parts

$1.330

100+ parts

$1.300

1k+ parts

$1.280

10k+ parts

-

2,977

$1.330

$1.300

$1.280

-

Texas Instruments

USA . 2,595 parts In-Stock

1+ parts

$2.444

100+ parts

$2.142

1k+ parts

$1.210

10k+ parts

-

2,595

$2.444

$2.142

$1.210

-

Mouser Electronics

USA . 365 parts In-Stock

1+ parts

$3.530

100+ parts

$2.350

1k+ parts

$2.030

10k+ parts

$1.920

365

$3.530

$2.350

$2.030

$1.920

DigiKey

USA . 164 parts In-Stock

1+ parts

$3.530

100+ parts

$2.350

1k+ parts

$2.176

10k+ parts

-

164

$3.530

$2.350

$2.176

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.779

100+ parts

-

1k+ parts

-

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10

$1.779

-

-

-

Digiode

USA . 3,201 parts In-Stock

1+ parts

$2.322

100+ parts

-

1k+ parts

-

10k+ parts

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3,201

$2.322

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-

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Vyrian

USA . 5,609 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,609

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.779

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$1.779

-

-

-

Ampacity Inc.

Singapore . 908 parts In-Stock

1+ parts

$2.080

100+ parts

-

1k+ parts

-

10k+ parts

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908

$2.080

-

-

-

Corphita

USA . 3,566 parts In-Stock

1+ parts

$2.200

100+ parts

-

1k+ parts

-

10k+ parts

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3,566

$2.200

-

-

-

Parana Technologies

USA . 944 parts In-Stock

1+ parts

$45.656

100+ parts

-

1k+ parts

-

10k+ parts

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944

$45.656

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-

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DigiPath Technology Company

USA . 1,574 parts In-Stock

1+ parts

$50.273

100+ parts

$46.251

1k+ parts

-

10k+ parts

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1,574

$50.273

$46.251

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IDEA Electronic Components Group

UK . 650 parts In-Stock

1+ parts

$51.299

100+ parts

$48.734

1k+ parts

$46.169

10k+ parts

-

650

$51.299

$48.734

$46.169

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ChromeModa Solutions

Germany . 519 parts In-Stock

1+ parts

$51.299

100+ parts

$42.065

1k+ parts

-

10k+ parts

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519

$51.299

$42.065

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QUARKTWIN TECHNOLOGY LTD

USA . 6,061 parts In-Stock

1+ parts

-

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1k+ parts

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6,061

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Perfect Parts

USA . 924 parts In-Stock

1+ parts

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924

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F5132IDA Microcontroller. Designed with cutting-edge technology and unparalleled precision, this product is the epitome of quality and performance. Perfect for a wide range of applications, this microcontroller offers customers unmatched value, benefits, and advantages. Experience seamless connectivity, low power consumption, and high-speed processing to take your projects to the next level. Trust in Texas Instruments to deliver excellence with the MSP430F5132IDA Microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body ensures the microcontroller is protected during handling and operation.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in powering the microcontroller within a safe voltage range.

ADC Channels: YES

Integrated Analog to Digital Converters provide the ability to interface with various sensors and other analog peripherals.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing a RISC architecture for the peripheral IC type allows for efficient and streamlined processing of instructions.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller without the need for special equipment, making it versatile for a variety of applications.

Technical Specifications

Microcontrollers MSP430F5132IDA attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

3

No. of I/O Lines:

31

No. of Terminals:

38

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

25 rpm

Maximum Supply Current:

6.15 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(16), CRC, DMA(3), POR, PWM, TIMER(2), WDT

Analog To Digital Convertors:

9-Ch 10-Bit

Trade Compliance

MSP430F5132IDA Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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