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MSP430F47196IPZ

Texas Instruments

MSP430F47196IPZ by Texas Instruments

MSP430F47196IPZ by Texas Instruments is a 16-bit microcontroller with 122880 ROM words, 4 RAM words, and 6-Ch 12-Bit ADC channels. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities. Features include 7 timers, multiple serial I/Os, and connectivity options like I2C, SPI, and UART.

Median Price

$8.214

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 90 parts In-Stock

1+ parts

$6.650

100+ parts

$6.520

1k+ parts

$6.380

10k+ parts

-

90

$6.650

$6.520

$6.380

-

Texas Instruments

USA . 920 parts In-Stock

1+ parts

$9.778

100+ parts

$7.971

1k+ parts

$5.314

10k+ parts

-

920

$9.778

$7.971

$5.314

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,603 parts In-Stock

1+ parts

$9.289

100+ parts

-

1k+ parts

-

10k+ parts

-

2,603

$9.289

-

-

-

Vyrian

USA . 3,738 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,738

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,674 parts In-Stock

1+ parts

$8.800

100+ parts

-

1k+ parts

-

10k+ parts

-

4,674

$8.800

-

-

-

AZTECH Wire

Italy . 1,216 parts In-Stock

1+ parts

$19.110

100+ parts

-

1k+ parts

-

10k+ parts

-

1,216

$19.110

-

-

-

Microchip USA

USA . 2,132 parts In-Stock

1+ parts

$24.500

100+ parts

$24.150

1k+ parts

$23.970

10k+ parts

$23.800

2,132

$24.500

$24.150

$23.970

$23.800

Parana Technologies

USA . 2,004 parts In-Stock

1+ parts

$51.082

100+ parts

-

1k+ parts

-

10k+ parts

-

2,004

$51.082

-

-

-

ChromeModa Solutions

Germany . 4,633 parts In-Stock

1+ parts

$57.396

100+ parts

$47.065

1k+ parts

-

10k+ parts

-

4,633

$57.396

$47.065

-

-

IDEA Electronic Components Group

UK . 1,738 parts In-Stock

1+ parts

$57.396

100+ parts

$54.526

1k+ parts

$51.656

10k+ parts

-

1,738

$57.396

$54.526

$51.656

-

Component Stockers USA

USA . 1,331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,331

-

-

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DigiPath Technology Company

USA . 110 parts In-Stock

1+ parts

-

100+ parts

$51.748

1k+ parts

-

10k+ parts

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110

-

$51.748

-

-

Perfect Parts

USA . 101 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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101

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Overview

Unlock the potential of your electronic projects with the MSP430F47196IPZ by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers like the MSP430F47196IPZ, offering customers reliability and performance. Ideal for a wide range of applications, this microcontroller provides value through its low power consumption, high clock frequency, and numerous peripherals such as timers, ADC channels, and PWM channels. Experience seamless connectivity with I2C, SPI, UART, and more, while benefiting from the flexibility and efficiency of FLASH programmability. Upgrade your designs today with the MSP430F47196IPZ and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various environments and applications.

Surface Mount: YES

Surface mount technology allows for easy integration onto printed circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

With a higher maximum supply voltage, this microcontroller can handle a wider range of power inputs, increasing its versatility.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and efficient multitasking capabilities.

Package Shape: SQUARE

The square shape of the package enables easy placement and alignment on the PCB, contributing to a more compact and organized design.

Bit Size: 16

A 16-bit architecture offers higher computational power and precision, making the microcontroller suitable for complex tasks and calculations.

Power Supplies (V): 2/3.3

Supporting multiple power supply options allows for flexibility in power sources, ensuring compatibility with various configurations and systems.

No. of Terminals: 100

A higher number of terminals provide more connectivity options and I/O capabilities, enhancing the overall functionality of the microcontroller.

Minimum Supply Voltage: 3.3 V

The minimum supply voltage of 3.3 V ensures stable operation and power efficiency, making it suitable for low-power applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance allows the microcontroller to withstand harsh environmental conditions and operate reliably in various settings.

Technical Specifications

Microcontrollers MSP430F47196IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES 4.15MHZ AT MINI 1.8V

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

68

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

122880

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), LIN(2), SCI(4), SPI(4), UART(2)"

Peripherals:

"BOD, COMPARATOR(2), DMA(3), RTC, TIMER(7), WDT"

Analog To Digital Convertors:

6-Ch 12-Bit

Trade Compliance

MSP430F47196IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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