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MSP430F5131IDAR

Texas Instruments

MSP430F5131IDAR by Texas Instruments

MSP430F5131IDAR by Texas Instruments is a 16-bit microcontroller with 38 terminals, operating at up to 25 MHz. It features ADC and DMA channels, suitable for industrial applications requiring low power consumption and connectivity via I2C, SPI, and UART interfaces.

Median Price

$2.478

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 16,699 parts In-Stock

1+ parts

$2.036

100+ parts

$1.784

1k+ parts

$1.008

10k+ parts

-

16,699

$2.036

$1.784

$1.008

-

Mouser Electronics

USA . 703 parts In-Stock

1+ parts

$2.920

100+ parts

$2.520

1k+ parts

$1.760

10k+ parts

$1.710

703

$2.920

$2.520

$1.760

$1.710

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,173 parts In-Stock

1+ parts

$1.934

100+ parts

-

1k+ parts

-

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2,173

$1.934

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Vyrian

USA . 8,477 parts In-Stock

1+ parts

-

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-

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-

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8,477

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,276 parts In-Stock

1+ parts

$1.730

100+ parts

-

1k+ parts

-

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8,276

$1.730

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Corphita

USA . 4,469 parts In-Stock

1+ parts

$1.832

100+ parts

-

1k+ parts

-

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4,469

$1.832

-

-

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Component Stockers USA

USA . 13,630 parts In-Stock

1+ parts

$2.630

100+ parts

$1.940

1k+ parts

$1.080

10k+ parts

-

13,630

$2.630

$1.940

$1.080

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Parana Technologies

USA . 982 parts In-Stock

1+ parts

$61.132

100+ parts

-

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-

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982

$61.132

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-

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DigiPath Technology Company

USA . 1,512 parts In-Stock

1+ parts

$67.314

100+ parts

$61.929

1k+ parts

-

10k+ parts

-

1,512

$67.314

$61.929

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IDEA Electronic Components Group

UK . 1,919 parts In-Stock

1+ parts

$68.688

100+ parts

$65.254

1k+ parts

$61.819

10k+ parts

-

1,919

$68.688

$65.254

$61.819

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ChromeModa Solutions

Germany . 1,715 parts In-Stock

1+ parts

$68.688

100+ parts

$56.324

1k+ parts

-

10k+ parts

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1,715

$68.688

$56.324

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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500

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Overview

Unlock the potential of your projects with the Texas Instruments MSP430F5131IDAR microcontroller. Manufactured by a trusted industry leader, this versatile device offers high-quality performance and endless possibilities for a wide range of applications. With its advanced features and reliable design, the MSP430F5131IDAR delivers exceptional value, efficiency, and innovation to customers looking to elevate their creations to new heights. Experience the benefits of cutting-edge technology and unleash your creativity with this top-of-the-line microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications without adding unnecessary weight to the overall design.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage which can be advantageous for power-hungry applications or when interfacing with other components that require higher voltage levels.

Bit Size: 16

A 16-bit microcontroller allows for higher precision in computation and data manipulation compared to lower bit sizes, making it suitable for more complex operations.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient use of resources and faster execution of instructions, making the microcontroller a good choice for high-performance applications.

Speed: 25 rpm

With a maximum clock frequency of 25 MHz, this microcontroller can process data and perform tasks quickly, making it suitable for applications that require fast response times.

Connectivity: I2C, SPI(2), UART

Multiple connectivity options such as I2C, SPI, and UART allow for flexible communication with other devices, enhancing the versatility of the microcontroller in various applications.

Technical Specifications

Microcontrollers MSP430F5131IDAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

3

No. of I/O Lines:

31

No. of Terminals:

38

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

25 rpm

Maximum Supply Current:

6.15 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(16), CRC, DMA(3), POR, PWM, TIMER(2), WDT

Trade Compliance

MSP430F5131IDAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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