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MSP430F47183IPZR

Texas Instruments

MSP430F47183IPZR by Texas Instruments

MSP430F47183IPZR by Texas Instruments is a 16-bit microcontroller with 8KB RAM and 118784 ROM words. It operates at a max frequency of 16MHz, has 3 ADC channels, and features low power mode. Ideal for industrial applications requiring high-speed processing and multiple peripherals like timers, UARTs, and SPI connectivity.

Median Price

$6.854

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,950 parts In-Stock

1+ parts

$8.206

100+ parts

$6.690

1k+ parts

$4.460

10k+ parts

-

8,950

$8.206

$6.690

$4.460

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Arrow

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.503

10k+ parts

$5.369

1,000

-

-

$5.503

$5.369

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,649 parts In-Stock

1+ parts

$7.796

100+ parts

-

1k+ parts

-

10k+ parts

-

3,649

$7.796

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-

-

Vyrian

USA . 3,148 parts In-Stock

1+ parts

-

100+ parts

-

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3,148

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-

-

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HZD GmbH

Germany . 175 parts In-Stock

1+ parts

-

100+ parts

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175

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,690 parts In-Stock

1+ parts

$7.385

100+ parts

-

1k+ parts

-

10k+ parts

-

3,690

$7.385

-

-

-

AZTECH Wire

Italy . 420 parts In-Stock

1+ parts

$14.960

100+ parts

-

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10k+ parts

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420

$14.960

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-

-

Parana Technologies

USA . 637 parts In-Stock

1+ parts

$15.182

100+ parts

-

1k+ parts

$15.579

10k+ parts

-

637

$15.182

-

$15.579

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DigiPath Technology Company

USA . 1,386 parts In-Stock

1+ parts

$16.717

100+ parts

$15.379

1k+ parts

-

10k+ parts

-

1,386

$16.717

$15.379

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ChromeModa Solutions

Germany . 5,284 parts In-Stock

1+ parts

$17.058

100+ parts

$13.988

1k+ parts

-

10k+ parts

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5,284

$17.058

$13.988

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IDEA Electronic Components Group

UK . 897 parts In-Stock

1+ parts

$17.058

100+ parts

$16.205

1k+ parts

$15.352

10k+ parts

-

897

$17.058

$16.205

$15.352

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Overview

Unlock the power of cutting-edge technology with the MSP430F47183IPZR by Texas Instruments. As a trusted leader in microcontrollers, Texas Instruments delivers unparalleled quality and reliability. Ideal for a wide range of applications, this microcontroller offers exceptional value with its low power consumption and high performance. Whether you're working on robotics, IoT devices, or industrial automation, this product provides the competitive edge you need to succeed. Experience seamless connectivity, advanced peripherals, and efficient processing with the MSP430F47183IPZR - the ultimate choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for various applications.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of voltage inputs, increasing flexibility in usage.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making this microcontroller efficient.

Number of I/O Lines: 72

Having a high number of I/O lines allows for more connectivity and functionality in the product.

ROM Programmability: FLASH

Flash ROM allows for easy and quick reprogramming of the microcontroller, enhancing its versatility.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures high performance and efficiency in processing tasks, making this microcontroller suitable for various applications.

Analog To Digital Convertors: 3-Ch 12-Bit

Having multiple ADC channels with high resolution allows for accurate analog to digital conversions in the product.

Technical Specifications

Microcontrollers MSP430F47183IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES 4.15MHZ AT MINI 1.8V

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

72

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

118784

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), LIN(2), SCI(4), SPI(4), UART(2)"

Peripherals:

"BOD, COMPARATOR(2), DMA(3), RTC, TIMER(7), WDT"

Analog To Digital Convertors:

3-Ch 12-Bit

Trade Compliance

MSP430F47183IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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